Fluid ejection assembly with controlled adhesive bond

Patent metadata

Field	Value
Publication number	US-9573369-B2
Application number	US-201214418433-A
Country	US
Kind code	B2
Filing date	Sep 19, 2012
Priority date	Sep 19, 2012
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.

First claim

What is claimed is:

1. A fluid ejection assembly comprising:
a substrate including substrate ribs that define ink feed slots extending from a top side to a bottom side of the substrate, the ink feed slots comprising a first ink feed slot and a second ink feed slot, the substrate ribs comprising a substrate rib having a substrate rib surface;
a substrate carrier including carrier ribs that define fluid passageways, the fluid passageways comprising a first fluid passageway to provide ink to the first ink feed slot and a second fluid passageway to provide ink to the second ink feed slot, the carrier ribs comprising a carrier rib including a carrier rib surface facing the substrate rib surface and having a width W 4 extending from an edge of the first fluid passageway to an edge of the second fluid passageway; and
a concavely tapered adhesive bond directly contacting the substrate rib surface and the carrier rib surface to adhere the substrate rib surface to the carrier rib surface without protruding into the first ink feed slot, the second ink feed slot, the first fluid passageway or the second fluid passageway, the adhesive bond comprising a mid-section that has a width W 5 that does not exceed the width W 4 of the carrier rib surface.

2. A fluid ejection assembly as in claim 1 , wherein the substrate rib surface has a width W 2 extending from an edge of the first ink feed slot to an edge of the second ink feed slot, the fluid ejection assembly further comprising: a substrate adhesive footprint defining a contact point of the adhesive bond at the substrate rib surface; wherein a width W 1 of the substrate adhesive footprint does not exceed the width W 2 of the substrate rib surface.

3. A fluid ejection assembly as in claim 2 , wherein the width W 5 does not exceed the width W 1 of the substrate adhesive footprint.

4. A fluid ejection assembly as in claim 1 , further comprising: a carrier adhesive footprint defining a contact point of the adhesive bond at the carrier rib surface; wherein a width W 3 of the carrier adhesive footprint does not exceed the width W 4 of the carrier rib surface.

5. A fluid ejection assembly as in claim 4 , wherein the width W 5 does not exceed the width W 3 of the carrier adhesive footprint.

6. A fluid ejection assembly as in claim 1 , wherein the substrate rib surface has a width W 2 extending from an edge of the first ink feed slot to an edge of the second ink feed slot, wherein the width W 5 does not exceed the width W 2 of the substrate rib surface or the width W 4 of the carrier rib surface.

7. A fluid ejection assembly as in claim 1 , wherein the substrate rib surface has a width W 2 extending from an edge of the first ink feed slot to an edge of the second ink feed slot, the fluid ejection assembly further comprising: first and second adhesive footprints defining contact points of the adhesive bond at first and second bonding surfaces, respectively; wherein a width W 1 of the first adhesive footprint exceeds the width W 4 of the second bonding surface, but does not exceed the width W 2 of the substrate rib surface.

8. A fluid ejection assembly as in claim 1 , wherein the adhesive bond comprises hydrophilic contact angles of less than 90 degrees at contact points where the adhesive bond contacts the substrate rib surface and the carrier rib surface.

9. A fluid ejection assembly as in claim 1 , further comprising a fluid chamber on the top side of the substrate to receive ink from the ink feed slot.

10. A fluid ejection assembly as in claim 1 , further comprising:
a carrier adhesive footprint defining a contact point of the adhesive bond at the carrier rib surface having a width W 3 ;
wherein the width W 3 of the carrier adhesive footprint exceeds the width W 5 of the adhesive bond mid-section.

11. A fluid ejection assembly as in claim 1 , further comprising:
a substrate adhesive footprint defining a contact point of the adhesive bond at the substrate rib surface having a width W 1 ,
wherein the width W 1 of the substrate adhesive footprint does not exceed the width W 5 of the adhesive bond mid-section.

12. A fluid ejection assembly comprising:
a printhead bonded to a fluid distribution manifold to form a fluid pathway extending from a fluid chamber on the printhead through the manifold; and
a concavely tapered adhesive bond between the printhead and the manifold that does not protrude into the fluid pathway, wherein the adhesive bond comprises hydrophilic contact angles of less than 90° at contact points where the adhesive bond contacts the print head and the manifold.

13. A fluid ejection assembly as in claim 12 , further comprising:
a substrate adhesive footprint defining a contact point of the adhesive bond at the printhead and having a substrate adhesive footprint with;
a carrier adhesive footprint defining a contact point of the adhesive bond at the manifold and having a carrier adhesive footprint with,
wherein the adhesive bond comprises a mid-section that has a midsection width, and
wherein the mid-section width of the adhesive bond is less than the substrate adhesive footprint with, and the mid-section width of the adhesive bond is less than the carrier adhesive footprint width.

14. A fluid ejection assembly as in claim 12 , further comprising: a nozzle corresponding with the fluid chamber; and a resistor to heat fluid in the fluid chamber and eject fluid through the nozzle.

15. A method of fabricating a controlled adhesive bond in a fluid ejection assembly, comprising:
fabricating a printhead substrate comprising substrate ribs defining ink feed slots;
fabricating a substrate carrier comprising carrier ribs defining fluid passageways;
depositing an adhesive on bonding surfaces of the carrier ribs;
bringing the substrate ribs into proximity with respective carrier ribs such that the deposited adhesive contacts bonding surfaces of the substrate ribs;
forming hydrophilic contact angles of less than 90 degrees where the adhesive contacts the bonding surfaces, such that the adhesive forms a concavely tapered adhesive bond profile that does not protrude into the ink feed slots or fluid passageways, wherein the adhesive bond profile comprises a midsection having a width W 5 that does not exceed a width W 4 of a carrier rib surface of an adjacent one of the carrier ribs.

16. A method as in claim 15 , wherein depositing an adhesive on bonding surfaces of the carrier ribs comprises jetting the adhesive on the bonding surfaces of the carrier ribs.

17. A method as in claim 15 , wherein forming hydrophilic contact angles comprises:
controlling formulation of the adhesive;
controlling the bonding surfaces of the substrate; and
controlling the bonding surfaces of the carrier.

18. A method as in claim 15 , wherein forming hydrophilic contact angles comprises:
engineering interfacial energies of the carrier and substrate surfaces to air interfacial energy;
engineering the carrier and substrate surfaces to adhesive liquid interfacial energy; and
engineering adhesive liquid to air interfacial energy.

19. A fluid ejection assembly comprising:
a substrate including substrate ribs that define an ink feed slot extending from a top side to a bottom side of the substrate;
a substrate carrier including carrier ribs that define a fluid passageway to provide ink to the ink feed slot; and
a concavely tapered adhesive bond to adhere a substrate rib surface to the a carrier rib surface without protruding into ink feed slot or the fluid passageway, the adhesive bond compris

Assignees

• Hewlett Packard Development Co Lp

Inventors

• Rivas Rio
• Friesen Ed

Classifications

• B41J2/14201 Primary

  Structure of print heads with piezoelectric elements · CPC title

• B41J2002/14387

  Front shooter · CPC title

• B41J2002/14362

  Assembling elements of heads · CPC title

• B41J2/1603

  of the front shooter type · CPC title

• B41J2/14145

  Structure of the manifold · CPC title