High/low temperature contactless radio frequency probes

Patent metadata

Field	Value
Publication number	US-10114040-B1
Application number	US-201414573216-A
Country	US
Kind code	B1
Filing date	Dec 17, 2014
Priority date	Dec 20, 2013
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A contactless radio frequency (RF) probe with inverted microstrip lines. The RF probe includes a microstrip associated with a device under test, and a broadside coupled inverted microstrip line configured to exchange RF signals to a network analyzer.

First claim

The invention claimed is:

1. An apparatus, comprising:
a microstrip or slot line associated with a device under test;
an inverted microstrip broadside coupled to the microstrip or slot line, and configured to exchange radio frequency signals within the apparatus; and
an air gap separating the microstrip or slot line and the inverted microstrip so that there are no structural connections between the microstrip or slot line and the inverted microstrip, wherein the inverted microstrip is independently movable with respect to the microstrip or slot line, wherein the inverted microstrip is coupled to a second substrate, wherein the second substrate comprises a flexible joint configured to allow a portion of the second substrate and a portion of the inverted microstrip to remain uniform or flare, wherein the flexible joint is configured to increase or decrease the air gap, increasing or decreasing the coupling between the microstrip or slot line and the inverted microstrip.

2. The apparatus of claim 1 , wherein the microstrip or slot line and the inverted microstrip form a contactless radio frequency probe via the air gap.

3. The apparatus of claim 1 , wherein the microstrip or slot line is coupled to a first substrate.

4. The apparatus of claim 3 , wherein the first substrate comprises a slot line substrate, a coplanar waveguide substrate, or a non-planar or conformal substrate.

5. The apparatus of claim 1 , wherein the inverted microstrip comprises a match load or an impedance.

6. The apparatus of claim 1 , wherein the inverted microstrip comprises a protective coating configured to reflect heat from the microstrip, a plurality of ventilation holes configured to prevent the inverted microstrip line from overheating, or both.

Assignees

• Nasa
• The Us Administrator Of National Aeronautics And Space Administration

Inventors

• Jordan Jennifer L
• Simons Rainee N

Classifications

• H01Q13/106

  Microstrip slot antennas (patch antenna elements H01Q9/0407) · CPC title

• G01R1/06772

  High frequency probes · CPC title

• G01R1/07 Primary

  Non contact-making probes · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• G01R31/00

  Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere ({measuring superconductive properties G01R33/1238;} testing line transmission systems H04B3/46; testing or measuring semiconductors or solid state devices during manufacture {H10P74/00}) · CPC title