Transfer-printed photonics

Patent metadata

Field	Value
Publication number	US-10069029-B1
Application number	US-201514946309-A
Country	US
Kind code	B1
Filing date	Nov 19, 2015
Priority date	Nov 19, 2014
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

A device such as a photo sensor, an optical isolator, and an optical damper is formed via a first process. The device is transfer printed to a waveguide of a read/write head in a second process.

First claim

What is claimed is:

1. A method comprising:
forming a photo sensor via a first process;
transfer printing the photo sensor proximate to a waveguide of a heat-assisted magnetic recording read/write head in a second process, the photo sensor being vertically separated from the waveguide; and
aligning the photo sensor on the read/write head via a third process after the second process, the alignment resulting in a laser sub-wavelength precision in one of a longitudinal separation between the photo sensor and a laser and the vertical separation between the waveguide and the photo sensor.

2. The method of claim 1 , wherein the first process comprises a high temperature process that exceeds 220 degrees Celsius.

3. The method of claim 1 , wherein the photo sensor comprises a photodiode.

4. The method of claim 1 , wherein the photo sensor comprises a bolometer.

5. The method of claim 1 , wherein the first process comprises forming, on a donor substrate, a material stack comprising of at least two of a material layer, adhesion layer, protection layer, carrier layer, bonding layer, and chemical mechanical planarization stop material layer.

6. The method of claim 5 , wherein the first process further comprises forming islands of the material stack, one of the islands corresponding to the photo sensor, and wherein the second process comprises transfer printing the island to the read/write head.

7. The method of claim 1 , wherein the first and second processes are performed for a plurality of photo sensors, the second process comprising transfer printing the plurality of photo sensors to a wafer comprising a plurality of read/write heads.

8. The method of claim 1 , wherein the third process comprises an etching that defines the longitudinal separation between the photo sensor and the laser.

9. The method of claim 1 , wherein the third process comprises a planarization that defines the vertical separation between the photo sensor and the waveguide.

10. A method comprising:
forming an optical isolator or optical damper via a first process;
transfer printing the optical isolator to a waveguide of a heat-assisted magnetic recording read/write head in a second process, the optical isolator or optical damper being vertically separated from the waveguide; and
aligning the optical isolator or optical damper on the read/write head via a third process after the second process, the alignment resulting in a sub-wavelength precision in one of a longitudinal separation between the optical isolator or optical damper and the waveguide and the vertical separation between the waveguide and the optical isolator or optical damper.

11. The method of claim 10 , wherein the optical isolator or damper includes a non-linear mirror.

12. The method of claim 10 , wherein the optical isolator or damper comprises a Faraday rotator material.

13. The method of claim 10 , wherein the first process comprises forming, on a donor substrate, a material stack comprising of at least two of a material layer, adhesion layer, protection layer, carrier layer, bonding layer, and chemical mechanical planarization stop material layer.

14. The method of claim 10 , wherein the third process comprises an etching that defines a longitudinal separation between the optical isolator and a laser.

15. The method of claim 10 , wherein the third process comprises a planarization that defines a vertical separation between the optical isolator or optical damper and a laser.

16. A method comprising:
creating, on a donor substrate, a material stack having at least two of a material layer, an adhesion layer, a protection layer, a carrier layer, a bonding layer, and planarization stop material layer, the material layer comprising one of a photo sensor material, an optical isolator material, and an optical damper;
forming islands from the material stack, the islands being used to form a plurality of read/write head components;
transfer printing the islands to a wafer having a plurality of heat-assisted magnetic recording read/write heads, the islands being proximate to and vertically separated from waveguides of the read/write heads; and
using photolithography, shaping or aligning the read/write head components on the read/write head after the transfer printing, the shaping or aligning resulting in a sub-wavelength precision in one of a longitudinal separation between the photo sensor and the waveguide and the vertical separation between the waveguide and the photo sensor.

17. The method of claim 16 , wherein the components are integrated with waveguides of the read/write heads.

18. The method of claim 1 , wherein the photo sensor comprises a structure that is incompatible with growth on a substrate of the read/write head.

19. The method of claim 1 , wherein the waveguide of the read/write head is formed on an AlTiC substrate.

Assignees

• Seagate Technology Llc

Inventors

• Olson Scott Eugene
• Hipwell Jr Roger L

Classifications

• G02F1/093

  used as non-reciprocal devices, e.g. optical isolators, circulators (G02F1/0955 takes precedence) · CPC title

• G11B2005/0021

  Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title

• G11B5/1272

  Assembling or shaping of elements (G11B5/1278 takes precedence) · CPC title

• H01L31/02327

  Electricity · mapped topic

• H01L31/167

  Electricity · mapped topic