Polishing features formed in components

Patent metadata

Field	Value
Publication number	US-10065289-B2
Application number	US-201514842962-A
Country	US
Kind code	B2
Filing date	Sep 2, 2015
Priority date	Sep 2, 2014
Publication date	Sep 4, 2018
Grant date	Sep 4, 2018

Abstract

A polishing system and method for polishing a channel formed within a component is disclosed. The polishing system may include a tooling element operable to be positioned within a recess formed partially through a component. The tooling element may include an outer surface having a geometry corresponding to a geometry of the recess formed in the component. The tooling element forms a channel between the recess of the component and the tooling element when positioned in the recess. The system may also include a first member in fluid communication with a first opening of the channel, and a second member in fluid communication with a second opening of the channel. The second opening may be in fluid communication with the first opening via the channel. Additionally, the first and second member may be configured to continuously vary a pressure within the channel to move an abrasive slurry within the channel.

First claim

What is claimed is:

1. A method for polishing a component for a portable electronic device, the component having a non-linear surface, comprising:
forming a channel having a first opening and a second opening between the non-linear surface of the component and a corresponding non-linear surface of a tooling element, wherein slurry is capable of moving within the channel; and
polishing the non-linear surface of the component by:
(i) pushing the slurry from the first opening towards the second opening by using a first flexible member, the first flexible member covering the first opening, and
(ii) concurrent with pushing the slurry from the first opening towards the second opening, pulling the slurry towards the second opening by using a second flexible member, the second flexible member covering the second opening, wherein the non-linear surface is polished by movement of an amount of the slurry that is in polishing contact therewith.

2. The method of claim 1 , wherein polishing the non-linear surface of the component further comprises:
(iii) pushing the slurry from the second opening towards the first opening by using the second flexible member, and
(iv) concurrent with pushing the slurry from the second opening towards the first opening, pulling the slurry towards the first opening by using the first flexible member.

3. The method of claim 2 , further comprising:
repeating (i)-(iv) until the non-linear surface of the component is polished according to a predetermined amount.

4. The method of claim 3 , wherein moving the slurry within the channel comprises:
continuously varying a pressure within the channel using at least one of the first flexible member or the second flexible member; and
repeatedly moving the slurry from:
the first opening to the second opening; and
the second opening to the first opening.

5. The method of claim 1 , wherein the first flexible member is coupled to an outer surface of the tooling element and a surface of the component, and the second flexible member is coupled to the outer surface of the tooling element and the surface of the component.

6. The method of claim 5 , wherein the component includes a recess that is formed partially through the component, and the recess includes a geometry that corresponds to the non-linear surface of the component and the corresponding non-linear surface of the tooling element.

7. The method of claim 5 , wherein a portion of the outer surface of the tooling element is substantially planar to a portion of the surface of the component.

Assignees

• Apple Inc

Inventors

• Chinnakaruppan Palaniappan
• Kamireddi Srikanth

Classifications

• B24B31/116

  using plastically deformable grinding compound, moved relatively to the workpiece under the influence of pressure · CPC title

• B24C1/08 Primary

  for polishing surfaces, e.g. {smoothing a surface} by making use of liquid-borne abrasives · CPC title

• B24C3/327

  by an axially-moving flow of abrasive particles without passing a blast gun, impeller or the like along the internal surface (polishing or abrading surfaces using plastically deformable grinding compound, moved relatively to the workpiece under the influence of pressure B24B31/116) · CPC title

• B24C1/083

  Deburring · CPC title

• B24B31/006

  for grinding the interior surfaces of hollow workpieces · CPC title