Encapsulated polymerization initiators, polymerization systems and methods using the same

Patent metadata

Field	Value
Publication number	US-10087272-B2
Application number	US-201715594590-A
Country	US
Kind code	B2
Filing date	May 13, 2017
Priority date	May 29, 2015
Publication date	Oct 2, 2018
Grant date	Oct 2, 2018

Abstract

A polymerizable system includes a curable composition and one or more encapsulated initiator particles. The curable composition can include one or more 1,1-disubstituted alkene compounds and the encapsulated initiator particles can include one or more polymerization initiators encapsulated by a cured composition. The cured composition includes one or more 1,1-disubstituted alkene compounds.

First claim

What is claimed is:

1. A method of forming encapsulated initiator matrices comprising:
dispersing polymerization initiators in a medium, the polymerization initiators comprising spherical, non-spherical, irregular, angular, textured, or layered particles having an average granulometry of about 0.1 microns to about 1,000 microns; and
adding a first polymerizable composition to the medium, the first polymerizable composition comprising one or more 1,1-disubstituted alkene compounds; and
wherein the first polymerizable composition polymerizes upon contact with the polymerization initiators to form encapsulated initiator matrices.

2. The method of claim 1 , further comprising the step of terminating residual polymerization of the first polymerizable composition by adding a first anionic polymerization terminator to the medium.

3. The method of claim 2 , wherein the first anionic polymerization terminator comprises a mineral acid, a carboxylic acid, or a combination thereof.

4. The method of claim 1 , wherein the one or more 1,1-disubstituted alkene compounds of the first polymerizable composition comprise low Tg 1,1-disubstituted alkene compounds.

5. The method of claim 1 , wherein the one or more 1,1-disubstituted alkene compounds of the first polymerizable composition comprise a blend of low Tg 1,1-disubstituted alkene compounds and elevated Tg 1,1-disubstituted alkene compounds.

6. The method of claim 1 , wherein the one or more 1,1-disubstituted alkene compounds of the first polymerizable composition are selected from the group consisting of methylene malonates, methylene β-ketoesters, methylene β-diketones, dialkyl disubstituted vinyls, dihaloalkyl disubstituted vinyls, monofunctional, difunctional, or multifunctional monomers, oligomers, or polymers thereof, and combinations thereof.

7. The method of claim 1 , wherein the first polymerizable composition further comprises one or more plasticizers.

8. The method of claim 1 , wherein the medium comprises an aqueous composition.

9. The method of claim 1 , wherein the encapsulated initiator particles rupture when about 0.1 psi or more of mechanical force is applied.

10. The method of claim 1 , further comprising the step of adding a second polymerizable composition to the medium after forming the encapsulated initiator matrices, the second polymerizable composition polymerizing upon contact with the encapsulated initiator matrices to form a shell layer surrounding the encapsulated initiator matrices.

11. The method of claim 10 , wherein the second polymerizable composition comprises one or more 1,1-disubstituted alkene compounds.

12. The method of claim 11 , wherein the one or more 1,1-disubstituted alkene compounds of the first polymerizable composition and the one or more 1,1-disubstituted alkene compounds of the second composition are different.

13. The method of claim 12 , further comprising the step of terminating residual polymerization of the second polymerizable composition by adding a second anionic polymerization terminator.

14. A method of curing a polymerizable system comprising:
providing a polymerizable system comprising:
a curable composition comprising one or more 1,1-disubstituted alkene compounds; and
one or more encapsulated initiator particles, each of the one or more encapsulated initiator particles comprising:
one or more polymerization initiators substantially encapsulated by a cured composition formed from one or more 1,1-disubstituted alkene compounds, the one or more polymerization initiators comprising spherical, non-spherical, irregular, angular, textured, or layered particles having an average granulometry of about 0.1 microns to about 1,000 microns; and

rupturing the one or more encapsulated initiator particles to initiate polymerization of the curable composition.

15. The method of claim 14 , wherein the step of rupturing the one or more encapsulated initiator particles comprises the application of thermal shock or about 5 psi, or more, of mechanical force to the polymerizable system.

16. The method of claim 14 , wherein the encapsulated initiator particles are mononuclear or polynuclear encapsulated initiator particles.

17. The method of claim 14 , wherein the one or more 1,1-disubstituted alkene compounds of the curable composition and the one or more 1,1-disubstituted alkene compounds of the cured composition are each selected from the group consisting of methylene malonates, methylene β-ketoesters, methylene β-diketones, dialkyl disubstituted vinyls, dihaloalkyl disubstituted vinyls, monofunctional, difunctional, or multifunctional monomers, oligomers, or polymers thereof, and combinations thereof.

18. The method of claim 14 , wherein the one or more 1,1-disubstituted alkene compounds of the curable composition and the one or more 1,1-disubstituted alkene compounds of the cured composition are different.

19. The method of claim 14 , wherein the ratio of the cured composition to the one or more polymerization initiators is a ratio of about 1:1 to about 2:1.

20. The method of claim 14 , wherein the polymerizable system further comprises one or more of a plasticizer, a stabilizer, a thickening agent, and a thixotropic agent.

Assignees

• Sirrus Inc

Inventors

• Stevenson Peter Rulon
• Palsule Aniruddha Sudhir
• Sullivan Jeffrey M

Classifications

• C08K7/20

  Glass · CPC title

• C08F4/00

  Polymerisation catalysts · CPC title

• B01J13/185 Primary

  in an organic phase · CPC title

• C08K9/10

  Encapsulated ingredients · CPC title

• C08K3/34

  Silicon-containing compounds · CPC title