Laser processing apparatus

Patent metadata

Field	Value
Publication number	US-10076805-B2
Application number	US-201615140053-A
Country	US
Kind code	B2
Filing date	Apr 27, 2016
Priority date	Apr 27, 2015
Publication date	Sep 18, 2018
Grant date	Sep 18, 2018

Abstract

A laser beam irradiating mechanism of a laser processing apparatus includes: a pulsed laser oscillator configured to oscillate a pulsed laser beam; a condenser configured to condense the laser beam oscillated from the pulsed laser oscillator, and irradiate a workpiece held on a chuck table with the condensed laser beam; a polygon mirror disposed between the pulsed laser oscillator and the condenser, and having a plurality of mirrors arranged concentrically with respect to a rotating shaft, the plurality of mirrors dispersing the pulsed laser beam oscillated from the pulsed laser oscillator; and a guiding unit disposed between the pulsed laser oscillator and the polygon mirror, the guiding unit guiding the pulsed laser beam such that the pulsed laser beam is not applied to an angular portion of mirrors adjacent to each other.

First claim

What is claimed is:

1. A laser processing apparatus comprising:
a chuck table configured to hold a workpiece; and
a laser beam irradiating mechanism configured to perform laser processing on a workpiece held by the chuck table;
the laser beam irradiating mechanism including
a pulsed laser oscillator configured to oscillate a pulsed laser beam,
a condenser configured to condense the laser beam oscillated from the pulsed laser oscillator, and irradiate the workpiece held on the chuck table with the condensed laser beam,
a polygon mirror disposed between the pulsed laser oscillator and the condenser, and having a plurality of mirrors arranged concentrically with respect to a rotating shaft, the plurality of mirrors dispersing the pulsed laser beam oscillated from the pulsed laser oscillator, and
guiding means disposed between the pulsed laser oscillator and the polygon mirror, the guiding means guiding the pulsed laser beam such that the pulsed laser beam is not applied to an angular portion of mirrors adjacent to each other.

2. The laser processing apparatus according to claim 1 , wherein
the guiding means includes
an optical switching element configured to selectively guide the pulsed laser beam oscillated from the pulsed laser oscillator to a first path and a second path,
a polarization beam splitter configured to guide the pulsed laser beams guided to the first path and the second path to a third path in which the polygon mirror is disposed,
rotation position detecting means for detecting a rotation position of the polygon mirror, and
control means for controlling the optical switching element on a basis of a detection signal from the rotation position detecting means such that the pulsed laser beams are not applied to an angular portion of adjacent mirrors of the polygon mirror, and
the first path and the second path are positioned such that the polarization beam splitter branches the pulsed laser beam guided to the first path and the pulsed laser beam guided to the second path with a predetermined interval between the pulsed laser beam guided to the first path and the pulsed laser beam guided to the second path.

Assignees

• Disco Corp

Inventors

• Nayuki Masatoshi

Classifications

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P72/50

  for positioning, orientation or alignment · CPC title

• B23K26/067

  Dividing the beam into multiple beams, e.g. multi-focusing · CPC title

• B23K26/0821

  using multifaceted mirrors, e.g. polygonal mirror · CPC title