Heat dissipating sheet and heat dissipating structure using same

Patent metadata

Field	Value
Publication number	US-10091868-B2
Application number	US-201515325526-A
Country	US
Kind code	B2
Filing date	Sep 9, 2015
Priority date	Sep 17, 2014
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

A heat-dissipating sheet includes a thermally-conductive resin sheet, an adhesive layer on an upper surface of the thermally-conductive resin sheet, and a thermally-conductive film on an upper surface of the adhesive layer. The thermally-conductive film has a higher thermal conductivity than the thermally-conductive resin sheet. The thermally-conductive resin sheet has a thin portion that is locally thin to form a recess in a lower surface of the thermally-conductive resin sheet. The recess may be an aperture passing through the thermally-conductive resin sheet. The adhesive layer is exposed from the aperture.

First claim

The invention claimed is:

1. A heat-dissipating sheet comprising:
a thermally-conductive resin sheet;
an adhesive layer provided on an upper surface of the thermally-conductive resin sheet; and
a thermally-conductive film provided on an upper surface of the adhesive layer, the thermally-conductive film having a thermal conductivity higher than a thermal conductivity of the thermally-conductive resin sheet,
wherein the thermally-conductive resin sheet has a thin portion that is locally thin to form a recess in a lower surface of the thermally-conductive resin sheet, and
wherein the thermally-conductive resin sheet is made of a material that does not contain siloxane and is plastically deformed at 25° C.

2. The heat-dissipating sheet of claim 1 , wherein a thickness of the thin portion is not smaller than 5% and not larger than 70% of a thickness of a periphery of the thermally-conductive resin sheet.

3. The heat-dissipating sheet of claim 1 , wherein a width of the recess tapers from the lower surface of the thermally-conductive resin sheet toward a bottom surface of the recess.

4. The heat-dissipating sheet of claim 1 ,
wherein the recess is an aperture passing through the thermally-conductive resin sheet, and
wherein the adhesive layer is exposed from the aperture of the thermally-conductive resin sheet.

5. The heat-dissipating sheet of claim 1 , wherein the recess is provided more inwardly than a periphery of the thermally-conductive resin sheet.

6. The heat-dissipating sheet of claim 1 , wherein the thermally-conductive resin sheet is made of styrene polymer.

7. A heat-dissipating sheet comprising:
a thermally-conductive resin sheet;
an adhesive layer provided on an upper surface of the thermally-conductive resin sheet; and
a thermally-conductive film provided on an upper surface of the adhesive layer, the thermally-conductive film having a thermal conductivity higher than a thermal conductivity of the thermally-conductive resin sheet,
wherein the thermally-conductive resin sheet has a thin portion that s locally thin to form a recess in a lower surface of the thermally-conductive resin sheet,
wherein the recess is an aperture passing through the thermally-conductive resin sheet, and
wherein the adhesive layer is exposed from the aperture of the thermally-conductive resin sheet,
wherein the aperture is configured to allow a heat-generating component to be inserted into the aperture, and
wherein a size of a surface of the adhesive layer exposed from the aperture is larger than a size of an upper surface of the heat-generating component.

8. A heat-dissipating sheet comprising:
a thermally-conductive resin sheet;
an adhesive layer provided on an upper surface of the thermally-conductive resin sheet; and
a thermally-conductive film provided on an upper surface of the adhesive layer, the thermally-conductive film having a thermal conductivity higher than a thermal conductivity of the thermally-conductive resin sheet,
wherein the thermally-conductive resin sheet has a thin portion that is locally thin to form a recess in a lower surface of the thermally-conductive resin sheet,
wherein the recess is configured to allow a heat-generating component to be inserted into the recess, and
wherein a size of a bottom surface of the recess is smaller than a size of the upper surface of the heat-generating component.

9. A heat-dissipating structure comprising:
a printed circuit board,
a heat-generating component mounted on an upper surface of the printed circuit board, and
a heat-dissipating sheet,
wherein the heat-dissipating sheet includes:
a thermally-conductive resin sheet,
an adhesive layer provided on an upper surface of the thermally-conductive resin sheet, and
a thermally-conductive film that is provided on an upper surface of the adhesive layer and has a thermal conductivity higher than a thermal conductivity of the thermally-conductive resin sheet,

wherein the thermally-conductive resin sheet having a recess provided in a lower surface of the thermally-conductive resin sheet, the recess having a bottom surface contacting an upper surface of the heat-generating component,
wherein the thermally-conductive resin sheet includes a thin portion locally thin to form the recess,
wherein the thermally-conductive resin sheet contacts at least a part of the upper surface of the printed circuit board, an entirety of the upper surface of the heat-generating component, and a half or more of a side surface of the heat-generating component from the upper surface to the lower surface of the heat-generating component,
wherein the recess is an aperture passing through the thermally-conductive resin sheet,
wherein the adhesive layer is exposed from the aperture of the thermally-conductive resin sheet, and
wherein the heat-generating component contacts the adhesive layer exposed from the aperture and is bonded to the adhesive layer.

10. The heat-dissipating structure of claim 9 , wherein a size of the bottom surface of the recess is smaller than a size of the upper surface of the heat-generating component, with the heat-generating component outside the recess.

11. The heat-dissipating structure of claim 9 , wherein a thickness of the thin portion is between 5% and 70% inclusive of a thickness of a periphery of the thermally-conductive resin sheet.

12. The heat-dissipating structure of claim 9 , wherein, while the heat-generating component is not inserted in recess, a size of a surface of the adhesive layer exposed from the aperture is larger than a size of the upper surface of the heat-generating component.

13. The heat-dissipating structure of claim 9 , wherein the recess is provided more inwardly than a periphery of the thermally-conductive resin sheet.

14. The heat-dissipating structure of claim 9 , wherein the thermally-conductive resin sheet is made of styrene polymer.

15. A heat-dissipating structure comprising:
a printed circuit board,
a heat-generating component mounted on an upper surface of the printed circuit board, and
a heat-dissipating sheet,
wherein the heat-dissipating sheet includes:
a thermally-conductive resin sheet,
an adhesive layer provided on an upper surface of the thermally-conductive resin sheet, and
a thermally-conductive film that is provided on an upper surface of the adhesive layer and has a thermal conductivity higher than a thermal conductivity of the thermally-conductive resin sheet,

wherein the thermally-conductive resin sheet having a recess provided in a lower surface of the thermally-conductive resin sheet, the recess having a bottom surface contacting an upper surface of the heat-generating component,
wherein the thermally-conductive resin sheet includes a thin portion locally thin to form the recess,
wherein the thermally-conductive resin sheet contacts at least a part of the upper surface of the printed circuit board, an entirety of the upper surface of the heat-generating component, and a half or more of a side surface of the heat-generating component from the upper surface to the lower surface of the heat-generating component, and
wherein a size of the bottom surface of the recess is smaller than a size of the upper surface of the heat-generating component, with the heat-generating component outside the recess.

16. A heat-dissipating sheet comprising:
a thermally-conductive resin sheet;
an adhesive layer provided on an upper surface of the thermally-conductive resin sheet; and
a thermally-conductive film provided on an upper surface of the adhesive layer, the thermally-conductive film having a thermal conductivity

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Nakayama Masafumi
• Matsuno Koji

Classifications

• H10W40/25

  characterised by their materials · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• F28F13/18

  by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing · CPC title

• H05K1/0204 Primary

  using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence) · CPC title