Semiconductor device in a level shifter with electrostatic discharge (ESD) protection circuit and semiconductor chip

US10068892B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10068892-B2
Application numberUS-201715626263-A
CountryUS
Kind codeB2
Filing dateJun 19, 2017
Priority dateMar 13, 2015
Publication dateSep 4, 2018
Grant dateSep 4, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure relates to a semiconductor chip having a level shifter with electro-static discharge (ESD) protection circuit and device applied to multiple power supply lines with high and low power input to protect the level shifter from the static ESD stress. More particularly, the present disclosure relates to a feature to protect a semiconductor device in a level shifter from the ESD stress by using ESD stress blocking region adjacent to a gate electrode of the semiconductor device. The ESD stress blocking region increases a gate resistance of the semiconductor device, which results in reducing the ESD stress applied to the semiconductor device.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor device in a level shifter, comprising: a gate insulating layer comprising a thin gate insulation layer and a thick gate insulation layer formed on a substrate; a gate electrode formed on the thin gate insulation layer and on the thick gate insulation layer; a non-silicide region, a silicide region, and a gate contact region formed on the gate electrode; wherein the gate contact region does not overlap the thick gate insulation layer. 2. A semiconductor device in a level shifter of claim 1 , further comprising: a drain region disposed adjacent to the thick gate insulation layer; a source region disposed adjacent to the thin gate insulation layer; and an extended drain junction region of a second conductivity type formed in a well region of a first conductivity type, wherein the extended drain junction region overlaps with the gate electrode and extends to a portion of the well region under the thin gate insulating layer, and the first conductivity type is an opposite type from the second conductivity type. 3. A semiconductor device in a level shifter of claim 1 , wherein the non-silicide region has a higher resistance than the silicide region. 4. A semiconductor device in a level shifter of claim 1 , wherein the non-silicide region comprises a silicide blocking layer. 5. A semiconductor device in a level shifter of claim 1 , wherein the gate electrode comprises a counter doped region. 6. A semiconductor device in a level shifter of claim 1 , wherein the non-silicide region of the gate electrode comprises a poly-silicon resistor. 7. A semiconductor device in a level shifter of claim 1 , wherein the gate contact region is in direct contact with the non-silicide region. 8. A semiconductor device in a level shifter, comprising: a gate insulation layer comprising a thin gate insulation layer and a thick gate insulation layer formed on a substrate; a silicided poly-silicon layer formed on the thin gate insulation layer and on the thick gate insulation layer; a non-silicided poly-silicon layer formed adjacent to the silicided poly-silicon layer; and a gate contact region formed adjacent to the non-silicided poly-silicon layer, wherein the silicided poly-silicon layer is electrically connected to the non-silicided poly-silicon layer. 9. A semiconductor device in a level shifter of claim 8 , wherein the silicided poly-silicon layer and the non-silicided poly-silicon layer are electrically connected to each other through a metal connector. 10. A semiconductor device in a level shifter of claim 8 , wherein the gate contact region is in direct contact with the non-silicided poly-silicon layer.

Assignees

Inventors

Classifications

  • the additional conductive layer comprising a silicide layer formed by the silicidation reaction between the layer of silicon with a metal layer which is not formed by metal implantation · CPC title

  • in field effect transistor circuits · CPC title

  • Interface arrangements · CPC title

  • G09G3/20Primary

    for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix {no fixed position being assigned to or needed to be assigned to the individual characters or partial characters} · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US10068892B2 cover?
The present disclosure relates to a semiconductor chip having a level shifter with electro-static discharge (ESD) protection circuit and device applied to multiple power supply lines with high and low power input to protect the level shifter from the static ESD stress. More particularly, the present disclosure relates to a feature to protect a semiconductor device in a level shifter from the ES…
Who is the assignee on this patent?
Magnachip Semiconductor Ltd
What technology area does this patent fall under?
Primary CPC classification G09G3/20. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 04 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).