Cosmetic Composition Comprising a Thickening Polymer Having Hydrophobic and Hydrophilic Portions
US-2016008258-A1 · Jan 14, 2016 · US
US10072335B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10072335-B2 |
| Application number | US-201514839664-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 28, 2015 |
| Priority date | Aug 29, 2014 |
| Publication date | Sep 11, 2018 |
| Grant date | Sep 11, 2018 |
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A method of coating a metallic object with a substantially invisible protective coating, wherein the coating comprises a first layer, a second layer, and a third layer, each layer comprising a metal oxide or a nitride. The method comprises placing the object in an atomic layer deposition (ALD) reactor; depositing a first layer comprising a metal oxide or a nitride on a surface of the object by ALD; depositing a second layer comprising a metal oxide or a nitride on the first layer by ALD; and depositing a third layer comprising a metal oxide or a nitride on the second layer by ALD, thereby forming the protective coating on the object.
Opening claim text (preview).
The invention claimed is: 1. A method of coating a metallic object with a nearly invisible protective coating, comprising: placing the metallic object in an atomic layer deposition (ALD) reactor; depositing a first layer comprising a metal oxide or a nitride on a surface of the metallic object by ALD; depositing a second layer comprising a metal oxide or a nitride on the first layer by ALD; and depositing a third layer comprising a metal oxide or a nitride on the second layer by ALD, thereby forming the nearly invisible protective coating on the metallic object, wherein the nearly invisible protective coating has a Delta E 2000 of 5 or less. 2. The method of claim 1 , wherein depositing the first, second, and third layers each comprises repeatedly pulsing a precursor material and purging the reactor with an inert gas following each pulse. 3. The method of claim 2 , wherein depositing the first layer comprises repeatedly pulsing the precursor and purging with the inert gas until the first layer is about 1 to 100 nm thick; wherein depositing the second layer comprises repeatedly pulsing the precursor and purging with the inert gas until the second layer is about 1 to 100 nm thick; and wherein depositing the third layer comprises repeatedly pulsing the precursor and purging with the inert gas until the third layer is about 1 to 100 nm thick. 4. The method of claim 2 , wherein precursor material corresponds to a deposited material selected from the group consisting of Al 2 O 3 , FeO, HfO 2 , MgO, SiO 2 , SnO 2 , Ta, Ta 2 O 5 , TiN, TiO 2 , VO 2 , ZnO, and ZrO. 5. The method of claim 2 , wherein the precursor material is selected from the group consisting of trimethylaluminum, diethyl zinc, tetrakis-dimethyl-amido titanium, and 3-aminopropyltriethoxysilane. 6. The method of claim 2 , wherein depositing the first layer comprises repeatedly pulsing trimethylaluminum; wherein depositing the second layer comprises repeatedly pulsing tetrakis-dimethyl-amido titanium or 3-aminopropyltriethoxysilane; and wherein depositing the third layer comprises repeatedly pulsing diethyl zinc or trimethylaluminum. 7. The method of claim 6 , further comprising depositing a fourth layer on the third layer by ALD by repeatedly pulsing tetrakis-dimethyl-amido or trimethylaluminum. 8. The method of claim 6 , wherein depositing the first layer comprises repeatedly pulsing the trimethylaluminum until the first layer is about 20 to 50 nm thick; wherein depositing the second layer comprises repeatedly pulsing the tetrakis-dimethyl-amido titanium or 3-aminopropyltriethoxysilane until the second layer is about 20 to 50 nm thick; and wherein depositing the third layer comprises repeatedly pulsing the diethyl zinc or trimethylaluminum until the third layer is about 1 to 10 nm thick. 9. The method of claim 1 , further comprising depositing a gradient layer on the first layer by ALD prior to depositing the second layer, wherein depositing the gradient layer comprising pulsing a precursor used to form the first layer and a precursor used to form the second layer. 10. The method of claim 1 , wherein depositing at least one of the first, second, and third layers further comprise pulsing a precursor corresponding to a dopant selected from the group consisting of Ag, Au, Fe, Ir, Os, Pd, Pt, Rh, Ru, FeO, HfO 2 , MgO, SiO 2 , SnO 2 , Ta, Ta 2 O 5 , TiN, TiO 2 , VO 2 , ZnO, and ZrO. 11. The method of claim 1 , wherein the surface comprises sterling silver. 12. The method of claim 1 , wherein the nearly invisible protective coating has a Delta E 2000 of 4 or less. 13. The method of claim 1 , wherein the nearly invisible protective coating has a Delta E 2000 of 3 or less. 14. The method of claim 1 , wherein the nearly invisible protective coating has a Delta E 2000 of 2 or less. 15. The method of claim 1 , wherein the nearly invisible protective coating has a Delta E 2000 of 1. 16. The method of claim 1 , wherein the first layer comprises Al 2 O 3 . 17. The method of claim 16 , wherein the second layer comprises TiO 2 . 18. The method of claim 16 , wherein the third layer comprises ZnO.
of zinc, germanium, cadmium, indium, tin, thallium or bismuth · CPC title
of refractory metals or yttrium · CPC title
of aluminium, magnesium or beryllium · CPC title
characterized by the use of precursors specially adapted for ALD · CPC title
applied in non-semiconductor technology · CPC title
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