Semiconductor device with an interconnection structure having interconnections with an interconnection density that decreases moving away from a cell semiconductor pattern

Patent metadata

Field	Value
Publication number	US-10115667-B2
Application number	US-201514957113-A
Country	US
Kind code	B2
Filing date	Dec 2, 2015
Priority date	Dec 3, 2014
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A semiconductor device includes a cell semiconductor pattern disposed on a semiconductor substrate. A semiconductor dummy pattern is disposed on the semiconductor substrate. The semiconductor dummy pattern is co-planar with the cell semiconductor pattern. A first circuit is disposed between the semiconductor substrate and the cell semiconductor pattern. A first interconnection structure is disposed between the semiconductor substrate and the cell semiconductor pattern. A first dummy structure is disposed between the semiconductor substrate and the cell semiconductor pattern. Part of the first dummy structure is co-planar with part of the first interconnection structure. A second dummy structure not overlapping the cell semiconductor pattern is disposed on the semiconductor substrate. Part of the second dummy structure is co-planar with part of the first interconnection structure. A conductive shielding pattern is disposed between the cell semiconductor pattern and the semiconductor substrate and above the first circuit and the first interconnection structure.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a cell semiconductor pattern disposed on a semiconductor substrate;
a first circuit disposed between the semiconductor substrate and the cell semiconductor pattern;
a cell array region disposed on the cell semiconductor pattern, the cell semiconductor pattern extending beyond the cell array region;
a first interconnection structure disposed between the semiconductor substrate and the cell semiconductor pattern and electrically connected to the first circuit, wherein the first interconnection structure includes a plurality of first interconnections, and the first interconnections have an interconnection density that decreases moving away from the cell semiconductor pattern;
a first dummy structure disposed between the semiconductor substrate and the cell semiconductor pattern, wherein the first dummy structure includes first dummy patterns co-planar with the first interconnections; and
second dummy patterns disposed on the semiconductor substrate, wherein the second dummy patterns are co-planar with the first interconnections,
wherein the second dummy patterns have a lower pattern density at an area closer to the cell semiconductor pattern than at an area farther away from the cell semiconductor pattern.

2. The semiconductor device of claim 1 , wherein the first dummy structure is electrically isolated.

3. The semiconductor device of claim 1 , wherein the first dummy pattern includes the same material as the first interconnections.

4. The semiconductor device of claim 1 , wherein the second dummy patterns do not overlap the cell semiconductor pattern.

5. The semiconductor device of claim 1 , wherein the second dummy patterns face end portions of the first interconnections.

6. The semiconductor device of claim 1 , wherein the second dummy patterns are spaced apart from the first interconnections.

7. The semiconductor device of claim 1 , wherein the cell semiconductor pattern extends beyond the cell array region in a first direction, and
wherein the plurality of first interconnections extend away from the cell semiconductor pattern in the first direction.

8. A semiconductor device, comprising:
a first cell semiconductor pattern and a second cell semiconductor pattern disposed on the semiconductor substrate;
first and second circuits disposed between the semiconductor substrate and the first cell semiconductor pattern;
third and fourth circuits disposed between the semiconductor substrate and the second cell semiconductor pattern;
a first cell array region disposed on the first cell semiconductor pattern, wherein the first cell semiconductor pattern has a high concentration impurity region and a low concentration impurity region;
a second cell array region disposed on the second cell semiconductor pattern;
a first interconnection structure electrically connected to the first circuit and a second interconnection structure electrically connected to the second circuit, wherein the first and second interconnection structures are disposed between the semiconductor substrate and the first cell semiconductor pattern;
a third interconnection structure electrically connected to the third circuit and a fourth interconnection structure electrically connected to the fourth circuit, wherein the third and fourth interconnection structures are disposed between the semiconductor substrate and the second cell semiconductor pattern; and
a dummy structure disposed between the first cell semiconductor pattern and the second cell semiconductor pattern.

9. The semiconductor device of claim 8 , wherein the dummy structure includes a semiconductor dummy pattern disposed on the semiconductor substrate between the first and second cell semiconductor patterns and having substantially the same thickness as the first and second cell semiconductor patterns, and
the semiconductor dummy pattern has a smaller size than the first semiconductor pattern.

10. The semiconductor device of claim 8 , wherein the first interconnection structure is disposed between the first cell semiconductor pattern and the semiconductor substrate, extends away from the first cell semiconductor pattern toward the second cell semiconductor pattern, and has a lower interconnection density at an area farther away from the first cell semiconductor pattern than at an area closer to the first cell semiconductor pattern.

11. The semiconductor device of claim 8 , wherein the first and third interconnection structures include the same material, have substantially the same thickness and are disposed in the same plane.

12. The semiconductor device of claim 8 , wherein a second dummy structure includes second interconnection dummy patterns disposed between the first and third interconnection structures, and
the second interconnection dummy patterns include substantially the same material and are disposed in the same plane as the interconnections of the first and third interconnection structures.

13. The semiconductor device of claim 12 , wherein the second interconnection dummy patterns are spaced apart from the first and third interconnection structures and have a lower pattern density at an area closer to the first and second cell semiconductor patterns than at an area farther away from the first and second cell semiconductor patterns.

14. The semiconductor device of claim 12 , further comprising
a first conductive shielding pattern disposed between the first cell semiconductor pattern and the semiconductor substrate, and above the first and second circuits and the first and second interconnection structures.

15. The semiconductor device of claim 12 , further comprising a second conductive shielding pattern disposed between the second cell semiconductor pattern and the semiconductor substrate, and above the third and fourth circuits and the third and fourth interconnection structures.

16. The semiconductor device of claim 8 , wherein the third interconnection structure is disposed between the second cell semiconductor pattern and the semiconductor substrate, extends away from the second cell semiconductor pattern toward the first cell semiconductor pattern, and has a lower interconnection density at an area farther away from the second cell semiconductor pattern than at an area closer to the second cell semiconductor pattern.

17. The semiconductor device of claim 8 , wherein the first and second cell semiconductor patterns have substantially the same size.

18. A semiconductor device, comprising:
a cell semiconductor pattern disposed on a substrate;
a transistor disposed between the substrate and the cell semiconductor pattern;
a first interconnection disposed between the transistor and the cell semiconductor pattern; and
a second interconnection disposed in the same plane as the first interconnection, the second interconnection not being overlapped by the cell semiconductor pattern,
wherein the first interconnection includes a plurality of interconnections extending away from the cell semiconductor pattern, the number of interconnections decreasing as they get farther from the cell semiconductor pattern,
wherein the second interconnection includes a plurality of interconnections extending toward the cell semiconductor pattern, the number of interconnections decreasing as they get closer to the cell semiconductor pattern, and
wherein the interconnections of the first interconnection and the interconnections of the second interconnection alternately overlap each other in a horizontal direction.

19. The semiconductor device

Assignees

• Samsung Electronics Co Ltd
• Amsung Electronics Co Ltd

Inventors

• Yun Jang-Gn
• Yun Jaesun
• Lim Joon-Sung

Classifications

• H10W74/147 Primary

  the encapsulations being multilayered · CPC title

• H10W20/40

  Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes · CPC title

• H10W20/43 Primary

  Layouts of interconnections · CPC title

• H01L27/0688

  Electricity · mapped topic

• H01L23/528 Primary

  Electricity · mapped topic