Flexible microelectronic systems and methods of fabricating the same

Patent metadata

Field	Value
Publication number	US-10103037-B2
Application number	US-201414273754-A
Country	US
Kind code	B2
Filing date	May 9, 2014
Priority date	May 9, 2014
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

Microelectronic systems encapsulated in a stretchable/flexible material, which is skin/bio-compatible and able to withstand environmental conditions. In one embodiment of the present description, the microelectronic system includes a microelectronic device that is substantially encapsulated in a non-permeable encapsulant, such as, butyl rubbers, ethylene propylene rubbers, fluoropolymer elastomers, or combinations thereof. In another embodiment, the microelectronic system includes a microelectronic device that is substantially encapsulated in a permeable encapsulant, such as polydimethylsiloxane, wherein a non-permeable encapsulant substantially encapsulates the permeable encapsulant.

First claim

What is claimed is:

1. A microelectronic system comprising:
a microelectronic component structure encapsulated in a flexible first encapsulation structure, wherein the microelectronic component structure comprises at least one microelectronic device electrically connected with a trace network, wherein the microelectronic device includes an active surface and an opposing back surface, wherein the microelectronic device active surface is electrically connected with the trace network, wherein the microelectronic component further comprises an adhesive material contacting the microelectronic device back surface, and wherein the flexible first encapsulation structure consists of a single material that completely surrounds and encases the microelectronic component structure, contacts the microelectronic device active surface, and contacts all surfaces of the adhesive material not in contact with the microelectronic device back surface, and wherein a portion of the flexible first encapsulation material extends through the trace network.

2. The microelectronic system of claim 1 , wherein the flexible first encapsulation structure comprises a flexible non-permeable encapsulation material selected from the group comprising butyl rubber, ethylene propylene rubber, fluoropolymer elastomer, and combinations thereof.

3. The microelectronic system of claim 1 , wherein the flexible first encapsulation structure comprises a flexible permeable encapsulation structure and further including a flexible second encapsulation structure, wherein the flexible second encapsulation structure comprises a flexible non-permeable encapsulation structure that completely surrounds and encases the flexible first encapsulation structure and the microelectronic component structure.

4. The microelectronic system of claim 3 , wherein the flexible first encapsulation structure comprises polydimethylsiloxane.

5. The microelectronic system of claim 1 , wherein the microelectronic component structure comprises the at least one microelectronic device electrically connected to the trace network with at least one bond wire extending from the active surface of the microelectronic device to the trace network.

6. A microelectronic system comprising:
a flexible first encapsulation material layer comprising either a permeable or a non-permeable encapsulation material;
at least one microelectronic component structure abutting the flexible first encapsulation material layer, wherein the at least one microelectronic component structure comprises at least one microelectronic device electrically connected with a trace network formed on and extending above the flexible first encapsulation material layer, wherein the microelectronic device includes an active surface and an opposing back surface, wherein the microelectronic device active surface is electrically connected with the trace network, wherein the microelectronic component further comprises an adhesive material contacting the microelectronic device back surface, and wherein the flexible first encapsulation material contacts the adhesive material; and
a flexible second encapsulation material over the at least one microelectronic component structure and abutting the flexible first encapsulation material layer, wherein the flexible first encapsulation material layer and the flexible second encapsulation material form a flexible encapsulation structure completely surrounding and encasing the at least one microelectronic component structure, wherein at least one of the flexible first encapsulation material layer and the flexible second encapsulation material is a non-permeable material and wherein the flexible first encapsulation material is different from the flexible second encapsulation material, wherein the flexible second encapsulation contacts the microelectronic device active surface and contacts the adhesive material, and wherein a portion of the flexible second encapsulation material extends through the trace network.

7. The microelectronic system of claim 6 , wherein the flexible first encapsulation material layer and the flexible second encapsulation material are selected from the group comprising butyl rubber, ethylene propylene rubber, fluoropolymer elastomer, and polydimethylsiloxane.

8. The microelectronic system of claim 6 , wherein the microelectronic component structure comprises the at least one microelectronic device electrically connected to the trace network with at least one bond wire extending from the active surface of the microelectronic device to the trace network.

9. The microelectronic system of claim 1 , wherein the microelectronic component structure further comprises at least one secondary microelectronic device attached to the trace network.

10. The microelectronic system of claim 1 , wherein the trace network comprises a metal selected from the group consisting of copper, aluminum, gold, titanium, nickel, tungsten, silver, zirconium, cobalt, and alloys thereof.

11. The microelectronic system of claim 5 , wherein the flexible first encapsulation structure surrounds the at least one bond wire.

12. The microelectronic system of claim 5 , wherein the at least one bond wire is a metal selected from the group consisting of copper, aluminum, nickel, silver, gold, and alloys thereof.

13. The microelectronic system of claim 6 , wherein the microelectronic component structure further comprises at least one secondary microelectronic device attached to the trace network.

14. The microelectronic system of claim 6 , wherein the trace network comprises a metal selected from the group consisting of copper, aluminum, gold, titanium, nickel, tungsten, silver, zirconium, cobalt, and alloys thereof.

15. The microelectronic system of claim 8 , wherein the flexible second encapsulation material surrounds the at least one bond wire.

16. The microelectronic system of claim 8 , wherein the at least one bond wire is a metal selected from the group consisting of copper, aluminum, nickel, silver, gold, and alloys thereof.

Assignees

• Intel Corp

Inventors

• Aleksov Aleksandar
• Seneviratne Dilan
• Gurumurthy Charavana K
• Shen Ching-Ping J
• Sobieski Daniel N

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W72/5522

  comprising gold [Au] · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title