Glass enclosures for electronic devices

US10085357B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10085357-B2
Application numberUS-201615365328-A
CountryUS
Kind codeB2
Filing dateNov 30, 2016
Priority dateJan 26, 2016
Publication dateSep 25, 2018
Grant dateSep 25, 2018

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The disclosed embodiments include enclosures for electronic devices formed from RF-transparent, toughened glass materials, such as chemically hardened alkali-aluminosilicate glass. For example, according to the disclosed embodiments, an enclosure for an electronic device may be formed from a plurality of enclosure components joined together along corresponding interfaces to establish an enclosure structure, or alternatively, may be formed from a single enclosure component. In some aspects, the enclosure structure may have corresponding first and second ends, the enclosure structure may have corresponding first and second surfaces, and the second surface may be exposed to an environment. The enclosure may also include first and second cap components disposed at corresponding ones of the first and second ends.

First claim

Opening claim text (preview).

What is claimed is: 1. An enclosure for an electronic device, comprising: an enclosure structure that has a first end, a second end, an outer surface, and an inner surface that encloses an inner region of the enclosure structure, the enclosure structure comprising a plurality of components that include: (i) a first elongated enclosure plate formed of glass that is electromagnetically transparent to radio-frequency (RF) signals, (ii) a second elongated enclosure plate formed of glass that is electromagnetically transparent to RF signals, (iii) a first elongated support member formed of glass that is electromagnetically transparent to RF signals, the first elongated support member being joined to the first elongated enclosure plate at a first interface and being joined to the second elongated enclosure plate at a second interface, and (iv) a second elongated support member formed of glass that is electromagnetically transparent to RF signals, the second elongated support member being joined to the first elongated enclosure plate at a third interface and being joined to the second elongated enclosure plate at a fourth interface, wherein the first elongated enclosure plate, the second elongated enclosure plate, the first elongated support member, and the second elongated support member define the inner surface of the enclosure structure that forms the inner region of the enclosure structure; and a first cap component disposed at the first end. 2. The enclosure of claim 1 , further comprising the electronic device, the electronic device being disposed within the inner region. 3. The enclosure of claim 1 , wherein each of the first elongated enclosure plate, the second elongated enclosure plate, the first elongated support member, and the second elongated support member comprises a chemically hardened alkali-aluminosilicate glass. 4. The enclosure of claim 3 , wherein the chemically hardened alkali-aluminosilicate glass is doped with at least one colored pigment. 5. The enclosure of claim 1 , wherein the first elongated enclosure plate, the second elongated enclosure plate, the first elongated support member, and the second elongated support member are joined together using at least one of a welding process that applies heat to the corresponding interfaces, an ultrasonic welding process, or an application of an adhesive to the interfaces. 6. The enclosure of claim 1 , wherein a cross-sectional shape of the enclosure structure comprises an ellipsoid. 7. The enclosure of claim 1 , wherein a cross-sectional shape of the enclosure structure comprises a regular or irregular polygon. 8. The enclosure of claim 1 , wherein at least one of an anti-reflective coating, an oleophobic coating, or a scratch-resistance coating is applied to the outer surface. 9. The enclosure of claim 1 , wherein: the first elongated support member comprises a single piece of electromagnetically transparent glass that joins to the first elongated enclosure plate at the first interface and that joins to the second elongated enclosure plate at the second interface; and the second elongated support member comprises a single piece of electromagnetically transparent glass that joins to the first elongated enclosure plate at the third interface and that joins to the second elongated enclosure plate at the fourth interface. 10. The enclosure of claim 1 , further comprising a second cap component disposed at the second end. 11. The enclosure of claim 10 , wherein: the first cap component is formed from a metallic and/or plastic material; and the second cap component is formed from a metallic and/or plastic material. 12. The enclosure of claim 10 , wherein: the first cap component is mechanically affixed to the first end of the enclosure structure with glue; and the second cap component is mechanically affixed to the second end of the enclosure structure with glue. 13. The enclosure of claim 10 , wherein the first and second cap components isolate the inner region from an environment to which the outer surface is exposed. 14. The enclosure of claim 1 , wherein the inner surface of the enclosure structure closely confines the electronic device within the inner region of the enclosure structure.

Assignees

Inventors

Classifications

  • Mechanical details of casings (covers, lids, hoods or members for covering apertures H05K5/03) · CPC title

  • H05K5/0243Primary

    for decorative purposes · CPC title

  • with the aid of adhesive specially adapted for that purpose · CPC title

  • Uniting glass pieces by fusing without substantial reshaping · CPC title

  • Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing (C03C17/00 takes precedence; layered structures comprising at least one glass sheet B32B17/00; wired glass C03B; joining glass to ceramics C04) · CPC title

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What does patent US10085357B2 cover?
The disclosed embodiments include enclosures for electronic devices formed from RF-transparent, toughened glass materials, such as chemically hardened alkali-aluminosilicate glass. For example, according to the disclosed embodiments, an enclosure for an electronic device may be formed from a plurality of enclosure components joined together along corresponding interfaces to establish an enclosu…
Who is the assignee on this patent?
Google Llc
What technology area does this patent fall under?
Primary CPC classification H05K5/0243. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 25 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).