Thermal plate with optional cooling loop in electronic display

Patent metadata

Field	Value
Publication number	US-9313917-B2
Application number	US-201313954469-A
Country	US
Kind code	B2
Filing date	Jul 30, 2013
Priority date	Nov 13, 2009
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

Disclosed is a thermal plate assembly and method for cooling an electronic display. The thermal plate may contain a first portion which is in thermal communication with the electronic display. A second portion of the thermal plate may be in thermal communication with the housing. Apertures may be placed within the plate and a fan may be positioned to draw air through the apertures. A gap may be located between the electronic display and a transparent plate assembly, where the fan may be further positioned to force air through the gap as well.

First claim

What is claimed is:

1. A thermal plate for use with an electronic display placed within a thermally-conductive housing, the thermal plate comprising:
a first portion which is in conductive thermal communication with the electronic display; and
a second portion extending from the first portion and placed within conductive thermal communication with the housing.

2. The thermal plate of claim 1 wherein:
the first and second portions form an ‘L’ shape.

3. The thermal plate of claim 1 wherein:
the first portion of the thermal plate is in conductive thermal communication with a backlight assembly of the electronic display.

4. The thermal plate of claim 1 further comprising:
a plurality of apertures within the first portion which permit air to flow through the thermal plate.

5. The thermal plate of claim 4 wherein:
the apertures are slots.

6. The thermal plate of claim 5 wherein:
the slots are oriented parallel to the path of the air.

7. The thermal plate of claim 1 wherein:
the first and second portions are comprised of metal.

8. The thermal plate of claim 1 wherein:
the plate is positioned along an edge of the electronic display.

9. The thermal plate of claim 1 wherein:
the first portion of the thermal plate is in conductive thermal communication with an edge-lit LED backlight assembly of the electronic display.

10. A method for using a thermal plate to cool an electronic display within a thermally-conductive housing and having a transparent plate assembly positioned in front of the electronic display, the method comprising:
presenting a thermal plate comprising a first portion which is in conductive thermal communication with the electronic display, and a second portion extending from the first portion and placed within conductive thermal communication with the housing;
allowing heat to transfer from the electronic display to the first portion;
allowing heat to transfer from the first portion to the second portion; and
allowing heat to transfer from the second portion to the housing.

11. The thermal plate cooling method of claim 10 further comprising the steps of:
presenting a plurality of apertures within the thermal plate; and
forcing air through the apertures.

12. The thermal plate cooling method of claim 10 further comprising the steps of:
presenting a fan which draws air across the thermal plate and between the electronic display and the transparent plate assembly.

13. The thermal plate cooling method of claim 10 further comprising the steps of:
forcing air across the thermal plate and between the electronic display and the transparent plate assembly.

14. The thermal plate cooling method of claim 10 further comprising the steps of:
presenting a plurality of apertures within the thermal plate; and
forcing air through the apertures and between the electronic display and the transparent plate assembly.

15. A thermal plate assembly for use with first and second electronic displays placed back-to-back and within a thermally-conductive housing, each electronic display having an edge-lit backlight and a gap defined by the space between the electronic display and a transparent plate assembly, the thermal plate assembly comprising:
a first thermal plate placed in conductive thermal communication with the edge-lit backlight of the first display;
a second thermal plate placed in conductive thermal communication with the edge-lit backlight of the second display; and
a fan positioned to circulate air across the first and second thermal plates as well as through the gap for the first display and the gap for the second display.

16. The thermal plate assembly of claim 15 further comprising:
a plurality of apertures within the first and second thermal plates.

17. The thermal plate assembly of claim 16 wherein:
the fan is further position to draw air through the apertures of the first and second thermal plates.

18. The thermal plate assembly of claim 15 wherein:
the first thermal plate is further placed in conductive thermal communication with the housing; and
the second thermal plate is further placed in conductive thermal communication with the housing.

19. The thermal plate assembly of claim 15 further comprising:
a separating plate within the housing which divides the housing into lower and upper portions,
wherein the fan is positioned on the separating plate.

Assignees

• Mri Inc

Inventors

• Dunn William
• Le Don
• Bedell Ware

Classifications

• F28F3/00

  Plate-like or laminated elements; Assemblies of plate-like or laminated elements (specially adapted for movement F28F5/00) · CPC title

• G02F1/133382 Primary

  Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell · CPC title

• G02F1/133385

  with cooling means, e.g. fans · CPC title

• G02F2201/36

  Airflow channels, e.g. constructional arrangements facilitating the flow of air · CPC title

• H05K7/20963

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20972 takes precedence) · CPC title