Mold structure, transfer molding apparatus, and transfer molding method

Patent metadata

Field	Value
Publication number	US-10093043-B2
Application number	US-201514704276-A
Country	US
Kind code	B2
Filing date	May 5, 2015
Priority date	Nov 5, 2012
Publication date	Oct 9, 2018
Grant date	Oct 9, 2018

Abstract

A mold structure has a first mold, a second mold relatively connectable to and disconnectable from the first mold, a heater on at least one of the first and second molds, a transfer member on at least one of the first and second molds, that is relatively movable and separable from the at least one of the first and second molds on which the transfer member is disposed, a transfer surface formed on the transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet, and a moving mechanism that moves the at least one of the first and second molds on which the transfer member is disposed and the transfer member relative to each other.

First claim

The invention claimed is:

1. A mold structure configured to perform molding, comprising:
a first mold;
a second mold configured to be brought together and separated from the first mold;
a heater on at least one of the first and second molds;
a transfer member on at least one of the first and second molds, wherein the transfer member is configured to be moved and separated from the at least one of the first and second molds on which the transfer member is disposed during the molding;
a transfer surface formed on the transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet; and
a moving mechanism that moves the at least one of the first and second molds on which the transfer member is disposed away from the transfer member during the molding.

2. A transfer molding apparatus comprising the mold structure according to claim 1 .

3. The transfer molding apparatus according to claim 2 ,
wherein the transfer member comprises a cooling unit that cools the transfer member that is maintained in contact with the resin sheet and that has been moved and separated from the at least one of the first and second molds on which the transfer member is disposed.

4. The transfer molding apparatus according to claim 3 ,
wherein the cooling unit is located in a non-transfer area at least when transfer molding is not being performed.

5. The transfer molding apparatus according to claim 4 ,
wherein the cooling unit comprises an intake unit that supplies air to a surface of the transfer member opposite to the transfer surface of the transfer member moved and separated from the at least one of the first and second molds on which the transfer member is disposed.

6. The transfer molding apparatus according to claim 4 ,
the cooling unit comprises a cooling member that comes in contact with a surface of the transfer member opposite to the transfer surface of the transfer member moved and separated from the at least one of the first and second molds on which the transfer member is disposed.

7. The transfer molding apparatus according to claim 3 ,
wherein the cooling unit comprises an intake unit that supplies air to a surface of the transfer member opposite to the transfer surface of the transfer member moved and separated from the at least one of the first and second molds on which the transfer member is disposed.

8. The transfer molding apparatus according to claim 3 ,
the cooling unit comprises a cooling member that comes in contact with a surface of the transfer member opposite to the transfer surface of the transfer member moved and separated from the at least one of the first and second molds on which the transfer member is disposed.

9. The transfer molding apparatus according to claim 8 ,
wherein the cooling member has a temperature not more than a glass-transition temperature of the resin sheet.

10. The transfer molding apparatus according to claim 9 ,
wherein the cooling member has a first surface coming in contact with the surface of the transfer member opposite to the transfer surface, and a second surface having a heat insulator thereon.

11. The transfer molding apparatus according to claim 9 ,
wherein one of the first and second molds located opposite to the cooling unit across the resin sheet comprises a heater, and a heat insulator between the resin sheet and the heater.

12. The transfer molding apparatus according to claim 8 ,
wherein the cooling member has a first surface coming in contact with the surface of the transfer member opposite to the transfer surface, and a second surface having a heat insulator thereon.

13. The transfer molding apparatus according to claim 8 ,
wherein one of the first and second molds located opposite to the cooling unit across the resin sheet comprises a heater, and a heat insulator between the resin sheet and the heater.

14. The transfer molding apparatus according to claim 8 ,
wherein the cooling member is movable in a direction intersecting with a direction in which the first and second molds are brought together and separated.

15. The transfer molding apparatus according to claim 3 ,
wherein the cooling unit comprises one cooling member that cools a surface of the transfer member opposite to the transfer surface,
wherein only one of the first and second molds comprises the transfer member, and
wherein the only one of the first and second molds has a higher temperature than an opposing one of the first and second molds that is disposed opposite the only one of the first and second molds.

16. A transfer molding apparatus comprising:
a mold structure configured to perform molding, comprising:
a first mold;
a second mold configured to be brought together and separated from the first mold;
a heater on at least one of the first and second molds;
a first transfer member formed on the first mold, wherein the first transfer member is configured to be moved and separated from the first mold during the molding;
a second transfer member formed on the second mold, wherein the second transfer member is configured to be moved and separated from the second mold during the molding;
a first transfer surface formed on the first transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet;
a second transfer surface formed on the second transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet;
a first moving mechanism that moves the first mold away from the first transfer member during the molding; and
a second moving mechanism that moves the second mold away from the second transfer member during the molding,

wherein the first transfer member comprises a first cooling unit that cools the first transfer member that is maintained in contact with the resin sheet and that has been moved and separated from the first mold,
wherein the second transfer member comprises a second cooling unit that cools the second transfer member that is maintained in contact with the resin sheet and that has been moved and separated from the second mold,
wherein the first and second molds are maintained at a substantially same temperature.

17. The transfer molding apparatus according to claim 16 ,
wherein at least one of the first and second molds reciprocates in a first direction that intersects with a second direction in which the molds are brought together and separated.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Takemura Koichi
• Shibata Tomofusa
• Ito Yoshinori
• Taguchi Yoshikaga

Classifications

• B29C51/087

  with at least one of the mould parts comprising independently movable sections (B29C51/32 and B29C51/34 take precedence) · CPC title

• B29C51/082

  by shaping between complementary mould parts · CPC title

• B29C59/026 Primary

  of layered or coated substantially flat surfaces · CPC title

• B29C43/361

  with pressing members independently movable of the parts for opening or closing the mould, e.g. movable pistons (transfer moulding B29C45/02; injection-compression moulding B29C45/561) · CPC title

• B29C2059/023

  Microembossing · CPC title