Apparatus and method for chemical mechanical polishing process control

Patent metadata

Field	Value
Publication number	US-10096482-B2
Application number	US-201514822671-A
Country	US
Kind code	B2
Filing date	Aug 10, 2015
Priority date	Nov 24, 2010
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

An apparatus and method for providing target thickness and surface profile uniformity control of a multi-head chemical mechanical polishing (CMP) process is disclosed. An exemplary method includes providing at least two wafers; determining a surface profile of each of the at least two wafers; determining an operation mode for a chemical mechanical polishing (CMP) process based on the surface profiles of the at least two wafers; determining a CMP polishing recipe for each of the at least two wafers based on the operation mode; and performing the CMP process on the at least two wafers based on the determined CMP polishing recipes.

First claim

What is claimed is:

1. An apparatus comprising:
a chemical mechanical polishing (CMP) tool having at least two wafer heads for polishing wafers; and
a controller in communication with the CMP tool, wherein the controller is configured to provide target thickness and surface profile uniformity control for the wafers by:
classifying surface profiles of at least two wafers, wherein each of the at least two wafers corresponds with one of the at least two wafer heads,
selecting an operation mode based on the classified surface profiles of the at least two wafers, wherein the operation mode is designated as a coupled mode where the at least two wafers are polished on a single polishing pad or a decoupled mode where the at least two wafers are polished on different polishing pads,
generating a CMP polishing recipe for each of the at least two wafer heads based on the operation mode, wherein the CMP polishing recipe accounts for interactions among the at least two wafer heads, and
performing a CMP process on the at least two wafers based on the operation mode and the generated CMP polishing recipe.

2. The apparatus of claim 1 , wherein the coupled mode is selected, and wherein the controller is further configured to determine the CMP polishing recipe accounts for a polishing rate interaction between the at least two wafer heads, whereby a removal rate of a first wafer of the at least two wafers corresponding with a first wafer head of the at least two wafer heads depends on a polishing pressure imparted on a second wafer of the at least two wafers by a second wafer head of the at least two wafer heads during polishing on the single polishing pad.

3. The apparatus of claim 2 , wherein the polishing pressure imparted on the second wafer is different from a polishing pressure imparted on the first wafer.

4. The apparatus of claim 1 , further comprising a metrology tool configured to measure the surface profiles of the at least two wafers after the CMP process, and wherein the controller is further configured to modify, based on the measured surface profiles, a CMP control model used to generate the CMP polishing recipe.

5. The apparatus of claim 1 , wherein the at least two wafer heads each include a plurality of independent pressure zones.

6. The apparatus of claim 5 , wherein the controller is further configured to generate the CMP polishing recipe to account for a polishing rate interaction between a first pressure zone and a second pressure zone of the plurality of independent pressure zones, whereby a removal rate of the first pressure zone depends on a polishing pressure imparted by the second pressure zone.

7. The apparatus of claim 5 , wherein the plurality of independent pressure zones are arranged concentrically around a pressure head center line.

8. The apparatus of claim 1 , wherein the CMP polishing recipe defines at least one of the following for each of the at least two wafer heads: a mean pressure, a pressure profile, a polishing time, or a velocity.

9. A chemical-mechanical polishing (CMP) system comprising:
a base configured to receive at least one polishing pad;
a plurality of wafer heads each configured to receive a wafer and to polish the received wafer on the at least one polishing pad, wherein the plurality of wafer heads are further configured to polish received wafers on the at least one polishing pad concurrently, and wherein the plurality of wafer heads are further configured to apply independent polishing pressures while polishing the received wafers on the at least one polishing pad concurrently; and
a controller communicatively coupled to the plurality of wafer heads, wherein the controller is configured to:
classify surface profiles of the received wafers;
determine a polishing parameter for each of the plurality of wafer heads based on: the classified surface profiles and an interaction between the plurality of wafer heads, whereby a polishing rate associated with one of the plurality of wafer heads depends on pressure applied by the other of the plurality of wafer heads when polishing the received wafers on the at least one polishing pad concurrently; and
control the plurality of wafer heads to perform the polishing of the received wafers on the at least one polishing pad concurrently according to the polishing parameter.

10. The CMP system of claim 9 , wherein the controller is further configured to determine the polishing parameter further based on at least one of a target thickness or a surface profile uniformity.

11. The CMP system of claim 9 , wherein the polishing parameter for each of the plurality of wafer heads includes a polishing pressure and wherein a polishing pressure associated with one of the plurality of wafer heads is different from the polishing pressure associated with the other of the plurality of wafer heads.

12. The CMP system of claim 9 further comprising a metrology tool configured to determine a post-polishing surface profile of the received wafers after the polishing of the received wafers on the same polishing pad concurrently, wherein the controller is further configured to modify a control model used to determine the polishing parameter based on the post-polishing surface profile.

13. The CMP system of claim 9 , wherein the polishing parameter includes at least one of: a mean pressure, a pressure profile, a polishing time, or a velocity.

14. The CMP system of claim 9 , wherein each of the plurality of wafer heads includes a plurality of independent pressure zones each configured to provide an independent polishing pressure.

15. The CMP system of claim 14 , wherein the plurality of independent pressure zones are arranged concentrically around a pressure head center line.

16. The CMP system of claim 14 , wherein the controller is further configured to determine the polishing parameter further based on an interaction between a first pressure zone and a second pressure zone of the plurality of independent pressure zones, whereby a polishing rate associated with the first pressure zone depends on a pressure associated with the second pressure zone.

17. A wafer polishing apparatus comprising:
a controller configured to determine a polishing parameter to achieve at least one of a target thickness or a target surface profile uniformity of a first wafer and a second wafer, wherein the polishing parameter accounts for a removal rate effect on the first wafer due to a pressure applied to the second wafer when concurrently polishing the first wafer and the second wafer on a single polishing pad; and
a first wafer head and a second wafer head for concurrently polishing the first wafer and the second wafer, respectively, based on the polishing parameter, wherein the second wafer head and the first wafer head are configured to apply independent pressures respectively to the first wafer and the second wafer.

18. The wafer polishing apparatus of claim 17 , wherein the polishing parameter includes a first pressure associated with the first wafer head and a second pressure associated with the second wafer head, and wherein the first pressure and the second pressure are different.

19. The wafer polishing apparatus of claim 17 , wherein the polishing parameter includes at least one of: a mean pressure, a pressure profile, a polishing time, or a velocity.

20. The wafer polishing apparatus of claim 17 , wherein each of the first wafer head and the second wafer head have a plurality of independent pressure zones, and wherein the determined polishing parameter further accounts for a re

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Hui Keung
• Sung Jin-Ning
• Mou Jong-I
• Huang Soon-Kang
• Tsen Yen-Di

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P52/402 Primary

  of semiconductor materials · CPC title

• B24B49/02

  according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent (B24B49/12 takes precedence) · CPC title

• B24B37/042 Primary

  operating processes therefor · CPC title