Apparatus for transferring substrate and apparatus for processing substrate including the same

Patent metadata

Field	Value
Publication number	US-10103043-B2
Application number	US-201615260874-A
Country	US
Kind code	B2
Filing date	Sep 9, 2016
Priority date	Nov 2, 2015
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

The inventive concepts provide apparatuses for transferring a substrate and/or apparatuses for processing a substrate including the same. The substrate transferring apparatus including a chamber, a filter assembly disposed in a chamber to provide external air into the chamber, and an additional assembly including a moisture removing part and a purge gas providing part sequentially stacked on the filter assembly may be provided. The filter assembly may be coupled to the additional assembly.

First claim

What is claimed is:

1. A semiconductor manufacturing equipment, the equipment comprising:
a plurality of process chambers in which a substrate is etched or cleaned;
a first transfer chamber between the plurality of process chambers;
a load port configured to receive a carrier that is configured to store the substrate;
a second transfer chamber between the load port and the first transfer chamber, the second transfer chamber having a transfer robot;
a filter above the transfer robot in the second transfer chamber;
a heater on the filter in the second transfer chamber; and
a nitrogen gas nozzle on the heater, the nitrogen gas nozzle configured to inject a nitrogen gas into the heater such that the nitrogen gas heated by the heater is provided in the second transfer chamber and the carrier accommodated in the second transfer chamber, and removes an oxygen gas therein.

2. The equipment of claim 1 , further comprising:
a fan between the filter and the heater, the fan configured to blow the nitrogen gas into the filter to provide the nitrogen gas in second transfer chamber.

3. The equipment of claim 1 , wherein:
the heater having a plurality of heater holes; and
the nitrogen gas nozzle having a plurality of nozzle holes, the plurality of nozzle holes being on the plurality of heater holes, respectively.

4. The equipment of claim 1 , wherein the heater includes a plurality of square tubes.

5. The equipment of claim 1 , further comprising:
a door in the second transfer chamber, the door connecting the second transfer to the load port;
a sensor on a side wall of the second transfer chamber and between the door and the filter; and
wherein the heater in configured to heat the nitrogen gas based on a sensing signal of the sensor.

6. The equipment of claim 1 , further comprising:
an exhausting pipe connected to a bottom of the second transfer chamber and configured to exhaust the nitrogen gas from the second transfer chamber.

7. The equipment of claim 1 , further comprising:
a plurality of load lock chambers between the first and second transfer chambers,
wherein the first transfer chamber connects the plurality of load lock chambers to each other.

8. A semiconductor manufacturing equipment, the equipment comprising:
a plurality of process chambers in which a substrate is etched or cleaned;
a first transfer chamber between the plurality of process chambers;
a load port configured to receive a carrier that is configured to store the substrate;
a second transfer chamber between the load port and the first transfer chamber, the second transfer chamber having a transfer robot;
a filter above the transfer robot in the second transfer chamber;
a heater on the filter in the second transfer chamber;
a nitrogen gas nozzle on the heater, the nitrogen gas nozzle configured to inject a nitrogen gas into the heater; and
a fan between the filter and the heater, the fan configured to blow the nitrogen gas into the filter to provide the nitrogen gas in second transfer chamber.

9. The equipment of claim 8 , wherein:
the heater having a plurality of heater holes; and
the nitrogen gas nozzle having a plurality of nozzle holes, the plurality of nozzle holes being on the plurality of heater holes, respectively.

10. The equipment of claim 8 , wherein the heater includes a plurality of square tubes.

11. The equipment of claim 8 , wherein the filter includes High Efficiency Particulate Air (HEPA) filter or Ultra Low Penetration Absolute (ULPA) filter.

12. The equipment of claim 8 , further comprising:
a plurality of load lock chambers between the first and second transfer chambers,
wherein the first transfer chamber connects the plurality of load lock chambers to each other.

13. The equipment of claim 8 , further comprising:
a door in the second transfer chamber, the door connecting the second transfer to the load port;
a sensor on a side wall of the second transfer chamber and between the door and the filter; and
wherein the heater is configured to heat the nitrogen gas based on a sensing signal of the sensor.

14. The equipment of claim 8 , further comprising:
an exhausting pipe connected to a bottom of the second transfer chamber and configured to exhaust the nitrogen gas from the second transfer chamber.

15. A semiconductor manufacturing equipment, the equipment comprising:
a plurality of process chambers in which a substrate is etched or cleaned;
a first transfer chamber between the plurality of process chambers;
a load port configured to receive a carrier that is configured to store the substrate;
a second transfer chamber between the load port and the first transfer chamber, the second transfer chamber having a transfer robot;
a plurality of load lock chambers between the first transfer chamber and the second transfer chamber;
a filter above the transfer robot in the second transfer chamber;
a heater on the filter in the second transfer chamber; and
a nitrogen gas nozzle on the heater, the nitrogen gas nozzle configured to inject a nitrogen gas into the heater,
wherein the first transfer chamber connects the plurality of load lock chambers to each other.

16. The equipment of claim 15 , further comprising:
a fan between the filter and the heater, the fan configured to blow the nitrogen gas into the filter to provide the nitrogen gas into second transfer chamber,
wherein the nitrogen gas nozzle is connected to a plurality of gas lines on the fan.

17. The equipment of claim 15 , wherein:
the heater having a plurality of heater holes; and
the nitrogen gas nozzle having a plurality of nozzle holes, the plurality of nozzle holes being on the plurality of heater holes, respectively.

18. The equipment of claim 15 , wherein the heater includes a plurality of square tubes.

19. The equipment of claim 15 , further comprising:
an exhausting pipe connected to a bottom of the second transfer chamber, and configured to exhaust the nitrogen gas from the second transfer chamber.

20. The equipment of claim 15 , further comprising:
a door in the second transfer chamber, the door connecting the second transfer to the load port;
a sensor on a side wall of the second transfer chamber and between the door and the filter; and
wherein the heater is configured to heat the nitrogen gas based on a sensing signal of the sensor.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Choi Hyun Sun
• Jeon Yun-Kwang
• Kang Taekyun

Classifications

• H10P72/3411

  involving loading and unloading of wafers · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/1924

  characterised by atmosphere control · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title