Printed wiring board and method of producing the same

Patent metadata

Field	Value
Publication number	US-10104765-B2
Application number	US-201615010733-A
Country	US
Kind code	B2
Filing date	Jan 29, 2016
Priority date	Jan 30, 2015
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. EBG unit cells are disposed on a boundary between the digital circuit and the analog circuit one dimensionally or two dimensionally and periodically, and an interdigital electrode is formed. A magnetic body film is formed over the printed wiring board, partially formed on the EBG unit cells, or formed avoiding the EBG unit cells.

First claim

What is claimed is:

1. A printed wiring board comprising:
a digital circuit;
an analog circuit;
a power supply path disposed on an insulating layer between the digital circuit and the analog circuit; and
a plurality of electromagnetic band gap unit cells, that are arranged periodically adjacent to each other in a boundary between the digital circuit and the analog circuit, and each of the plurality of electromagnetic band gap unit cells includes:
a bridge portion that forms part of the power supply path to supply DC current, wherein the bridge portion of electromagnetic band gap unit cells that are adjacent are electrically interconnected, and
a plurality of thin wire electrodes that extend along an insulating layer surface from the bridge portion, wherein interdigital electrodes that are formed by entering mutually the plurality of thin wire electrodes in a noncontact manner with the thin wire electrodes of the electromagnetic band gap unit cells that are adjacent.

2. The printed wiring board according to claim 1 , wherein each of the electromagnetic band gap unit cells does not have a via for connecting to another layer.

3. The printed wiring board according to claim 1 , wherein a shape of each of the electromagnetic band gap unit cells is one selected from a quadrate shape, a rectangular shape, a triangular shape, and a regular hexagon shape.

4. The printed wiring board according to claim 1 , wherein a magnetic body film is formed over the printed wiring board, partially formed on the electromagnetic band gap unit cells, or formed avoiding the electromagnetic band gap unit cells.

5. The printed wiring board according to claim 4 , wherein the magnetic body film is a thin ferrite plating film.

6. The printed wiring board according to claim 4 , wherein the magnetic body film has a thickness of 0.2 μm to 20 μm.

7. The printed wiring board according to claim 1 , wherein the electromagnetic band gap unit cells are disposed around the digital circuit periodically.

8. The printed wiring board according to claim 1 , wherein the electromagnetic band gap unit cells are disposed around the analog circuit periodically.

9. A method of producing a printed wiring board comprising:
disposing a power supply path on an insulating layer between a digital circuit and an analog circuit;
disposing a plurality of electromagnetic band gap unit cells, wherein the plurality of electromagnetic band gap unit cells are arranged periodically adjacent to each other in a boundary between the digital circuit and the analog circuit, and each of the plurality of electromagnetic band gap unit cells includes:
a bridge portion that forms part of the power supply path to supply DC current, wherein the bridge portion of electromagnetic band gap unit cells that are adjacent are electrically interconnected, and
a plurality of thin wire electrodes that extend along an insulating layer surface from the bridge portion, wherein the plurality of thin wire electrodes enter mutually in a noncontact manner with the thin wire electrodes of the electromagnetic band gap unit cells that are adjacent to form interdigital electrodes; and

forming a magnetic body film on the electromagnetic band gap unit cells.

Assignees

• Nat Univ Corporation Okayama Univ
• Kyocera Circuit Solutions Inc
• Kyocera Corp

Inventors

• Toyota Yoshitaka
• Iokibe Kengo
• Yamashita Yuki
• Naito Masanori
• Kaneko Toshiyuki
• Kaiya Kiyohiko
• Uehara Toshihisa
• Kondo Koichi

Classifications

• H05K3/00

  Apparatus or processes for manufacturing printed circuits · CPC title

• H05K2201/086

  for inductive purposes, e.g. printed inductor with ferrite core · CPC title

• H05K2201/09972

  Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently · CPC title

• H05K1/0236 Primary

  Electromagnetic band-gap structures · CPC title

• H05K2201/0715

  provided by an outer layer of PCB · CPC title