Probe card, thermal insulation cover assembly for probe card, and semiconductor device test apparatus including the same

Patent metadata

Field	Value
Publication number	US-10082536-B2
Application number	US-201615145153-A
Country	US
Kind code	B2
Filing date	May 3, 2016
Priority date	Jul 7, 2015
Publication date	Sep 25, 2018
Grant date	Sep 25, 2018

Abstract

A probe card includes a circuit substrate to transmit an electrical signal for testing a semiconductor device, a probe block on a lower surface of the circuit substrate, the probe block having a plurality of probes, and a thermal insulation cover assembly on an upper surface of the circuit substrate, the thermal insulation cover assembly covering at least a portion of the circuit substrate and defining a heat receiving space, the thermal insulation cover assembly retaining heat applied to the circuit substrate within the heat receiving space.

First claim

What is claimed is:

1. A probe card, comprising:
a circuit substrate to transmit an electrical signal for testing a semiconductor device;
a probe block on a lower surface of the circuit substrate, the probe block having a plurality of probes; and
a thermal insulation cover assembly on an upper surface of the circuit substrate, the thermal insulation cover assembly covering at least a portion of the circuit substrate and defining a heat receiving space, the thermal insulation cover assembly retaining heat applied to the circuit substrate within the heat receiving space,
wherein the heat receiving space is an empty space enclosed between the upper surface of the circuit substrate and an interior surface of the thermal insulation cover that faces the upper surface of the circuit substrate, and
wherein the thermal insulation cover assembly includes:
an inner cover having a dome shape to cover at least the portion of the upper surface of the circuit substrate, the inner cover being the interior surface of the thermal insulation cover that faces the upper surface of the circuit substrate,
an outer cover spaced apart from the inner cover, a thermal insulating space being defined between the inner and outer covers, and
a flange fixing a lower portion of the inner cover and a lower portion of the outer cover to the upper surface of the circuit substrate, the flange including a plurality of recesses in a lower surface of the flange, and the plurality of recesses being in fluid communication with the heat receiving space.

2. The probe card as claimed in claim 1 , further comprising a connection portion connecting a lower portion of the inner cover and a lower portion of the outer cover to each other.

3. The probe card as claimed in claim 1 , wherein the thermal insulation cover assembly further comprises:
a first adiabatic layer on an outer surface of the outer cover; and
a second adiabatic layer on an inner surface of the inner cover.

4. The probe card as claimed in claim 1 , wherein the thermal insulation cover assembly further comprises an insulating material between the inner cover and the outer cover.

5. The probe card as claimed in claim 1 , wherein the thermal insulation cover assembly is detachably mounted on the upper surface of the circuit substrate.

6. A thermal insulation cover assembly for a probe card, the thermal insulation cover assembly comprising:
a non-flat thermal insulation cover covering at least a portion of an upper surface of a circuit substrate of a probe card to define a heat receiving space; and
a flange fixing the thermal insulation cover to the upper surface of the circuit substrate,
wherein the flange includes a plurality of recesses in a lower surface of the flange, the plurality of recesses extending in a radial direction of the flange, and being in fluid communication with the heat receiving space, and
wherein the plurality of recesses are spaced apart from each other in a circumferential direction of the flange.

7. The thermal insulation cover assembly as claimed in claim 6 , wherein the thermal insulation cover includes:
an inner cover having a dome shape; and
an outer cover spaced apart from the inner cover to define a thermal insulating space.

8. The thermal insulation cover assembly as claimed in claim 7 , further comprising:
a first adiabatic layer on an outer surface of the outer cover; and
a second adiabatic layer on an inner surface of the inner cover.

9. The thermal insulation cover assembly as claimed in claim 7 , further comprising an insulating material between the inner cover and the outer cover, the insulating material includes a silica fiber.

10. The thermal insulation cover assembly as claimed in claim 6 , wherein each recess of the plurality of recesses extends from an inner side of the flange to an outer side of the flange.

11. The thermal insulation cover assembly as claimed in claim 6 , wherein the flange includes an insulation material.

12. A probe card, comprising:
a circuit substrate to transmit an electrical signal for testing a semiconductor device;
a probe block on a lower surface of the circuit substrate, the probe block having a plurality of probes;
a thermal insulation cover assembly on an upper surface of the circuit substrate, the thermal insulation cover assembly defining an empty space between an interior of the thermal insulation cover assembly and the upper surface of the circuit substrate, and the empty space overlapping the probe block; and
a flange between the thermal insulation cover assembly and the upper surface of the circuit substrate, the flange having a ring shape overlapping a bottom of the thermal insulation cover assembly and connecting the bottom of the thermal insulation cover assembly to the upper surface of the circuit substrate,
wherein the thermal insulation cover assembly has a closed dome shape defining the empty space above the upper surface of the circuit substrate, the empty space overlapping the entire probe block.

13. The probe card as claimed in claim 12 , wherein the thermal insulation cover assembly includes dome-shaped inner and outer covers spaced apart from each other, a thermal insulating space being defined between the inner and outer covers.

14. The probe card as claimed in claim 12 , wherein the flange includes a plurality of recesses in a lower surface of the flange, each of the plurality of recesses being in fluid communication with the empty space inside the thermal insulation cover assembly and with an exterior of the thermal insulation cover assembly.

15. The probe card as claimed in claim 6 , wherein a portion of the thermal insulation cover extends away from the upper surface of the circuit substrate, the heat receiving space being an empty space enclosed between the upper surface of the circuit substrate and the portion of the thermal insulation cover.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Na Young-Mi
• Kim Min-Gu

Classifications

• G01R31/2862 Primary

  Chambers or ovens; Tanks · CPC title

• G01R31/2875

  related to heating · CPC title

• G01R31/2863

  Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title

• G01R31/2601

  Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence) · CPC title

• G01R1/073 Primary

  Multiple probes · CPC title