Fluid ejection cartridge with controlled adhesive bond

Patent metadata

Field	Value
Publication number	US-10099483-B2
Application number	US-201715404113-A
Country	US
Kind code	B2
Filing date	Jan 11, 2017
Priority date	Sep 19, 2012
Publication date	Oct 16, 2018
Grant date	Oct 16, 2018

Abstract

A fluid ejection cartridge may include a substrate including substrate ribs that define fluid feed slots extending from a first side to a second side of the substrate, fluid chambers having nozzle openings on a first side of the substrate, an ejection element within each of the fluid chambers and a substrate carrier on a second side of the substrate. The substrate carrier may include carrier ribs that define fluid passageways having oblique centerlines and internal widths that gradually increase from a first width proximate the substrate to a second width, greater than the first width, distant the substrate. Concavely tapered adhesive bonds directly contact faces of the substrate ribs and the carrier ribs to adhere the substrate ribs to the carrier ribs.

First claim

What is claimed is:

1. A fluid ejection cartridge comprising:
a substrate including substrate ribs that define fluid feed slots extending from a top side to a bottom side of the substrate;
fluid chambers having nozzle openings on a first side of the substrate;
an ejection element within each of the fluid chambers;
a substrate carrier on a second side of the substrate, the substrate carrier including carrier ribs that define fluid passageways having oblique centerlines and internal widths that gradually increase from a first width proximate the substrate to a second width, greater than the first width, distant the substrate; and
concavely tapered adhesive bonds directly contacting faces of the substrate ribs and the carrier ribs to adhere the substrate ribs to the carrier ribs.

2. The fluid ejection cartridge of claim 1 , wherein the fluid feed slots comprise a first fluid feed slot and a second fluid feed slot, the substrate ribs comprising a substrate rib having a substrate rib surface, wherein the fluid passageways comprise a first fluid passageway between a first pair of the carrier ribs to provide fluid to the first fluid feed slot and a second fluid passageway between a second pair of the carrier ribs to provide fluid to the second fluid feed slot and wherein the carrier ribs comprise a carrier rib including a carrier rib surface facing the substrate rib surface.

3. The fluid ejection cartridge of claim 2 , wherein the substrate rib surface has a width W 2 , extending from an edge of the first fluid feed slot to an edge of the second fluid feed slot and wherein a width W 1 of a substrate adhesive footprint does not exceed the width W 2 of the substrate rib surface.

4. The fluid ejection cartridge of claim 2 , wherein the carrier rib surface has a width W 4 , extending from an edge of the first fluid passageway to an edge of the second fluid passageway and wherein a width W 3 of a carrier adhesive footprint does not exceed the width W 4 of the carrier rib surface.

5. The fluid ejection cartridge of claim 2 , wherein the substrate rib surface has a width W 2 , extending from an edge of the first fluid feed slot to an edge of the second fluid feed slot, wherein the carrier rib surface has a width W 4 and wherein a width W 5 of a midsection of the concavely tapered adhesive bond does not exceed at least one of the width W 4 of the carrier rib surface and the width W 2 of the substrate rib surface.

6. The fluid ejection cartridge of claim 5 , wherein width W 5 of a midsection of the concavely tapered adhesive bond does not exceed the width W 4 of the carrier rib surface and does not exceed the width W 2 of the substrate rib surface.

7. The fluid ejection cartridge of claim 2 , wherein the carrier rib surface has a first width W 4 , extending from an edge of the first fluid passageway to an edge of the second fluid passageway, and wherein the substrate rib surface has a second width W 2 , extending from an edge of the first ink feed slot to an edge of the second ink feed slot, greater than the first width W 4 .

8. The fluid ejection cartridge of claim 2 , wherein a width W 5 of a midsection of the concavely tapered adhesive bond does not exceed a width W 1 of the substrate adhesive footprint.

9. The fluid ejection cartridge of claim 2 , wherein a width W 5 of a midsection of the concavely tapered adhesive bond does not exceed a width W 3 of the carrier adhesive footprint.

10. The fluid ejection cartridge of claim 2 , wherein the substrate rib surface has a width W 2 extending from an edge of the first ink feed slot to an edge of the second ink feed slot, the fluid ejection cartridge further comprising: first and second adhesive footprints defining contact points of the adhesive bond at first and second bonding surfaces, respectively; wherein a width W 1 of the first adhesive footprint exceeds a width W 3 of the second bonding surface, but does not exceed a width W 2 of the substrate rib surface.

11. The fluid ejection cartridge of claim 10 , wherein the adhesive bond comprises hydrophilic contact angles of less than 90 degrees at contact points where the adhesive bond contacts the substrate rib surface and the carrier rib surface.

12. The fluid ejection cartridge of claim 2 further comprising a substrate adhesive footprint defining contact points of an adhesive bond to the substrate rib surface, the substrate adhesive footprint having a width W 1 greater than a width W 4 of the carrier rib surface.

13. The fluid ejection cartridge of claim 1 , wherein the ejection element comprises a thermal resistor.

14. The fluid ejection cartridge of claim 1 further comprising a fluid reservoir housed by the fluid ejection cartridge.

15. The fluid ejection cartridge of claim 1 further comprising a conduit to be connected to a remote fluid reservoir.

16. The fluid ejection cartridge of claim 1 further comprising:
a chamber layer coupled to the second side of the substrate; and
an orifice plate coupled to the chamber layer, the chamber layer and the orifice plate forming the chamber and providing the nozzles.

17. A method of fabricating a fluid ejection cartridge, the method comprising:
fabricating a substrate comprising substrate ribs defining ink feed slots;
securing an orifice plate on a first side of the substrate;
securing a substrate carrier on a second side of the substrate, the substrate carrier comprising carrier ribs defining fluid passageways, wherein the fluid passageways each have a center line oblique to the orifice plate while gradually increasing from a first width proximate orifice plate to a second width, greater than the first width, distant the orifice plate;
depositing an adhesive on bonding surfaces of the carrier ribs;
bringing the substrate ribs into proximity with respective carrier ribs such that the deposited adhesive contacts bonding surfaces of the substrate ribs;
forming hydrophilic contact angles of less than 90 degrees where the adhesive contacts the bonding surfaces, such that the adhesive forms a concavely tapered adhesive bond profile that does not protrude into the ink feed slots or fluid passageways.

18. The method of claim 17 , wherein depositing an adhesive on bonding surfaces of the carrier ribs comprises jetting the adhesive on the bonding surfaces of the carrier ribs.

19. The method of claim 17 , wherein forming hydrophilic contact angles comprises:
controlling formulation of the adhesive;
controlling the bonding surfaces of the substrate; and
controlling the bonding surfaces of the substrate carrier.

20. The method of claim 17 , wherein forming hydrophilic contact angles comprises:
engineering interfacial energies of the carrier and substrate surfaces to air interfacial energy;
engineering the carrier and substrate surfaces to adhesive liquid interfacial energy; and
engineering adhesive liquid to air interfacial energy.

Assignees

• Hewlett Packard Development Co

Inventors

• Rivas Rio
• Friesen Ed

Classifications

• B41J2/1631

  photolithography · CPC title

• B41J2/14137

  Resistor surrounding the nozzle opening · CPC title

• B41J2/1632

  machining · CPC title

• B41J2/1603

  of the front shooter type · CPC title

• B41J2/1607

  Production of print heads with piezoelectric elements (B41J2/1606, B41J2/162 take precedence) · CPC title