Electronic component package having electronic component within a frame on a redistribution layer

Patent metadata

Field	Value
Publication number	US-10068824-B2
Application number	US-201615264684-A
Country	US
Kind code	B2
Filing date	Sep 14, 2016
Priority date	Mar 10, 2016
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.

First claim

What is claimed is:

1. An electronic component package, comprising:
a frame having a through hole, and comprising a first wiring layer disposed on a first surface of the frame;
an electronic component having an active surface on which electrode pads are disposed and an inactive surface opposing the active surface, the electronic component disposed in the through hole;
an encapsulant covering the inactive surface of the electronic component and a portion of the first wiring layer, and disposed between the frame and the electronic component within the through hole;
a metal layer disposed to abut a top surface of the encapsulant; and
a redistribution layer disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads,
wherein the frame further comprises:
a second wiring layer disposed on an inner wall of the frame, and
the metal layer directly contacts at least a portion of the first wiring layer and at least a portion of the second wiring layer, and
the metal layer and the first and second wiring layers contacting the metal layer serve as a ground of the electronic component package.

2. The electronic component package of claim 1 , wherein a surface of the first wiring layer is coplanar with a surface of the encapsulant.

3. The electronic component package of claim 1 , wherein the frame further comprises:
a through-wiring penetrating through the frame; and
a third wiring layer disposed on a second surface of the frame.

4. The electronic component package of claim 1 , further comprising:
a passivation layer disposed on the metal layer and having openings; and
a heat sink disposed on the passivation layer and connected to the metal layer through the openings.

5. The electronic component package of claim 4 , further comprising:
a second passivation layer disposed on the redistribution layer and having second openings; and
second connection terminals disposed in the second openings,
wherein at least one of the second connection terminals is disposed in a fan-out region.

6. The electronic component package of claim 1 , further comprising:
a passivation layer disposed on the metal layer and having openings; and
connection terminals disposed in the openings,
wherein at least one of the connection terminals is disposed in a fan-out region, and
a connection terminal connected to the metal layer is a connection terminal for connecting the electronic component to a ground.

7. An electronic component package, comprising:
a frame having a through hole, and comprising a first wiring layer disposed on a first surface of the frame;
an electronic component having an active surface on which electrode pads are disposed and an inactive surface opposing the active surface, the electronic component disposed in the through hole;
an encapsulant covering the inactive surface of the electronic component and a portion of the first wiring layer, and disposed between the frame and the electronic component within the through hole;
a metal layer disposed to abut a top surface of the encapsulant;
a redistribution layer disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads;
a passivation layer disposed on the metal layer and having openings; and
a memory chip package disposed on the passivation layer and connected to the metal layer through connection terminals disposed in the openings,
wherein the connection terminals connected to the metal layer are connection terminals for connecting a ground of the electronic component to a ground of the memory chip package.

8. The electronic component package of claim 7 , wherein the memory chip package comprises:
a substrate;
a memory chip disposed on the substrate; and
a wire electrically connecting the substrate and the memory chip to each other; and
a second encapsulant encapsulating the memory chip.

9. The electronic component package of claim 7 , further comprising:
a second passivation layer disposed on the redistribution layer and having second openings; and
second connection terminals disposed in the second openings,
wherein at least one of the second connection terminals is disposed in a fan-out region.

10. An electronic package, comprising:
a frame having a through hole, and comprising a first wiring layer disposed on a first surface of the frame;
an electronic component having an active surface on which electrode pads are disposed and an inactive surface opposing the active surface, the electronic component disposed in the through hole;
an encapsulant covering the inactive surface of the electronic component and a portion of the first wiring layer, and disposed between the frame and the electronic component within the through hole;
a metal layer disposed to abut a top surface of the encapsulant;
a redistribution layer disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads;
a passivation layer disposed on the metal layer and having openings;
connection terminals disposed in the openings;
a second passivation layer disposed on the redistribution layer;
a surface mounting component disposed on the second passivation layer and electrically connected to the electrode pads of the electronic component through the redistribution layer; and
a second encapsulant disposed on the second passivation layer and encapsulating the surface mounting component,
wherein at least one of the connection terminals is disposed in a fan-out region, and
a connection terminal connected to the metal layer is a connection terminal for connecting the electronic component to a ground.

11. An electronic component package, comprising:
a frame having a through hole, and comprising a first wiring layer disposed on a first surface of the frame;
an electronic component having a first surface and an opposing second surface, the electronic component being disposed in the through hole;
an encapsulant disposed over the first surface of the electronic component, a portion of the first wiring layer, and into the gap between sidewalls of the through hole and the electronic component;
a metal layer disposed to abut a top surface of the encapsulant to electrically connect with ground terminals; and
electrode pads electrically connected to a redistribution layer being disposed on the opposing second surface of the electronic component,
wherein the frame further comprises:
a second wiring layer disposed on an inner wall of the frame, and
the metal layer directly contacts at least a portion of the first wiring layer and at least a portion of the second wiring layer, and
the metal layer and the first and second wiring layers contacting the metal layer serve a ground of the electronic component package.

12. The electronic component package of claim 11 , wherein the first surface of the electronic component is an inactive surface and the opposing second surface the active surface.

13. The electronic component package of claim 12 , wherein the frame is used to structurally support the electronic component package.

14. The electronic component package of claim 13 , wherein an electronic device comprises the electronic component package.

Assignees

• Samsung Electro Mech

Inventors

• Kim Thomas A
• Han Kyu Bum
• Jung Chang Moo
• Kang Kyung In
• Lee Sang Kyu

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title