Hollow spring and method for manufacturing same

US9227300B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9227300-B2
Application numberUS-201113988624-A
CountryUS
Kind codeB2
Filing dateNov 24, 2011
Priority dateDec 3, 2010
Publication dateJan 5, 2016
Grant dateJan 5, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A straight-shaped hollow spring material is used in a blasting apparatus. The length of the spring material is set to be 1.5 m to 3.5 m, and the inner diameter of the spring material is set to be not more than 10 mmφ (not including 0). In inner surface abrasive blasting for the spring material, first and second blastings are performed. In the first blasting, abrasives are ejected to an opening portion of the spring material and are suctioned from a second opening portion thereof. In the second blasting, the abrasives are ejected to the second opening portion and are suctioned from the opening portion. The ejection pressure, the suction pressure, and the like are appropriately set, so that generation of grinding amount difference between the center portion and both end portions of the inner surface of the spring material can be inhibited.

First claim

Opening claim text (preview).

The invention claimed is: 1. A production method for a hollow spring, comprising: a preparing step in which a straight-shaped hollow spring material is prepared; and an abrasive blasting step in which abrasives are ejected to an inner surface of the spring material and are suctioned, and the inner surface of the spring material is thereby ground, wherein in the preparing step of the spring material, length of the spring material is set to be 1.5 m to 3.5 m, and an inner diameter of the spring material is set to be not more than 10 mm; in the abrasive blasting step, a first blasting and a second blasting are performed as the blasting in turn; in the first blasting, the abrasives are ejected from one end portion of the spring material and are suctioned at another end portion of the spring material; in the second blasting, the abrasives are ejected from the other end portion of the spring material and are suctioned at the one end portion of the spring material; and the first blasting and the second blasting are each performed at an ejection pressure of at least 0.5 MPa for at least 90 seconds. 2. The production method for the hollow spring according to claim 1 , wherein by the blasting, an inner diameter reduction amount of a center portion of the inner surface of the spring material is set to be 190 μm and an inner diameter reduction amount of both end portions of the spring material is set to be 200 μm. 3. The production method for the hollow spring according to claim 1 , wherein the spring material is formed into a coil shape after the abrasive blasting step for the spring material. 4. The hollow spring formed by the production method according to claim 1 . 5. The production method for the hollow spring according to claim 1 , wherein an inner surface of the spring member is ground at a depth of at least 50 μm. 6. The production method for the hollow spring according to claim 1 , wherein the abrasives have a particle size of at least #20. 7. The production method for the hollow spring according to claim 1 , wherein a depth of an inner surface defect of the hollow spring is not more than 20 μm. 8. The production method for the hollow spring according to claim 1 , wherein the abrasives have a particle size of at least #80. 9. The production method for the hollow spring according to claim 1 , wherein a depth of an inner surface defect of the hollow spring is not more than 5 μm. 10. The production method for the hollow spring according to claim 1 , wherein an aspect ratio of an inner surface defect of the hollow spring, which is a depth of a defect shape/a width of the defect shape, is 0.5 or less. 11. The production method for the hollow spring according to claim 1 , wherein an aspect ratio of an inner surface defect of the hollow spring, which is a depth of a defect shape/a width of the defect shape, is 0.3 or less. 12. The production method for the hollow spring according to claim 1 , wherein the abrasives are made from alumina.

Assignees

Inventors

Classifications

  • Springs (working with fluid F16F5/00, F16F9/00) · CPC title

  • B24C1/00Primary

    Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods · CPC title

  • by an axially-moving flow of abrasive particles without passing a blast gun, impeller or the like along the internal surface (polishing or abrading surfaces using plastically deformable grinding compound, moved relatively to the workpiece under the influence of pressure B24B31/116) · CPC title

  • B24C1/10Primary

    for compacting surfaces, e.g. shot-peening (for deforming sheet metal, tubes or profiles B21D31/06; as a metallurgical treatment C21D7/00, C22F1/00) · CPC title

  • with turns lying in cylindrical surfaces · CPC title

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What does patent US9227300B2 cover?
A straight-shaped hollow spring material is used in a blasting apparatus. The length of the spring material is set to be 1.5 m to 3.5 m, and the inner diameter of the spring material is set to be not more than 10 mmφ (not including 0). In inner surface abrasive blasting for the spring material, first and second blastings are performed. In the first blasting, abrasives are ejected to an opening …
Who is the assignee on this patent?
Yajima Takashi, Katsuyama Akira, Nhk Spring Co Ltd
What technology area does this patent fall under?
Primary CPC classification B24C1/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).