Electronic display assembly having thermal cooling plate and optional convective air cooling loop

Patent metadata

Field	Value
Publication number	US-10080316-B2
Application number	US-201615095880-A
Country	US
Kind code	B2
Filing date	Apr 11, 2016
Priority date	Nov 13, 2009
Publication date	Sep 18, 2018
Grant date	Sep 18, 2018

Abstract

Disclosed herein is an electronic display assembly including a backlight that is positioned to illuminate a liquid crystal display, and a novel cooling mechanism in the form of a thermal plate that is located and configured to transfer heat from the backlight to a thermally conductive housing of the electronic display assembly. The thermal plate is preferably placed in conductive thermal communication with the backlight and with the thermally conductive housing for this purpose. One or more air flow apertures may pass through the thermal plate. A convective cooling loop may also be provided, which cooling loop may include a fan that is located to move cooling air over the thermal plate and/or though one or more apertures in the thermal plate. Both a top and bottom thermal plate may be employed in some exemplary embodiments.

First claim

What is claimed is:

1. An electronic display assembly comprising:
a thermally conductive housing;
a liquid crystal display positioned within the thermally conductive housing;
a backlight positioned to illuminate the liquid crystal display;
a thermal plate in conductive thermal communication with the backlight and with the thermally conductive housing; and
one or more air flow apertures that pass through the thermal plate.

2. The electronic display assembly of claim 1 wherein:
the thermal plate is positioned between an edge of the liquid crystal display and the housing.

3. The electronic display assembly of claim 1 wherein:
the backlight is a LED backlight.

4. The electronic display assembly of claim 1 further comprising:
a fan located within the thermally conductive housing and configured to cause a flow of cooling air through the one or more apertures in the thermal plate.

5. The electronic display assembly of claim 4 wherein:
the one or more apertures are oriented horizontally relative to the ground when the electronic display is in a typical viewing orientation, while the flow path of the cooling air extends vertically through the one or more apertures.

6. The electronic display assembly of claim 1 wherein:
the thermal plate is located and configured to transfer heat from the backlight to the thermally conductive housing.

7. The electronic display assembly of claim 4 wherein:
the thermal plate is located and configured to accept heat from the backlight, and is positioned for convective removal of said heat by the flow of cooling air.

8. The electronic display assembly of claim 1 wherein:
the thermal plate and housing are metallic.

9. An electronic display assembly comprising:
a thermally conductive housing having a front portion which faces an intended observer;
a liquid crystal display positioned within the thermally conductive housing;
a backlight positioned behind the liquid crystal display;
a thermal plate in contact with the backlight and with the thermally conductive housing; and
one or more air flow apertures that pass through the thermal plate.

10. The electronic display assembly of claim 9 wherein:
the thermal plate is located and configured to absorb heat from the backlight and to transfer the heat forwardly towards the front portion of the thermally conductive housing.

11. The electronic display assembly of claim 9 wherein:
the thermal plate contains a portion which is oriented substantially horizontally, and is positioned above both the backlight and the liquid crystal display.

12. The electronic display assembly of claim 9 wherein:
the backlight is a LED backlight.

13. The electronic display assembly of claim 9 wherein:
the thermal plate is positioned in a cooling air path that travels over and through the thermal plate.

14. The electronic display assembly of claim 13 further comprising:
a fan located within the thermally conductive housing and configured to cause cooling air to flow within the cooling air path.

15. The electronic display assembly of claim 13 wherein:
the cooling air path travels through the apertures within the plate.

16. An electronic display assembly comprising:
a thermally conductive housing;
a liquid crystal display positioned within the thermally conductive housing;
a backlight having a top portion and a bottom portion and positioned to backlight the liquid crystal display;
a top thermal plate contacting the top portion of the backlight; and
a bottom thermal plate contacting the bottom portion of the backlight;
wherein the top thermal plate and the bottom thermal plate are located and configured to transfer heat from the backlight to the thermally conductive housing.

17. The electronic display assembly of claim 16 further comprising:
one or more fans located within the thermally conductive housing and configured to cause a flow of cooling air that will pass through one or more apertures in the top thermal plate and the bottom thermal plate.

18. The electronic display assembly of claim 17 further comprising:
a vertically oriented channel through the housing, the channel forming a cooling air pathway between the thermal plates.

19. The electronic display assembly of claim 16 wherein:
the top thermal plate spans across the backlight and the liquid crystal display and is located above the backlight and the liquid crystal display; and
the bottom thermal plate spans across the backlight and the liquid crystal display and is located below the backlight and the liquid crystal display.

20. The electronic display assembly of claim 16 further comprising:
one or more apertures passing through the top thermal plate;
one or more apertures passing through the bottom thermal plate; and
a fan located within the thermally conductive housing and configured to cause a flow of cooling air to pass through the aperture(s) in the top thermal plate and the aperture(s) in the bottom thermal plate.

Assignees

• Mri Inc

Inventors

• Dunn William
• Le Don
• Bedell Ware

Classifications

• G02F1/133382 Primary

  Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell · CPC title

• G02F2201/36

  Airflow channels, e.g. constructional arrangements facilitating the flow of air · CPC title

• G02F1/133615

  Edge-illuminating devices, i.e. illuminating from the side · CPC title

• G02F2001/133342

  Physics · mapped topic

• H05K7/20963

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20972 takes precedence) · CPC title