Stitched electromagnetic wave absorbing composite material for low-speed impact protection
US-2024367391-A1 · Nov 7, 2024 · US
Board, semiconductor fabrication plant (FAB) and fabrication facility
US10104816B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10104816-B2 |
| Application number | US-201615017559-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 5, 2016 |
| Priority date | Feb 5, 2016 |
| Publication date | Oct 16, 2018 |
| Grant date | Oct 16, 2018 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A board includes a first magnetic conductive plate and a second magnetic conductive plate. The first magnetic conductive plate has a first magnetic conductive direction. The second magnetic conductive plate overlaps with the first magnetic conductive plate. The second magnetic conductive plate has a second magnetic conductive direction. The first magnetic conductive direction and the second magnetic conductive direction cross.
First claim
Opening claim text (preview).
What is claimed is: 1. A board, comprising: a first magnetic conductive plate having a first magnetic conductive direction; and a second magnetic conductive plate overlapping with the first magnetic conductive plate, the second magnetic conductive plate having a second magnetic conductive direction, wherein the first magnetic conductive direction and the second magnetic conductive direction cross. 2. The board of claim 1 , wherein the first magnetic conductive plate is made of silicon steel. 3. The board of claim 1 , wherein the first magnetic conductive plate has grain orientation different from that of the second magnetic conductive plate. 4. The board of claim 1 , further comprising: a magnetic shielding structure overlapping with the first magnetic conductive plate. 5. The board of claim 4 , wherein the magnetic shielding structure is a magnetic shielding plate. 6. The board of claim 4 , wherein the magnetic shielding structure is a porous magnetic shielding structure. 7. The board of claim 4 , wherein the magnetic shielding structure is made of metal. 8. The board of claim 4 , wherein the first magnetic conductive plate is present between the magnetic shielding structure and the second magnetic conductive plate. 9. The board of claim 4 , wherein the magnetic shielding structure is present between the first magnetic conductive plate and the second magnetic conductive plate.
Assignees
Inventors
Classifications
from electric or magnetic fields, e.g. radio waves · CPC title
- H05K9/00Primary
Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q17/00) · CPC title
Diaphragms; Shields associated with electron or ion-optical arrangements; Compensation of disturbing fields · CPC title
Details · CPC title
Screening (insulation or other protection of buildings E04B; emergency protection of apparatus in general F16P7/00; in connection with acoustic waves G10K11/00; in connection with nuclear radiation G21F) · CPC title
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Frequently asked questions
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- What does patent US10104816B2 cover?
- A board includes a first magnetic conductive plate and a second magnetic conductive plate. The first magnetic conductive plate has a first magnetic conductive direction. The second magnetic conductive plate overlaps with the first magnetic conductive plate. The second magnetic conductive plate has a second magnetic conductive direction. The first magnetic conductive direction and the second mag…
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K9/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 16 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).