Formation of voids within components formed from porous substrates

US10087110B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10087110-B2
Application numberUS-201715490306-A
CountryUS
Kind codeB2
Filing dateApr 18, 2017
Priority dateApr 8, 2014
Publication dateOct 2, 2018
Grant dateOct 2, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of creating a component comprises forming a substrate and depositing a template material within the substrate, such that there are a plurality of template member. The component is heated to a temperature above a melting point of the template material, such that the template material wicks into a porosity of the substrate and forms a component with voids. An average hydraulic diameter of the voids is less than 1 millimeter.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of creating a component comprising: forming a substrate and depositing a template material within said substrate, such that there are a plurality of template members; and heating said component to a temperature above a melting point of said template material, such that said template material wicks into a porosity of said substrate and forms a component with voids, wherein an average hydraulic diameter of said voids is less than 1 millimeter, and wherein a shell of silicon is formed around said voids to insulate, at least in part, the substrate material. 2. The method as set forth in claim 1 , wherein said template material is silicon. 3. The method as set forth in claim 1 , wherein said component is for use in a gas turbine engine. 4. The method as set forth in claim 1 , wherein the average hydraulic diameter of said voids is less than 100 microns. 5. The method as set forth in claim 4 , wherein said average hydraulic diameter is greater than or equal to about 10 and less than or equal to about 20 microns. 6. The method as set forth in claim 1 , wherein said substrate material initially includes graphite and said template material is silicon, such that said component includes a silicon carbide matrix. 7. The method as set forth in claim 1 , wherein said substrate material initially includes a carbon rich polymer derived ceramic matrix and said template material is silicon, such that said component includes a silicon carbide matrix. 8. The method as set forth in claim 7 , wherein said substrate material is further provided with metallic particles, selected from the group of molybdenum, titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, hafnium, tantalum, tungsten, platinum, yttrium and boron, such that said component also includes corresponding metal silicide regions. 9. The method as set forth in claim 1 , wherein said voids are utilized to receive a material subsequent to the formation of the voids. 10. The method as set forth in claim 9 , wherein said voids are filled subsequent to being utilized to receive a material. 11. The method as set forth in claim 1 , wherein said template material is one of fibers, particles, thin films, or sheets. 12. The method as set forth in claim 1 , wherein said substrate material initially includes at least one of amorphous carbon, glassy carbon, carbonaceous material, activated carbon, turbostratic carbon, and mixtures thereof, and said template material is silicon, such that said component includes a silicon carbide matrix. 13. The method as set forth in claim 1 , wherein said substrate material is in the form of fibers and said template material in the form of particles, and wherein said voids have an elongated morphology. 14. The method as set forth in claim 1 , further comprising the step of processing said substrate after the forming step and before the heating step, and wherein said substrate reaches a predetermined porosity level during the processing step. 15. The method as set forth in claim 14 , wherein the processing step occurs at a temperature below said melting point of said template material. 16. The method as set forth in claim 14 , wherein the processing step includes at least one of polymer infiltration, pyrolysis, and casting. 17. The method as set forth in claim 2 , wherein said template material is in the form of particles, fibers, whiskers, or sheets prior to the heating step. 18. The method at set forth in claim 3 , wherein said component is a blade. 19. The method as set forth in claim 18 , wherein said voids are cooling channels in said blade.

Assignees

Inventors

Classifications

  • obtained by reaction sintering {or recrystallisation} · CPC title

  • Boron · CPC title

  • for manufacturing refractories (C04B35/05, C04B35/107, C04B35/484 take precedence) · CPC title

  • Graphite · CPC title

  • by melting out · CPC title

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What does patent US10087110B2 cover?
A method of creating a component comprises forming a substrate and depositing a template material within the substrate, such that there are a plurality of template member. The component is heated to a temperature above a melting point of the template material, such that the template material wicks into a porosity of the substrate and forms a component with voids. An average hydraulic diameter o…
Who is the assignee on this patent?
United Technologies Corp
What technology area does this patent fall under?
Primary CPC classification C04B38/0087. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 02 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).