Electronic apparatus, method of controlling electronic apparatus, power reception device, electric device, and system

Patent metadata

Field	Value
Publication number	US-10097025-B2
Application number	US-201414901022-A
Country	US
Kind code	B2
Filing date	Jun 20, 2014
Priority date	Jun 27, 2013
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

There is provided an electronic apparatus including: a heating section; a heat storage section; a detection section configured to detect a heat storage amount of the heat storage section; and a control section configured to control operation of the heating section, based on the heat storage amount detected by the detection section.

First claim

The invention claimed is:

1. An electronic apparatus comprising:
a heating section;
a heat storage section;
a detection section configured to detect at least two of a temperature, a pressure and an electric resistance value; and
a control section configured to calculate a heat storage amount based upon the at least two of the temperature, the pressure and the electric resistance value detected by the detection section, and control operation of the heating section based on the heat storage amount.

2. The electronic apparatus according to claim 1 , wherein the control section calculates the heat storage amount, based on one or more of a volume, a stress, and a strain of the heat storage section.

3. The electronic apparatus according to claim 1 , wherein the heating section includes one or a plurality of heating components thermally connected to the heat storage section.

4. The electronic apparatus according to claim 3 , wherein the heat storage section includes one or a plurality of individual heat storage sections thermally connected to the respective heating components.

5. The electronic apparatus according to claim 4 , wherein one of the one or the plurality of individual heat storage sections is configured integrally with a corresponding heating component.

6. The electronic apparatus according to claim 4 , further comprising
a heat dissipation component connected to one of the one or the plurality of heating components, wherein
the heat dissipation component is configured integrally with the individual heat storage section corresponding to the heating component that is connected to the heat dissipation component.

7. The electronic apparatus according to claim 4 , wherein one of the one or the plurality of individual heat storage sections is configured of a solid phase transition material.

8. The electronic apparatus according to claim 7 , wherein the solid phase transition material is an electronic phase transition material.

9. The electronic apparatus according to claim 4 , wherein one of the one or the plurality of individual heat storage sections is configured by compounding a solid phase transition material with one or more metals.

10. The electronic apparatus according to claim 9 , wherein the metal is one of aluminum (Al), copper (Cu), Magnesium (Mg), titanium (Ti), iron (Fe), nickel (Ni), zinc (Zn), silver (Ag), tin (Sn), indium (In), antimony (Sb), bismuth (Bi), and lead (Pd).

11. The electronic apparatus according to claim 4 , wherein one of the one or the plurality of individual heat storage sections is configured by compounding a solid phase transition material with one of rubber and gel.

12. The electronic apparatus according to claim 4 , wherein
one of the one or the plurality of individual heat storage sections has a metallic film on a part of a surface of the individual heat storage section, and
the individual heat storage section having the metallic film is connected to a corresponding heating component by a solder through the metallic film.

13. The electronic apparatus according to claim 4 , wherein one of the one or the plurality of individual heat storage sections is configured of a latent heat storage material.

14. The electronic apparatus according to claim 4 , further comprising another heat storage section connected to the one or the plurality of individual heat storage sections.

15. The electronic apparatus according to claim 1 , wherein the heating section is a charging section configured to charge a battery.

16. The electronic apparatus according to claim 15 , wherein the heating section further includes a battery.

17. The electronic apparatus according to claim 15 , wherein the control section performs control to decrease a power supply amount to the battery when the heat storage amount is larger than a first threshold, and performs control to stop power supply to the battery when the heat storage amount is larger than a second threshold.

18. The electronic apparatus according to claim 15 , wherein the charging section charges the battery, based on power received from a feeding device through wireless feeding.

19. The electronic apparatus according to claim 18 , wherein the charging section receives power from the feeding device through one or more of electromagnetic induction, electrostatic induction, infrared radiation, and electromagnetic waves.

20. The electronic apparatus according to claim 15 , wherein the charging section charges the battery, based on power received from a feeding device through wired feeding.

21. The electronic apparatus according to claim 1 , wherein the heating section is a semiconductor circuit.

22. The electronic apparatus according to claim 1 , wherein the heating section is a display panel.

23. The electronic apparatus according to claim 1 , wherein the heating section is located in an enclosure including the heat storage section.

24. The electronic apparatus according to claim 1 , wherein the heating section is located in an enclosure that is configured as the heat storage section.

25. The electronic apparatus according to claim 1 , wherein
the heating section is located in an enclosure, and
the heat storage section is disposed outside the enclosure, and is thermally connected to the heating section through the enclosure.

26. The electronic apparatus according to claim 1 , wherein
the heating section is located in an enclosure, and
the heat storage section is disposed outside the enclosure, and is thermally connected to the heating section without through the enclosure.

27. The electronic apparatus according to claim 1 , wherein the heating section and the heat storage section are located in an enclosure.

28. A method of controlling an electronic apparatus, the method comprising:
detecting at least two of a temperature, a pressure and an electric resistance value
calculating a heat storage amount based upon the at least two of the temperature, the pressure and the electric resistance value; and
controlling operation of a heating section based on the heat storage amount.

Assignees

• Sony Corp

Inventors

• Yajima Masakazu
• Ichimura Kiminobu
• Ishida Yuichi
• Sugiyama Yutaka
• Muraoka Yoshio

Classifications

• H10W40/735

  by melting or evaporation of solids · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H02J7/82

  Control of state of charge [SOC] · CPC title

• H02J7/975

  in response to temperature · CPC title

• H02J7/92

  with prioritisation of loads or sources · CPC title