Manufacturing method of vapor chamber

US10112272B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10112272-B2
Application numberUS-201615052880-A
CountryUS
Kind codeB2
Filing dateFeb 25, 2016
Priority dateFeb 25, 2016
Publication dateOct 30, 2018
Grant dateOct 30, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A manufacturing method of vapor chamber includes steps of: providing a first board body and a second board body; using mechanical processing to form a hooked section structure on one face of the first board body; using mechanical processing to form a hook section structure on one face of the second board body; and correspondingly mating the first and second board bodies with each other to make the hook section and the hooked section contact and hook and connect with each other and sealing the periphery of the first and second board bodies and vacuuming the first and second board bodies and filling therein a working fluid. According to the manufacturing method, the vapor chamber is manufactured without any additional support structure, but is still free from the problem of thermal expansion. Also, the vapor chamber can be thinned and lightweight.

First claim

Opening claim text (preview).

What is claimed is: 1. A manufacturing method of vapor chamber, comprising steps of: providing a first board body and a second board body; using mechanical processing to form a hooked section structure on one face of the first board body, the hooked section structure being defined as a capillary structure layer; using mechanical processing to form a hook section structure as a support structure on one face of the second board body; and correspondingly mating the first and second board bodies with each other to form a chamber, and make the hook section and the hooked section contact and hook and connect with each other and sealing the periphery of the first and second board bodies and vacuuming the first and second board bodies and filling therein a working fluid, so as to form a vapor chamber with a vacuum chamber and sealed periphery, such that the hook section contacts, hooks and connects with the hooked section to provide a drag effect for the first and second board bodies to avoid a thermal expansion problem taking place when the vapor chamber is heated. 2. The manufacturing method of vapor chamber as claimed in claim 1 , wherein the mechanical processing is selected from a group consisting of planing/milling processing, embossing processing, shoveling/filing processing and laser processing. 3. The manufacturing method of vapor chamber as claimed in claim 1 , wherein the hooked section is composed of multiple loop bodies. 4. A manufacturing method of vapor chamber, comprising steps of: providing a first hoard body and a second hoard body; pre-making a hooked section structure and a hook section structure, the hooked section structure being defined as a capillary structure layer, the hook section structure defined as a support structure; respectively attaching the hooked section structure and the hook section structure to one face of the first board body and one face of the second hoard body and overlaying the hooked section structure and the hook section structure on the first board body and the second board body; and correspondingly mating the first and second board bodies with each other to form a chamber, and make the hook section and the hooked section contact and hook and connect with each other and sealing the periphery of the first and second board bodies and vacuuming the first and second board bodies and filling therein a working fluid, so as to form a vapor chamber with a vacuum chamber and sealed periphery, such that the hook section contacts, hooks and connects with the hooked section to provide a drag effect for the first and second board bodies to avoid a thermal expansion problem taking place when the vapor chamber is heated. 5. The manufacturing method of vapor chamber as claimed in claim 4 , wherein the attachment manner is selected from a group consisting of welding, diffusion bonding, adhesion, ultrasonic bonding, gluing and lamination. 6. The manufacturing method of vapor chamber as claimed in claim 4 , wherein the hooked section structure is composed of multiple loop bodies.

Assignees

Inventors

Classifications

  • Heat pipes · CPC title

  • B23P15/26Primary

    heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)} · CPC title

  • characterised by the material or the construction of the capillary structure · CPC title

  • by using permeable mass, perforated or porous materials (F28F13/18 takes precedence) · CPC title

  • Cooling means · CPC title

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What does patent US10112272B2 cover?
A manufacturing method of vapor chamber includes steps of: providing a first board body and a second board body; using mechanical processing to form a hooked section structure on one face of the first board body; using mechanical processing to form a hook section structure on one face of the second board body; and correspondingly mating the first and second board bodies with each other to make …
Who is the assignee on this patent?
Asia Vital Components Co Ltd
What technology area does this patent fall under?
Primary CPC classification B23P15/26. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 30 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).