Method of forming an electronic package and structure
US-9768091-B2 · Sep 19, 2017 · US
US10074619B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10074619-B2 |
| Application number | US-201314401757-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 23, 2013 |
| Priority date | May 24, 2012 |
| Publication date | Sep 11, 2018 |
| Grant date | Sep 11, 2018 |
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An optoelectronic component device includes first and second electrodes; a first optoelectronic component electrically coupled to the first and second electrodes; and a first electrically conductive section electrically coupled to the first electrode, and a second electrically conductive section electrically coupled to the second electrode; wherein the first and second electrically conductive sections are arranged electrically in parallel with the first optoelectronic component; wherein the first and second electrically conductive sections are arranged and configured relative to one another such that, beyond a response voltage applied over the first and second conductive sections, a discharge path is formed between the first and second conductive sections; and wherein the response voltage has as its value a value formed greater than the threshold voltage value of the first optoelectronic component and less than or equal to the value of the breakdown voltage of the first optoelectronic component.
Opening claim text (preview).
The invention claimed is: 1. An optoelectronic component device comprising: a first electrode and a second electrode, wherein the first electrode and the second electrode serve as electrical terminals of the optoelectronic component device; a first optoelectronic component electrically coupled to the first electrode and the second electrode; and a first electrically conductive section formed as a region of the first electrode, and a second electrically conductive section formed as a region of the second electrode; wherein the first electrically conductive section and the second electrically conductive section are arranged electrically in parallel with the first optoelectronic component; wherein the first electrically conductive section and the second electrically conductive section are arranged and configured relative to one another such that, beyond a response voltage applied over the first conductive section and the second conductive section, a spark discharge occurs between the first conductive section and the second conductive section; wherein the response voltage has as its value a value formed greater than a threshold voltage value of the first optoelectronic component and less than or equal to the value of a breakdown voltage of the first optoelectronic component; wherein the optoelectronic component is enclosed by a package; wherein the spark discharge occurs on an outer side of the package; wherein the optoelectronic component is formed on or over a lead frame, and wherein the first electrically conductive section or the second electrically conductive section is formed as part of the lead frame. 2. The optoelectronic component device as claimed in claim 1 , wherein the first electrode comprises a different material than the second electrode. 3. The optoelectronic component device as claimed in claim 1 , wherein the optoelectronic component is configured as an electromagnetic radiation-emitting component. 4. The optoelectronic component device as claimed in claim 1 , wherein the shortest distance between the first electrically conductive section and the second electrically conductive section, between which the spark discharge is formed, has a value of approximately 1 μm to approximately 10 μm. 5. The optoelectronic component device as claimed in claim 1 , wherein the optoelectronic component device is configured such that the optoelectronic component is protected against electrostatic discharges in the reverse-bias direction.
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