Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages

US10076023B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10076023-B2
Application numberUS-201615282882-A
CountryUS
Kind codeB2
Filing dateSep 30, 2016
Priority dateSep 30, 2016
Publication dateSep 11, 2018
Grant dateSep 11, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A compartment EMI shield for use inside of a system module package is provided that comprises at least a first set of electrically-conductive wires that surrounds and extends over circuitry of the module package. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the compartment EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire that is located in between the first and second ends of the respective wire extends above the circuitry and is spaced apart from the components of the circuitry so as not to be in contact with the components of the circuitry.

First claim

Opening claim text (preview).

What is claimed is: 1. A system module package comprising: a substrate; first circuitry comprising at least one electrical component mounted on a surface of the substrate; a first common electrical ground structure disposed on the surface of the substrate, the first common electrical ground structure having at least first, second, third and fourth portions; and a first compartment electromagnetic interference (EMI) shield, the compartment EMI shield surrounding the first circuitry and extending over the first circuitry, the first compartment EMI shield comprising at least a first set of electrically-conductive wires, each wire having a first length that extends over and is spaced apart from said at least one electrical component and having second and third lengths that extend from opposite ends of the respective first length and connect to the first common electrical ground structure, the first lengths being substantially parallel to one another and being substantially parallel to a plane in which the surface of the substrate lies, the first compartment EMI shield attenuating a frequency or frequency range of interest. 2. The system module package of claim 1 , wherein the second and third lengths of each wire of the first set connect to the first and second portions, respectively, of the first common electrical ground structure. 3. The system module package of claim 2 , wherein the first compartment EMI shield further comprises: first and second electrically-conductive wires that are substantially parallel to one another and extend along opposite sides of the first circuitry adjacent and parallel to the first and second portions, respectively, of the common electrical ground structure, the first and second electrically-conductive wires having first ends that are connected to the third portion of the common electrical ground structure and having second ends that are connected to the fourth portion of the common electrical ground structure. 4. The system module package of claim 3 , wherein the first and second electrically-conductive wires are perpendicular to the first lengths of the electrically-conductive wires of the first set. 5. The system module package of claim 2 , wherein the common electrical ground structure is substantially rectangular in shape, the first and second portions being substantially parallel to one another and the third and fourth portions being substantially parallel to one another and substantially perpendicular to the third and fourth portions, wherein first and second ends of the first portion are connected to first ends of the third and fourth portions, and wherein first and second ends of the second portion are connected to second ends of the third and fourth portions. 6. The system module package of claim 5 , wherein the compartment EMI shield further comprises: first and second sets of electrically-conductive wire portions, the wire portions of the first set having first and second ends that are connected to the third portion of the common electrical ground structure, the wire portions of the second set having first and second ends that are connected to the fourth portion of the common electrical ground structure, the wire portions of the first and second sets being parallel to one another and parallel to the electrically conductive wires of the first set. 7. The system module package of claim 6 , wherein the compartment EMI shield further comprises: first and second electrically-conductive wires that are substantially parallel to one another and extend along opposite sides of the first circuitry adjacent and parallel to the first and second portions, respectively, of the common electrical ground structure, the first and second electrically-conductive wires having first ends that are connected to the third portion of the common electrical ground structure and having second ends that are connected to the fourth portion of the common electrical ground structure. 8. The system module package of claim 1 , wherein the first compartment EMI shield further comprises: a second set of electrically-conductive wires, each wire of the second set having a first length that extends over and is spaced apart from said at least one electrical component and having second and third lengths that extend from opposite ends of the respective first length and connect to the first common electrical ground structure, the first lengths of the wires of the second set being substantially parallel to one another and being substantially parallel to the plane in which the surface of the substrate lies. 9. The system module package of claim 1 , wherein the second and third lengths of each wire of the second set connect to the third and fourth portions, respectively, of the first common electrical ground structure. 10. The system module package of claim 1 , wherein the first lengths of the wires of the first set are substantially perpendicular to the first lengths of the wires of the second set. 11. The system module package of claim 1 , wherein the second and third lengths of the wires of the first set are spaced apart from said at least one electrical component. 12. The system module package of claim 1 , wherein said at least one electrical component has first and second sides that are substantially parallel to one another, and wherein the wires of the first set are parallel to one another and are at an acute angle relative to the first and second sides of said at least one electrical component. 13. The system module package of claim 12 , wherein the acute angle ranges from about 30° to about 60°. 14. The system module package of claim 13 , wherein the acute angle is about 45°. 15. The system module package of claim 1 , wherein the common electrical ground structure is substantially rectangular in shape, the first and second portions being substantially parallel to one another and the third and fourth portions being substantially parallel to one another and substantially perpendicular to the third and fourth portions, wherein first and second ends of the first portion are connected to first ends of the third and fourth portions, and wherein first and second ends of the second portion are connected to second ends of the third and fourth portions, and wherein the wires of the first set are parallel to one another and are at an acute angle relative to the first and second portions of the first common electrical ground structure. 16. The system module package of claim 15 , wherein the acute angle ranges from about 30° to about 60°. 17. The system module package of claim 16 , wherein the acute angle is about 45°. 18. The system module package of claim 15 , wherein the compartment EMI shield further comprises: first and second electrically-conductive wires that are substantially parallel to one another and extend along opposite sides of the first circuitry adjacent and parallel to the first and second portions, respectively, of the common electrical ground structure, the first and second electrically-conductive wires having first ends that are connected to the third portion of the common electrical ground structure and having second ends that are connected to the fourth portion of the common electrical ground structure. 19. The system module package of claim 15 , wherein the first compartment EMI shield further comprises: a peripheral wire fence extending along at least one side of the first compartment EMI shield adjacent and parallel to one of the first, second, third and fourth portions of the common electrical ground structure, the peripheral

Assignees

Inventors

Classifications

  • Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title

  • characterised by their shape or disposition · CPC title

  • H10W42/20Primary

    protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

  • using auxiliary mounted passive components or auxiliary substances (printed passive components H05K1/16) · CPC title

  • Metal wires as connectors or conductors · CPC title

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Frequently asked questions

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What does patent US10076023B2 cover?
A compartment EMI shield for use inside of a system module package is provided that comprises at least a first set of electrically-conductive wires that surrounds and extends over circuitry of the module package. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the compartment EMI shield attenuates a frequency or frequency ran…
Who is the assignee on this patent?
Avago Technologies General Ip
What technology area does this patent fall under?
Primary CPC classification H10W42/20. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 11 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).