Transfer molding method and transfer molding apparatus

Patent metadata

Field	Value
Publication number	US-9452572-B2
Application number	US-201313762766-A
Country	US
Kind code	B2
Filing date	Feb 8, 2013
Priority date	Nov 5, 2012
Publication date	Sep 27, 2016
Grant date	Sep 27, 2016

Abstract

A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.

First claim

What is claimed is:

1. A transfer molding apparatus comprising:
a first die;
a second die configured to be separated from and come into contact with the first die;
a heater that is provided in at least one of the first and second dies;
a transfer member disposed in at least one of the first and second dies while being able to be separately moved from the die, wherein the transfer member performs transfer molding while abutting a transfer surface on a resin sheet supplied between the first and second dies;
a cooling member that abuts on and cools a surface on an opposite side of a surface, in which the transfer surface of the transfer member is formed, while separately moving the transfer member from the die; and
a controller that brings the first and second dies close to each other, nips the cooling member, the transfer member, and the resin film, cools the resin sheet while an applied pressure is maintained at a first setting value smaller than an applied pressure in the transfer molding, and further cools the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.

2. The transfer molding apparatus according to claim 1 , wherein the transfer member can relatively separately be moved from the die.

3. The transfer molding apparatus according to claim 2 , further comprising a cooling part that cools the transfer member relatively separately moved from the die.

4. The transfer molding apparatus according to claim 1 , wherein the transfer member can relatively separately be moved from the die.

5. The transfer molding apparatus according to claim 4 , further comprising a cooling part that cools the transfer member relatively separately moved from the die.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Takemura Koichi
• Shibata Tomofusa
• Yamanaka Yoshihisa
• Suzuki Kenji
• Kaneko Kazutaka
• Taguchi Yoshikaga
• Kojima Masayuki

Classifications

• B29C35/16

  Cooling {(cooling extruded material B29C48/911; cooling preforms for blow moulding B29C49/6427; cooling blown articles B29C49/66; cooling tyres during post cure inflation B29D30/0643)} · CPC title

• B29D11/00663 Primary

  Production of light guides · CPC title

• B29C59/02

  by mechanical means, e.g. pressing {(B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627)} · CPC title

• B29C2035/1658

  using gas · CPC title

• B29C2035/1616

  using liquids · CPC title