Method and apparatus for fabricating electrostatic capacitance-type acceleration sensor and electrostatic capacitance-type acceleration sensor

Patent metadata

Field	Value
Publication number	US-10067155-B2
Application number	US-201314388520-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Mar 29, 2012
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

In a method for fabricating an electrostatic capacitance-type acceleration sensor having a capacitor which electrostatic capacitance between a movable electrode and a fixed electrode changes according to the displacement of the movable electrode, the method includes: a step of forming a groove on at least one of the surface of an insulative substrate and the surface of a semiconductor substrate; a step of forming a hole in the semiconductor substrate so as to penetrate the semiconductor substrate at a position communicating with a passage formed by the groove; and a step of forming an electrode extraction hole in the insulative substrate so as to penetrate the insulative substrate, at a position communicating with the passage formed by the groove.

First claim

The invention claimed is:

1. A method for fabricating an electrostatic capacitance-type acceleration sensor having a capacitor for which electrostatic capacitance between a movable electrode and a fixed electrode changes according to displacement of the movable electrode, the method comprising steps of:
forming a groove on at least one of one surface of an insulative substrate on which the fixed electrode is formed as a film and one surface of a semiconductor substrate to which the insulative substrate is joined, the one surface of the insulative substrate being on an opposite side of the other surface of the insulative substrate on which the fixed electrode is formed as the film, and the insulative substrate being joined to the one surface of the semiconductor substrate;
forming a hole in the semiconductor substrate so as to penetrate from the one surface of the semiconductor substrate to the other surface of the semiconductor substrate, the hole communicating with a hollow passage formed by the groove; and
forming an electrode extraction hole, for electrically connecting the fixed electrode to the semiconductor substrate, in the insulative substrate so as to penetrate from the one surface of the insulative substrate to the other surface of the insulative substrate, the electrode extraction hole communicating with the hollow passage formed by the groove,
wherein the hole, the hollow passage formed by the groove, and the electrode extraction hole are configured to communicate damping gas to the movable electrode, and
wherein the hole is directly connected to the electrode extraction hole by the groove.

2. The method for fabricating an electrostatic capacitance-type acceleration sensor according to claim 1 , wherein
the electrostatic capacitance-type acceleration sensor includes the capacitor comprising a first capacitor for which electrostatic capacitance between the movable electrode and the first fixed electrode changes according to the displacement of the movable electrode, and a second capacitor for which electrostatic capacitance between the movable electrode and a second fixed electrode changes according to the displacement of the movable electrode in a contrary manner to the first capacitor, and wherein
the step of forming the groove forms the groove on at least one of the one surface of the insulative substrate on which one of the fixed electrode and the second fixed electrode is formed as the film and the one surface of the semiconductor substrate to which the insulative substrate is joined, the one surface of the insulative substrate being on the opposite side of the other surface of the insulative substrate on which the fixed electrode is formed as the film, and the insulative substrate being joined to the one surface of the semiconductor substrate.

3. The method for fabricating an electrostatic capacitance-type acceleration sensor according to claim 1 , wherein the step of forming the electrode extraction hole in the insulative substrate forms the electrode extraction hole in the insulative substrate, to which the semiconductor substrate is joined, wherein the electrode extraction hole extends from the other surface of the insulative substrate on which the fixed electrode is formed as the film.

4. An electrostatic capacitance-type acceleration sensor having a capacitor for which electrostatic capacitance between a movable electrode and a fixed electrode changes according to displacement acceleration of the movable electrode, comprising:
an insulative substrate on which the fixed electrode of the capacitor is formed as a film; and
a semiconductor substrate which is joined to one surface of the insulative substrate on an opposite side of the other surface of the insulative substrate on which the fixed electrode is formed as the film,
wherein a groove is formed on at least one of the one surface of the insulative substrate and the one surface of the semiconductor substrate to which the insulative substrate is joined, the one surface of the insulative substrate being on the opposite side of the other surface of the insulative substrate on which the fixed electrode is formed as the film,
wherein a first hole is formed in the semiconductor substrate so as to penetrate from the one surface of the semiconductor substrate to the other surface of the semiconductor substrate, the first hole communicating with a hollow passage formed by the groove,
wherein a second hole for electrode extraction, for electrically connecting the fixed electrode to the semiconductor substrate, is formed in the insulative substrate so as to penetrate from the one surface of the insulative substrate to the other surface of the insulative substrate, the second hole communicating with the hollow passage formed by the groove,
wherein the first hole, the hollow passage formed by the groove, and the second hole are configured to communicate damping gas to the movable electrode, and
wherein the first hole is directly connected to the second hole by the groove.

Assignees

• Akebono Brake Ind
• Japan Oil Gas & Metals Jogmec

Inventors

• Tsunoda Takahiro
• Kunimi Takashi
• Sekine Toru

Classifications

• G01P15/125 Primary

  by capacitive pick-up · CPC title

• G01P15/0802

  Details · CPC title

• B81B7/0038

  using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters · CPC title

• B81B2207/096

  through the substrate · CPC title

• B81B2201/0235

  Accelerometers · CPC title