SiC semiconductor device
US-12080760-B2 · Sep 3, 2024 · US
US10074742B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10074742-B2 |
| Application number | US-201514961582-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 7, 2015 |
| Priority date | Feb 11, 2005 |
| Publication date | Sep 11, 2018 |
| Grant date | Sep 11, 2018 |
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Official abstract text for this publication.
A semiconductor device formed on a semiconductor substrate, comprising: an epitaxial layer overlaying the semiconductor substrate; a drain formed on back of the semiconductor substrate; a drain region that extends into the epitaxial layer; an active region; and an island region under the contact trench and disconnected from the body, the island region having an opposite polarity as the epitaxial layer. The active region comprises: a body disposed in the epitaxial layer; a source embedded in the body; a gate trench extending into the epitaxial layer; a gate disposed in the gate trench; an active region contact trench extending through the source and the body; and an active region contact electrode disposed within the active region contact trench.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device formed on a semiconductor substrate, comprising: an epitaxial layer overlaying the semiconductor substrate; a drain formed on back of the semiconductor substrate; a drain region that extends into the epitaxial layer; an active region comprising: a body disposed in the epitaxial layer; a source embedded in the body; a first gate trench extending into the epitaxial layer; a gate disposed in the first gate trench; an active…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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