Adjustable heat sink fin spacing

Patent metadata

Field	Value
Publication number	US-10088244-B2
Application number	US-201715800095-A
Country	US
Kind code	B2
Filing date	Nov 1, 2017
Priority date	Apr 18, 2016
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

A heat sink includes a heat sink base/riser, a first fin, and a second fin. The spacing between the base/riser and the first fin and the second fin, restively, may be adjusted by rotating a threaded rod. The threaded rod includes a first threaded knurl that is engaged with the first fin and a second threaded knurl that is engaged with the second fin. The thread pitch of the first threaded knurl and the second threaded knurl may differ. For example, the pitch of the first threaded knurl may be smaller than the pitch of the second threaded knurl if the first fin is located nearest the heat sink base/riser relative to the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

First claim

What is claimed is:

1. A method to fabricate an electronic device comprising:
engaging a first heat sink fin with a first threaded knurl comprising a first thread of a first thread pitch;
engaging a second heat sink fin with a second threaded knurl comprising a second thread of a second thread pitch;
engaging the first heat sink fin and the second heat sink fin with a heat sink base to fix rotation of the first heat sink fin and the second heat sink fin relative to the heat sink base about an axis orthogonal to a major surface of the heat sink base; and
connecting the first threaded knurl with the second threaded knurl to fix rotation of first threaded knurl with the second threaded knurl about the axis orthogonal to the major surface of the heat sink base.

2. The method of claim 1 , further comprising:
thermally connecting the heat sink base to a semiconductor chip.

3. The method of claim 1 , further comprising:
connecting a first temperature sensing device to the first heat sink fin, wherein the first temperature sensing device measures the first heat sink fin temperature; and
connecting a second temperature sensing device to the second heat sink fin, wherein the second temperature sensing device measures the second heat sink fin temperature.

4. The method of claim 2 , further comprising:
connecting a temperature sensing device to the semiconductor chip, wherein the temperature sensing device measures the semiconductor chip temperature.

5. The method of claim 1 , further comprising:
connecting a motor to the first threaded knurl, wherein the motor rotates the first threaded knurl and the second threaded knurl about the axis orthogonal to the major surface of the heat sink base.

6. The method of claim 1 , wherein the major surface of the heat sink base is parallel with a major surface of the first heat sink fin and parallel with a major surface of the second heat sink fin.

7. The method of claim 1 , wherein spacing between the first heat sink fin and the heat sink base and spacing between the second heat sink fin and the heat sink base changes upon the rotation of the first threaded knurl and the second threaded knurl about the axis orthogonal to the major surface of the heat sink base.

8. The method of claim 1 , wherein the first heat sink fin is engaged with the heat sink base such that the first heat sink fin is nearest the heat sink base.

9. The method of claim 8 , wherein the first thread pitch is smaller than the second thread pitch.

10. A method to fabricate an electronic device comprising:
engaging a first heat sink fin with a first threaded knurl comprising a first thread of a first thread pitch;
engaging a second heat sink fin with a second threaded knurl comprising a second thread of a second thread pitch;
engaging the first heat sink fin and the second heat sink fin with a heat sink riser to fix rotation of the first heat sink fin and the second heat sink fin relative to the heat sink riser about an axis orthogonal to a major surface of the heat sink riser; and
connecting the first threaded knurl with the second threaded knurl to fix rotation of first threaded knurl with the second threaded knurl about the axis orthogonal to the major surface of the heat sink riser.

11. The method of claim 10 , further comprising:
connecting the heat sink riser to a heat sink base.

12. The method of claim 11 , further comprising:
thermally connecting the heat sink base to a semiconductor chip.

13. The method of claim 10 , further comprising:
connecting a first temperature sensing device to the first heat sink fin, wherein the first temperature sensing device measures the first heat sink fin temperature; and
connecting a second temperature sensing device to the second heat sink fin, wherein the second temperature sensing device measures the second heat sink fin temperature.

14. The method of claim 12 , further comprising:
connecting a temperature sensing device to the semiconductor chip, wherein the temperature sensing device measures the semiconductor chip temperature.

15. The method of claim 10 , further comprising:
connecting a motor to the first threaded knurl, wherein the motor rotates the first threaded knurl and the second threaded knurl about the axis orthogonal to the major surface of the heat sink riser.

16. The method of claim 10 , wherein the major surface of the heat sink riser is parallel with a major surface of the first heat sink fin and parallel with a major surface of the second heat sink fin.

17. The method of claim 12 , wherein the major surface of the heat sink riser is orthogonal to a major surface of the semiconductor chip.

18. The method of claim 10 , wherein spacing between the first heat sink fin and the heat sink riser and spacing between the second heat sink fin and the heat sink riser changes upon the rotation of the first threaded knurl and the second threaded knurl about the axis orthogonal to the major surface of the heat sink riser.

19. The method of claim 1 , wherein the first heat sink fin is engaged with the heat sink riser such that the first heat sink fin is nearest the heat sink riser.

20. The method of claim 8 , wherein the first thread pitch is smaller than the second thread pitch.

Assignees

• IBM

Inventors

• Bodenweber Paul F
• Sikka Kamal K

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W40/237

  attached to additional arrangements for cooling · CPC title