Interposer manufacturing method

Patent metadata

Field	Value
Publication number	US-10115644-B2
Application number	US-201715841032-A
Country	US
Kind code	B2
Filing date	Dec 13, 2017
Priority date	Dec 14, 2016
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A plurality of interposers are made from a material substrate. The material substrate includes a glass substrate partitioned by a plurality of crossing division lines to define a plurality of separate regions. A multilayer member is provided on a first surface or a second surface opposite to the first surface of the glass substrate and has an insulating layer and a wiring layer. An exposed surface of the multilayer member is cut along each division line by using a first cutting blade to form a cut groove on the exposed surface of the multilayer member, the cut groove having a depth not reaching the glass substrate. The glass substrate is cut along each cut groove by using a second cutting blade having a thickness smaller than the width of each cut groove to thereby divide the glass substrate and manufacture the plural interposers.

First claim

What is claimed is:

1. An interposer manufacturing method for manufacturing a plurality of interposers from a material substrate including a glass substrate having a first surface and a second surface opposite to said first surface and a multilayer member provided on said first surface or said second surface of said glass substrate, said glass substrate being partitioned by a plurality of crossing division lines to define a plurality of separate regions, said multilayer member including an insulating layer and a wiring layer, said interposer manufacturing method comprising:
a cut groove forming step of cutting an exposed surface of said multilayer member along each division line by using a first cutting blade to thereby form a cut groove on said exposed surface of said multilayer member, said cut groove having a depth not reaching said glass substrate; and
a dividing step of cutting said glass substrate along each cut groove by using a second cutting blade having a thickness smaller than the width of each cut groove to thereby divide said glass substrate and manufacture said plurality of interposers.

2. The interposer manufacturing method according to claim 1 , wherein the grain size of abrasive grains contained in said second cutting blade is smaller than that of abrasive grains contained in said first cutting blade.

3. An interposer manufacturing method for manufacturing a plurality of interposers from a material substrate including a glass substrate having a first surface and a second surface opposite to said first surface and a multilayer member provided on said first surface or said second surface of said glass substrate, said glass substrate being partitioned by a plurality of crossing division lines to define a plurality of separate regions, said multilayer member including an insulating layer and a wiring layer, said interposer manufacturing method comprising:
a laser processed groove forming step of applying a laser beam having an absorption wavelength to said multilayer member, to an exposed surface of said multilayer member along each division line to thereby form a laser processed groove on said exposed surface of said multilayer member, said laser processed groove having a depth not reaching said glass substrate; and
a dividing step of cutting said glass substrate along each laser processed groove by using a cutting blade having a thickness smaller than the width of each laser processed groove to thereby divide said glass substrate and manufacture said plurality of interposers.

Assignees

• Disco Corp

Inventors

• Suzuki Katsuhiko

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/095

  of vias therein · CPC title