Method using epitaxial transfer to integrate HAMR photonic integrated circuit (PIC) into recording head wafer

Patent metadata

Field	Value
Publication number	US-9105286-B2
Application number	US-201313954620-A
Country	US
Kind code	B2
Filing date	Jul 30, 2013
Priority date	Jul 30, 2013
Publication date	Aug 11, 2015
Grant date	Aug 11, 2015

Abstract

Embodiments of the present invention generally relate to a method for forming a HAMR device having a photonic integrated circuit that includes an optical detector, an optical emitter, and an optical element distinct from the optical detector and the optical emitter, where the elements of the photonic integrated circuit are aligned with a near field transducer. The method includes forming one or more layers on a substrate, bonding the layers to a partially fabricated recording head, removing the substrate using epitaxial lift-off, and forming the optical elements on the partially fabricated recording head.

First claim

What is claimed is:

1. A heat assisted magnetic recording device, comprising:
an optical detector;
an optical emitter;
an optical element distinct from the optical detector and the optical emitter, wherein the optical detector, the optical emitter, and the optical element are aligned in order; and
a near field transducer, wherein the optical detector, the optical emitter and the optical element are aligned with the near field transducer.

2. The heat ass…

Assignees

• HGST Netherlands BV

Inventors

• Boone Jr Thomas Dudley

Classifications

• G11B5/314 Primary

  Physics · mapped topic

• G11B5/6088

  Physics · mapped topic

• G11B2005/0021

  Physics · mapped topic

• G11B5/3163 Primary

  Physics · mapped topic

• G11B5/84 Primary

  Physics · mapped topic