Molded range and proximity sensor with optical resin lens

Patent metadata

Field	Value
Publication number	US-10061057-B2
Application number	US-201514832971-A
Country	US
Kind code	B2
Filing date	Aug 21, 2015
Priority date	Aug 21, 2015
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

First claim

The invention claimed is:

1. A device, comprising:
a first substrate having a first plurality of contact pads on a first side of the first substrate;
a semiconductor die having a light sensor area on an upper surface of the semiconductor die and a second plurality of contact pads, the semiconductor die being electrically connected to the first plurality of contact pads and also mechanically secured to the first substrate;
a light emitting device adjacent to the upper surface of the semiconductor die; and
a first resin lens positioned above and in abutting contact with the light emitting device;
a second resin lens positioned above and in abutting contact with the light sensor area of the semiconductor die;
a molding compound that extends as a single contiguous member over the first resin lens, the second resin lens and space between the first and second resin lenses; and
a glass element over the first resin lens, the second resin lens and at least a portion of a top surface of the molding compound that is flush with the first resin lens and the second resin lens.

2. The device of claim 1 further including a cap that overlies the molding compound.

3. The device of claim 1 wherein the semiconductor die is positioned on the first side of the substrate, the light emitting device is positioned on the upper surface of the semiconductor die, and each of the contact pads of the light emitting device is in electrical communication with a respective one of the contact pads of the semiconductor die.

4. The device of claim 1 , further comprising: an adhesive material that secures a lower surface of the semiconductor die to the first side of the first substrate.

5. The device of claim 1 , further comprising: a wire coupled between the contact pads of the semiconductor die and one of the contact pads of the light emitting device.

6. The device of claim 1 , further comprising a recess portion in the molding compound between the first resin lens and the second resin lens and filled with an opaque material.

7. The device of claim 6 , wherein the opaque material includes at least one of a black glue material or another opaque adhesive material.

8. The device of claim 1 , wherein the first resin lens and the second resin lens are positioned below a transparent display layer of a mobile device.

Assignees

• St Microelectronics Pte Ltd
• St Microelectronics Res & Dev Ltd

Inventors

• Wong Wing Shenq
• Price Andy
• Christison Eric

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/65 Primary

  Shapes or dispositions of interconnections · CPC title

• H01L25/167

  Electricity · mapped topic