Composition for forming silica layer, method for manufacturing silica layer and silica layer

Patent metadata

Field	Value
Publication number	US-10106687-B2
Application number	US-201615061670-A
Country	US
Kind code	B2
Filing date	Mar 4, 2016
Priority date	Jul 31, 2015
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

A composition for forming a silica layer includes a silicon-containing polymer and a mixed solvent including at least two solvents, wherein the mixed solvent has a surface tension of about 5 mN/m to about 35 mN/m at a temperature of about 25° C.

First claim

What is claimed is:

1. A composition for forming a silica layer comprising:
a silicon-containing polymer; and
a mixed solvent consisting of at least two selected from benzene, toluene, ethylbenzene, diethylbenzene, trimethylbenzene, triethylbenzene, cyclohexane, cyclohexene, dipentene, pentane, hexane, heptane, octane, nonane, decane, ethyl cyclohexane, methyl cyclohexane, cyclohexane, cyclohexene, p-menthane, dipropylether, dibutylether, butyl acetate, amyl acetate, methylisobutylketone, paramethylanisole, and tetramethyl benzene,
wherein the mixed solvent has a surface tension of about 29.51 mN/m to about 35 mN/m at a temperature of about 25° C.

2. The composition for forming a silica layer of claim 1 , wherein the silicon-containing polymer comprises polysilazane, polysiloxazane, or a combination thereof.

3. The composition for forming a silica layer of claim 1 , wherein the silicon-containing polymer has a weight average molecular weight of about 1,000 g/mol to about 160,000 g/mol.

4. The composition for forming a silica layer of claim 1 , wherein the silicon-containing polymer is included in an amount of about 0.1 wt % to about 30 wt % based on the total amount of the composition for forming a silica layer.

5. A method of manufacturing a silica layer, the method comprising
coating a composition for forming a silica layer on a substrate, the composition comprising:
a silicon-containing polymer; and
a mixed solvent consisting of at least two selected from benzene, toluene, xylene, ethylbenzene, diethylbenzene, trimethylbenzene, triethylbenzene, cyclohexane, cyclohexene, dipentene, pentane, hexane, heptane, octane, nonane, decane, ethyl cyclohexane, methyl cyclohexane, cyclohexane, cyclohexene, p-menthane, dipropylether, dibutylether, anisole, butyl acetate, amyl acetate, methylisobutylketone, paramethylanisole, and tetramethyl benzene,
wherein the mixed solvent has a surface tension of about 29.51 mN/m to about 35 mN/m at a temperature of about 25° C.;
drying the substrate coated with the composition to produce a resultant; and
curing the resultant at a temperature of about 150° C. or greater under an atmosphere including an inert gas to manufacture a silica layer.

6. The method of claim 5 , wherein the composition for forming a silica layer is coated utilizing a spin-on coating method.

7. The method of claim 5 , wherein the silicon-containing polymer comprises polysilazane, polysiloxazane, or a combination thereof.

8. The method of claim 5 , wherein the silicon-containing polymer has a weight average molecular weight of about 1,000 g/mol to about 160,000 g/mol.

9. The method of claim 5 , wherein the silicon-containing polymer is included in an amount of about 0.1 wt % to about 30 wt % based on the total amount of the composition for forming a silica layer.

10. A silica layer provided according to the method of claim 5 .

11. An electronic device comprising the silica layer of claim 10 .

12. An electronic device comprising a silica layer, the silica layer being a derivative of the composition of claim 1 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Jang Junyoung
• Yun Huichan
• Kim Woo Han
• Noh Kunbae
• Lee Eunseon
• Kwak Taeksoo
• Kim Jingyo
• Kim Haneul
• Na Yoong Hee
• Bae Jin-Hee
• Seo Jinwoo
• Hwang Byeonggyu

Classifications

• G02F1/133

  Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements (arrangements or circuits for control of liquid crystal elements in a matrix, not structurally associated with these elements G09G3/36) · CPC title

• C09D183/16

  in which all the silicon atoms are connected by linkages other than oxygen atoms · CPC title

• C09D183/08

  containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen · CPC title

• C09D7/20

  Diluents or solvents · CPC title

• C09D1/00 Primary

  Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances · CPC title