Substrate processing apparatus and substrate processing method

Patent metadata

Field	Value
Publication number	US-10112205-B2
Application number	US-201615223730-A
Country	US
Kind code	B2
Filing date	Jul 29, 2016
Priority date	Aug 18, 2015
Publication date	Oct 30, 2018
Grant date	Oct 30, 2018

Abstract

A substrate is transported to a coating processing unit. An annular region of one surface of the substrate is processed. The substrate is carried into an edge exposure unit. Positions of a peripheral edge of the substrate and an inner edge of the annular region are detected. A position deviation amount of a center of the substrate held by a spin chuck from a rotation center of the spin chuck is calculated. Based on schedule management information, a relationship between orientations of the substrate held by the spin chuck at the time of carrying of the substrate into the coating processing unit and the substrate held by the substrate rotation unit at the time of carrying of the substrate into the edge exposure unit is specified. Based on the relationship, a position deviation direction of the center of the substrate from the rotation center is determined.

First claim

I claim:

1. A substrate processing apparatus comprising:
a transport robot that holds and transports a substrate having an at least partially circular outer periphery;
a substrate processor that performs processing on the substrate using a processing liquid;
a detector that detects a state of the substrate; and
a controller that controls operations of the transport robot, the substrate processor and the detector, based on pieces of schedule management information including a transport path of the substrate by the transport robot and contents of processing for the substrate, wherein
the transport robot transports the substrate along the transport path, carries in the substrate to the substrate processor, carries out the substrate after processing from the substrate processor, and carries in the substrate after processing by the substrate processor to the detector,
the substrate processor includes
a rotation holder that holds and rotates the substrate carried in by the transport robot, and
a processing liquid supplier that performs processing on an annular region of one surface by supplying the processing liquid to a peripheral portion of the one surface of the substrate rotated by the rotation holder,
the detector includes
a substrate holder that holds the substrate carried in by the transport robot, and
a position detector that detects a position of a peripheral edge of the substrate held by the substrate holder and a position of an inner edge of the annular region of the substrate held by the substrate holder,
the controller includes
a position deviation amount calculator that calculates a position deviation amount of a center of the substrate held by the rotation holder from a rotation center of the rotation holder, based on the position of the peripheral edge of the substrate detected by the position detector and the position of the inner edge of the annular region of the substrate detected by the position detector,
a position deviation direction determiner that specifies a relationship between an orientation of the substrate held by the rotation holder at a time of carrying of the substrate into the substrate processor by the transport robot and an orientation of the substrate held by the substrate holder at a time of carrying of the substrate into the detector by the transport robot, based on the pieces of schedule management information, and determines a position deviation direction of the center of the substrate held by the rotation holder from the rotation center of the rotation holder, based on the specified relationship, and
an adjustor that adjusts a carry-in operation of the substrate to the substrate processor by the transport robot such that a center of the substrate carried into the substrate processor after calculation of the position deviation amount and determination of the position deviation direction coincides with the rotation center of the rotation holder, based on the calculated position deviation amount and the determined position deviation direction.

2. The substrate processing apparatus according to claim 1 , wherein
the substrate holder is configured to hold and rotate the substrate in a horizontal attitude,
the controller further includes a rotation controller that controls the substrate holder such that the substrate held by the substrate holder makes at least a full revolution, and
the position detector detects the position of the peripheral edge of the substrate rotated by the substrate holder and the position of the inner edge of the annular region of the substrate rotated by the substrate holder.

3. The substrate processing apparatus according to claim 2 , wherein
a position determiner for specifying an orientation of the substrate is formed at the substrate,
the position detector detects a position of the position determiner of the substrate, and
the rotation controller controls a rotation angle of the substrate holder based on a change of the position of the position determiner of the substrate detected by the position detector.

4. The substrate processing apparatus according to claim 2 ,
the position detector includes an image data detector that detects pieces of image data indicating the position of the peripheral edge of the substrate rotated by the substrate holder and the position of the inner edge of the annular region of the substrate rotated by the substrate holder, and
the position deviation amount calculator detects a change of the position of the peripheral edge of the substrate in a radial direction of the substrate and a change of the position of the inner edge of the annular region of the substrate in the radial direction of the substrate, based on the pieces of image data detected by the image data detector, and calculates the position deviation amount of the center of the substrate, based on the detected change of the position of the peripheral edge of the substrate and the detected change of the position of the inner edge of the annular region of the substrate.

5. The substrate processing apparatus according to claim 4 , wherein
the position deviation amount calculator calculates a width of the annular region in the radial direction of the substrate, based on the change of the position of the peripheral edge of the substrate in the radial direction of the substrate and the change of the position of the inner edge of the annular region of the substrate in the radial direction of the substrate, and calculates the position deviation amount of the center of the substrate, based on the calculated width.

6. The substrate processing apparatus according to claim 1 , wherein
the substrate processor further includes a coating liquid supplier that supplies a coating liquid for forming a coating film on the substrate rotated by the rotation holder,
the processing liquid supplier supplies a removal liquid that removes the coating liquid on the substrate supplied by the coating liquid supplier to the peripheral portion of the one surface of the substrate as the processing liquid, and
the annular region is an annular region from which the coating liquid on the substrate is removed.

7. The substrate processing apparatus according to claim 6 , wherein
the coating liquid supplier supplies a coating liquid for forming a photosensitive coating film,
the substrate processing apparatus further includes a peripheral exposer that exposes the coating film at the peripheral portion of the one surface of the substrate, the coating film being formed by the coating liquid supplier, and
the detector is provided at the peripheral exposer.

8. The substrate processing apparatus according to claim 1 , wherein
the processing liquid supplier supplies a coating liquid for forming a coating film on the substrate to the peripheral portion of the one surface of the substrate as the processing liquid, and
the annular region is an annular region on which the coating film is formed on the substrate.

Assignees

• Screen Holdings Co Ltd

Inventors

• Inagaki Yukihiko

Classifications

• H10P72/0458

  vertical arrangement · CPC title

• H10P72/0448 Primary

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/53

  using optical controlling means · CPC title

• H01L21/681

  Electricity · mapped topic