Differential interconnect with first and second transmission traces having a bend and including stub traces connected to the transmission traces

Patent metadata

Field	Value
Publication number	US-10076024-B2
Application number	US-201615195090-A
Country	US
Kind code	B2
Filing date	Jun 28, 2016
Priority date	Mar 27, 2014
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

This disclosure relates generally to an electronic assembly and method having a first electrical connection point and a second electrical connection point and a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including first and second transmission traces including a interior edges and a exterior edges opposite the interior edges, the second interior edge facing the first interior edge, and stub traces, each stub trace coupled to one of the first and second transmission traces and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge. A substantially equal number of stub traces project from the first exterior edge and the second exterior edge. At least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges.

First claim

What is claimed is:

1. An electronic assembly, comprising:
a first electrical connection point and a second electrical connection point; and
a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including:
a first transmission trace including a first interior edge and a first exterior edge opposite the first interior edge;
a second transmission trace substantially parallel with the first transmission trace and including a second interior edge and a second exterior edge opposite the second interior edge, the second interior edge facing the first interior edge; and
stub traces, individual stub traces coupled to one of the first transmission trace and the second transmission trace and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge, wherein a substantially equal number of stub traces project from the first exterior edge and the second exterior edge, and wherein at least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges;
wherein the differential interconnect forms a bend between the first and second electrical connection points, wherein a gap between adjacent stub traces proximate the bend is greater than a gap between adjacent stub traces not proximate the bend.

2. The electronic assembly of claim 1 , wherein the stub traces extend only from the first and second exterior edges.

3. The electronic assembly of claim 1 , wherein the stub traces extend substantially orthogonal to the first and second transmission traces.

4. The electronic assembly of claim 1 , wherein each of the stub traces have a substantially equal length.

5. The electronic assembly of claim 1 , wherein the stub traces form a substantially symmetric pattern between the first transmission trace and the second transmission trace.

6. The electronic assembly of claim 1 , wherein the differential interconnect is a first differential interconnect and further comprising a second differential interconnect substantially parallel, at least in part, with the first differential interconnect, wherein stub traces of the second differential interconnect are interleaved with the stub traces of the first differential interconnect.

7. The electronic assembly of claim 6 , wherein one of the stub traces of the second differential interconnect is approximately equidistant between adjacent ones of the stub traces of the first differential interconnect.

8. The electronic assembly of claim 7 , wherein the stub traces have a stub trace width, and wherein a lateral distance between the one of the stub traces of the second differential interconnect and the adjacent ones of the stub traces of the first differential interconnect is approximately four times greater than the stub trace width.

9. The electronic assembly of claim 1 , wherein the first and second transmission traces have a trace separation distance between the first and second transmission traces and wherein the stub traces have a stub trace length, wherein the trace separation distance is less than the stub trace length.

10. The electronic assembly of claim 1 , wherein the first and second transmission traces have a trace width and the stub traces have a stub trace width, the stub trace width approximately sixty percent the trace width.

11. A method of making a microelectronic assembly, comprising:
forming a first electrical connection point and a second electrical connection point; and
forming a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including:
a first transmission trace including a first interior edge and a first exterior edge opposite the first interior edge;
a second transmission trace substantially parallel with the first transmission trace and including a second interior edge and a second exterior edge opposite the second interior edge, the second interior edge facing the first interior edge; and
stub traces, individual stub traces coupled to one of the first transmission trace and the second transmission trace and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge,
wherein a substantially equal number of stub traces project from the first exterior edge and the second exterior edge, and wherein at least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges;
wherein the differential interconnect forms a bend between the first and second electrical connection points, wherein a gap between adjacent stub traces proximate the bend is greater than a gap between adjacent stub traces not proximate the bend.

12. The method of claim 11 , wherein forming the differential interconnect includes extending the stub traces only from the first and second exterior edges.

13. The method of claim 11 , wherein the stub traces extend substantially orthogonal to the first and second transmission traces.

14. The method of claim 11 , wherein forming the interconnect includes forming the stub traces so that each of the stub traces have a substantially equal length.

15. The method of claim 11 , wherein forming the interconnect includes forming the stub traces so that the stub traces form a substantially symmetric pattern between the first transmission trace and the second transmission trace.

16. The method of claim 11 , wherein the differential interconnect is a first differential interconnect and further comprising forming a second differential interconnect substantially parallel, at least in part, with the first differential interconnect, wherein stub traces of the second differential interconnect are interleaved with the stub traces of the first differential interconnect.

17. The method of claim 16 , wherein forming the first and second interconnects includes forming the stub traces so that one of the stub traces of the second differential interconnect is approximately equidistant between adjacent ones of the stub traces of the first differential interconnect.

18. The method of claim 17 , wherein the stub traces have a stub trace width, and wherein a lateral distance between the one of the stub traces of the second differential interconnect and the adjacent ones of the stub traces of the first differential interconnect is approximately four times greater than the stub trace width.

19. The method of claim 11 , wherein the first and second transmission traces have a trace separation distance between the first and second transmission traces and wherein the stub traces have a stub trace length, wherein the trace separation distance is less than the stub trace length.

20. The method of claim 11 , wherein the first and second transmission traces have a trace width and the stub traces have a stub trace width, the stub trace width approximately sixty percent the trace width.

Assignees

• Intel Corp

Inventors

• Ding Ruihua
• Wang Min
• Liu Mo

Classifications

• H05K1/0216

  Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

• H01P3/08

  Microstrips; Strip lines · CPC title

• H05K1/0245 Primary

  Lay-out of balanced signal pairs, e.g. differential lines or twisted lines · CPC title

• H05K1/0228

  Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245) · CPC title

• H01P11/003

  Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines · CPC title