Peeling Method and Method of Manufacturing Semiconductor Device
US-2016248013-A1 · Aug 25, 2016 · US
US10082265B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10082265-B2 |
| Application number | US-201715424038-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 3, 2017 |
| Priority date | Feb 4, 2016 |
| Publication date | Sep 25, 2018 |
| Grant date | Sep 25, 2018 |
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Official abstract text for this publication.
An illumination and/or signaling device for an automotive vehicle includes a dielectric substrate including a plurality of conductive tracks, and a plurality of light-emitting diodes surface-mounted on the dielectric substrate. The light emitting diodes are electrically connected to the conductive tracks of the dielectric substrate according to a predetermined connection plan. At least one control circuit board for controlling the light-emitting diodes includes a plurality of connecting pins and an electrical connection circuit board including a plurality of conductive lines for electrically connecting the connecting pins of the control circuit board to the conductive tracks of the dielectric substrate according to a predetermined connection plan. The electrical connection circuit board is connected to the conductive tracks of the dielectric substrate via an anisotropic conductive film.
Opening claim text (preview).
The invention claimed is: 1. Lighting device for an automotive vehicle, in particular for illumination and/or signaling, comprising: a dielectric substrate comprising a plurality of conductive tracks; a plurality of light-emitting diodes surface-mounted on said dielectric substrate, the light-emitting diodes being electrically connected to the conductive tracks of the dielectric substrate according to a predetermined connection plan; at least one control circuit board for controlling the light-emitting diodes, said control circuit board comprising a plurality of connecting pins; and an electrical connection circuit board comprising a plurality of conductive lines for electrically connecting the connecting pins of the control circuit board to the conductive tracks of the dielectric substrate according to a predetermined connection plan, wherein the electrical connection circuit board is connected to the conductive tracks of the dielectric substrate via an anisotropic conductive film. 2. Lighting device according to claim 1 , wherein the anisotropic conductive film comprises a plurality of electrical conduction pathways, the pitch between two adjacent conduction pathways being between 0.035 and 0.200 mm. 3. Lighting device according to claim 1 , wherein the electrical connection circuit board is a flexible integrated circuit. 4. Lighting device according to claim 1 , wherein the dielectric substrate is mounted on a heat dissipation circuit board. 5. Lighting device according to claim 1 , wherein dielectric substrate is made of a ceramic material. 6. Lighting device according to claim 5 , wherein the dielectric substrate comprises aluminum nitride. 7. Lighting device according to claim 1 , wherein the anisotropic conductive film comprises a layer of adhesive material and conductive balls, which conductive balls are agglomerated together in said layer of adhesive material so as to form said conduction pathways. 8. Lighting device according to claim 7 , wherein the conductive balls are plastic balls covered with nickel, gold or a mixture of gold and nickel.
arranged in a matrix · CPC title
for land vehicles · CPC title
Light emitting diodes [LED] · CPC title
associated with surface mounted components · CPC title
Cooling of mounted components (H05K1/0272 takes precedence) · CPC title
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