Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns

Patent metadata

Field	Value
Publication number	US-9741643-B2
Application number	US-201615004208-A
Country	US
Kind code	B2
Filing date	Jan 22, 2016
Priority date	Jan 22, 2016
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.

First claim

What is claimed is:

1. A leadframe strip for use in making leaded integrated circuit packages, the leadframe strip comprising:
a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of said die attach pad, respectively; and
a plurality of continuous lead structures connecting opposite ones of said first and second dam bars of horizontally adjacent leadframes of the plurality of integrally connected leadframes;
said plurality of integrally connected leadframes being arranged in a plurality of vertical leadframe columns wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent columns.

2. The leadframe strip of claim 1 wherein said die attach pads in every other one of said plurality of vertical leadframe columns are horizontally aligned.

3. The leadframe strip of claim 1 wherein said leadframe strip comprises:
first and second vertical ends with a horizontally extending rail located at each of said first and second vertical ends; and
said plurality of vertical leadframe columns extending between said horizontal rails uninterrupted by any structure other than one or more horizontally extending bones.

4. The leadframe strip of claim 3 , wherein each of said vertical leadframe columns is attached at opposite ends thereof to respective ones of said horizontally extending rails by dam bar extension structures aligned with said first and second dam bars on opposite sides of each of said vertical leadframe columns.

5. The leadframe strip of claim 1 wherein said leadframe strip comprises a first and a second horizontal end, a vertical end rail being located at each of said horizontal ends, said plurality of integrally connected leadframes extending horizontally between said vertical end rails, uninterrupted by any other structure.

6. The leadframe strip of claim 5 , wherein said leadframe strip is free of interior vertical rails positioned inwardly of said vertical end rails.

7. The leadframe strip of claim 1 , wherein said leadframe strip is free of vertical mold runners.

Assignees

• Texas Instruments Inc

Inventors

• Lee Lee Han Meng@Eugene
• Bin Abdul Aziz Anis Fauzi
• Fen Sueann Lim Wei

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W74/016

  using moulds · CPC title

• H10W74/014

  using batch processing · CPC title