Encapsulation film and organic electronic device comprising the same

Patent metadata

Field	Value
Publication number	US-10103353-B2
Application number	US-201515129349-A
Country	US
Kind code	B2
Filing date	Mar 27, 2015
Priority date	Mar 27, 2014
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

The present application relates to an encapsulation film and an organic electronic device including the encapsulation film, and provides an encapsulation film and an organic electronic device which effectively prevents the penetration of moisture or oxygen from the outside into the organic electronic device and also achieves the light diffusion and extraction effects.

First claim

What is claimed is:

1. An organic electronic device comprising:
a substrate;
an organic electronic element formed on one surface of the substrate; and
an encapsulation film formed on the opposite surface of the substrate,
wherein the encapsulation film comprises: an encapsulating layer which comprises an encapsulation resin, a hygroscopic filler at 1 to 40 parts by weight, and a non-hygroscopic filler at 1 to 10 parts by weight, and has a water vapor transmission rate of 50 g/m 2 ·day or less in a thickness direction when the encapsulating layer is cured,
wherein the water vapor transmission rate is measured under conditions of 38° C. and a relative humidity of 100%, and is measured according to ASTM F1249,
wherein a light transmittance of the encapsulation film is 80% or more with respect to a visible light region, and a haze of the encapsulation film is 50% or more, and
wherein the encapsulation film is applied to the opposite surface through which light is transmitted by the organic electronic device.

2. The organic electronic device of claim 1 , wherein the encapsulating layer comprises a first layer having the hygroscopic filler and a second layer having the non-hygroscopic filler.

3. The organic electronic device of claim 1 , wherein an average particle diameter of the hygroscopic filler is in a range of 10 nm to 5 μm.

4. The organic electronic device of claim 1 , wherein the hygroscopic filler is one or more selected from the group consisting of a metal oxide, a metal salt, and phosphorus pentoxide.

5. The organic electronic device of claim 4 , wherein the hygroscopic filler is one or more selected from the group consisting of CaO, MgO, CaCl 2 , CaCO 3 , CaZrO 3 , CaTiO 3 , SiO 2 , Ca 2 SiO 4 , MgCl 2 , P 2 O 5 , Li 2 O, Na 2 O, BaO, Li 2 SO 4 , Na 2 SO 4 , CaSO 4 , MgSO 4 , CoSO 4 , Ga 2 (SO 4 ) 3 , Ti(SO 4 ) 2 , NiSO 4 , SrCl 2 , YCl 3 , CuCl 2 , CSF, TaF 5 , NbF 5 , LiBr, CaBr 2 , CeBr 3 , SeBr 4 , VBr 3 , MgBr 2 , BaI 2 , MgI 2 , Ba(ClO 4 ) 2 and Mg(ClO 4 ) 2 .

6. The organic electronic device of claim 1 , wherein an average particle diameter of the non-hygroscopic filler is in a range of 500 nm to 10 μm.

7. The organic electronic device of claim 1 , wherein a refractive index difference between the encapsulation resin and the non-hygroscopic filler is in a range of 0.1 to 1.0.

8. The organic electronic device of claim 1 , wherein the non-hygroscopic filler comprises titanium dioxide (TiO 2 ), alumina (Al 2 O 3 ), silicon nitride (Si 3 N 4 ), aluminum nitride (AlN), gallium nitride (GaN), zinc sulfide (ZnS), cadmium sulfide (CdS), silica, talc, zeolite, titania, zirconia, montmorillonite, or clay.

9. The organic electronic device of claim 1 , wherein the encapsulation resin is an acrylic resin, an epoxy resin, a silicone resin, a fluorine resin, a styrene resin, a polyolefin resin, a thermoplastic elastomer, a polyoxyalkylene resin, a polyester resin, a polyvinyl chloride resin, a polycarbonate resin, a polyphenylene sulfide resin, a polyamide resin, or a mixture thereof.

10. The organic electronic device of claim 1 , wherein the encapsulating layer further comprises a dispersant.

11. The organic electronic device of claim 10 , wherein the dispersant is one or more selected from the group consisting of stearic acid, palmitic acid, oleic acid, linoleic acid, cetyl alcohol, stearyl alcohol, cetostearyl alcohol, oleyl alcohol, octyl glucoside, decyl glucoside and lauryl glucoside.

12. The organic electronic device of claim 10 , wherein the dispersant is included at 0.1 to 5 parts by weight with respect to 100 parts by weight of the hygroscopic filler and the non-hygroscopic filler.

13. The organic electronic device of claim 1 , wherein the organic electronic element is an organic light emitting diode.

14. The organic electronic device of claim 1 , further comprising a moisture barrier layer formed on the organic electronic element.

15. A method of manufacturing the organic electronic device of claim 1 , comprising:
forming the organic electronic element on one surface of the substrate; and
forming the encapsulation film on the other surface of the substrate.

Assignees

• Lg Chemical Ltd

Inventors

• Cho Yoon Gyung
• Yoo Hyun Jee
• Bae Kyung Yul
• Chang Suk Ky
• Lee Jung Hyoung
• Choi Jun Rye

Classifications

• H10W76/48

  Fillings including materials for absorbing or reacting with moisture or other undesired substances · CPC title

• H01L51/5259

  Electricity · mapped topic

• H01L51/5268

  Electricity · mapped topic

• H01L51/56

  Electricity · mapped topic

• H01L23/26

  Electricity · mapped topic