Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article

Patent metadata

Field	Value
Publication number	US-10113028-B2
Application number	US-201515321528-A
Country	US
Kind code	B2
Filing date	Jan 27, 2015
Priority date	Jun 30, 2014
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

An epoxy resin exhibits a small change in volume after thermal history, is excellent in low thermal expansion and low moisture absorption, and has high heat resistance, in terms of a cured product obtained therefrom; a curable resin composition; a cured product which has all the above properties; a semiconductor encapsulating material; a semiconductor device; a prepreg; a circuit board; a buildup film; a buildup substrate; a fiber-reinforced composite material; and a molded article. The present invention is characterized by an epoxy resin, characterized by including as essential components, a cresol-naphthol co-condensed novolac type epoxy resin (A), a naphthol glycidyl ether compound (B), and one or more xanthene compounds (C) selected from the group of compounds represented by the following structural formulae (1) to (3), wherein the content of the xanthene compound(s) (C) is from 0.1% to 5.5% in terms of area ratio in a GPC measurement.

First claim

The invention claimed is:

1. An epoxy resin, comprising as essential components, a cresol-naphthol co-condensed novolac epoxy resin (A), a naphthol glycidyl ether compound (B), and one or more xanthene compounds (C) selected from the group of compounds represented by the following structural formulae (1) to (3), wherein the content of the xanthene compound(s) (C) is from 0.1% to 5.5% in terms of area ratio in a GPC measurement:

wherein in the structural formulae (1) to (3), R′ each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, m each independently represents an integer of 1 to 6,
wherein the content of the glycidyl ether compound (B) is from 0.1% to 4.0% in terms of area ratio in a GPC measurement.

2. A curable resin composition comprising the epoxy resin as set forth in claim 1 and a curing agent as essential components.

3. A cured product, which is obtained by curing the curable resin composition as set forth in claim 2 .

4. A semiconductor device using the curable resin composition as set forth in claim 2 .

5. A prepreg using the curable resin composition as set forth in claim 2 .

6. A fiber-reinforced composite material, which comprises the curable resin composition as set forth in claim 2 and a reinforcing fiber.

7. A fiber-reinforced molded article, which is obtained by curing the fiber-reinforced composite material as set forth in claim 6 .

8. An epoxy resin, comprising as essential components, a cresol-naphthol co-condensed novolac epoxy resin (A), a naphthol glycidyl ether compound (B), and one or more xanthene compounds (C) selected from the group of compounds represented by the following structural formulae (1) to (3), wherein the content of the xanthene compound(s) (C) is from 0.1% to 5.5% in terms of area ratio in a GPC measurement:

wherein in the structural formulae (1) to (3), R 1 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, m each independently represents an integer of 1 to 6,
wherein the total content of the glycidyl ether compound (B) and the xanthene compound(s) (C) is from 1.0% to 8.0% in terms of area ratio in a GPC measurement.

9. A curable resin composition comprising the epoxy resin as set forth in claim 8 and a curing agent as essential components.

10. A cured product, which is obtained by curing the curable resin composition as set forth in claim 9 .

11. A semiconductor device using the curable resin composition as set forth in claim 9 .

12. A prepreg using the curable resin composition as set forth in claim 9 .

13. A fiber-reinforced composite material, which comprises the curable resin composition as set forth in claim 9 and a reinforcing fiber.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Hirota Yousuke
• Nakamura Takamitsu
• Satou Yutaka

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/016

  using moulds · CPC title

• C08K5/1545

  Six-membered rings · CPC title

• H01L23/293

  Electricity · mapped topic

• H05K1/0326

  containing O · CPC title