Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device

Patent metadata

Field	Value
Publication number	US-9079220-B2
Application number	US-201313804872-A
Country	US
Kind code	B2
Filing date	Mar 14, 2013
Priority date	Mar 30, 2012
Publication date	Jul 14, 2015
Grant date	Jul 14, 2015

Abstract

An ultrasonic transducer element chip includes a substrate, a plurality of ultrasonic transducer elements, a reinforcing member and a ventilation passage. The substrate defines a plurality of openings arranged in an array pattern. The ultrasonic transducer elements are respectively disposed at the openings on a first surface of the substrate. The reinforcing member is fixed on a second surface of the substrate opposite to the first surface of the substrate to reinforce the substrate. Through the ventilation passage, internal spaces of the openings and an external space of the substrate are in communication with each other.

First claim

What is claimed is:

1. An ultrasonic transducer element chip comprising:
a substrate defining a plurality of openings arranged in an array pattern;
a plurality of ultrasonic transducer elements respectively disposed at the openings on a first surface of the substrate;
a reinforcing member fixed on a second surface of the substrate opposite to the first surface of the substrate to reinforce the substrate; and
a ventilation passage through which internal spaces of the openings and an external space of the substrate are in communication with each other.

2. The ultrasonic transducer element chip according to claim 1 , wherein
the reinforcing member is bonded to a partition wall section of the substrate between the openings in at least one bonding region.

3. The ultrasonic transducer element chip according to claim 1 , wherein
the reinforcing member includes a first surface overlaid on the second surface of the substrate, and the ventilation passage includes a plurality of groove parts formed on the first surface of the reinforcing member.

4. The ultrasonic transducer element chip according to claim 1 , wherein
the ventilation passage includes a plurality of groove parts formed on the second surface of the substrate.

5. The ultrasonic transducer element chip according to claim 1 , wherein
at least a portion of one of the substrate and the reinforcing member is made of a porous material, and
the ventilation passage includes a plurality of pores of the porous material.

6. A probe comprising:
the ultrasonic transducer element chip according to claim 1 ; and
a case member supporting the ultrasonic transducer element chip.

7. An electronic instrument comprising:
the probe according to claim 6 ; and
a processing circuit connected to the probe, and configured to process output signals of the ultrasonic transducer elements.

8. An ultrasonic diagnostic device comprising:
the probe according to claim 6 ;
a processing circuit connected to the probe, and configured to process output signals of the ultrasonic transducer elements to generate an image; and
a display device configured to display the image.

9. A probe head comprising:
the ultrasonic transducer element chip according to claim 1 ; and
a case member supporting the ultrasonic transducer element chip, and configured to be coupled to a probe main body of a probe.

Assignees

• Seiko Epson Corp

Inventors

• Nakamura Tomoaki
• Tsuruno Jiro
• Kiyose Kanechika

Classifications

• G03B42/06

  using ultrasonic, sonic or infrasonic waves · CPC title

• B06B1/0622 Primary

  on one surface · CPC title

• A61B8/4444

  related to the probe · CPC title

• A61B8/4494 Primary

  characterised by the arrangement of the transducer elements · CPC title

• A61B8/5207

  involving processing of raw data to produce diagnostic data, e.g. for generating an image · CPC title