MEMS internal temperature sensor having thin film thermopile

Patent metadata

Field	Value
Publication number	US-10060803-B2
Application number	US-201415103366-A
Country	US
Kind code	B2
Filing date	Dec 12, 2014
Priority date	Dec 13, 2013
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

An internal temperature sensor includes substrates with one surface to be placed in contact with a measurement surface of an object to measure an internal temperature of the object, a heat flux sensor on another surface of the substrates, and a temperature sensor. The heat flux sensor is fabricated through a MEMS process and includes first and second temperature measurement parts, and a thin film including a thermopile to detect a temperature difference between the first and second temperature measurement parts. The thin film is supported by a thermally conductive member to form a space between the first temperature measurement part and the substrates and to extend parallel to the substrates. The thermally conductive member conducts heat traveling from the object through the substrates to the second temperature measurement part. The temperature sensor measures the temperature of a part of the substrates that is in contact with the thermally conductive member.

First claim

The invention claimed is:

1. An internal temperature sensor, comprising:
a substrate having one surface to be placed in contact with a surface of an object to measure an internal temperature of the object;
a heat flux sensor arranged on another surface of the substrate, the heat flux sensor being fabricated through a micro electro mechanical systems process,
the heat flux sensor including a first temperature measurement part, a second temperature measurement part, and a thin film including a thermopile configured to detect a temperature difference between the first temperature measurement part and the second temperature measurement part,
the thin film being supported by a thermally conductive member to form a space between the first temperature measurement part and the substrate and to extend parallel to the substrate, the thermally conductive member being configured to conduct heat traveling from the object through the substrate to the second temperature measurement part; and
a temperature sensor configured to measure a temperature of a part of the substrate that is placed in contact with the thermally conductive member or a temperature of the second temperature measurement part of the thin film.

2. The internal temperature sensor according to claim 1 , wherein
the thin film in the heat flux sensor comprises a heat radiation accelerating structure configured to accelerate heat radiation from the first temperature measurement part.

3. The internal temperature sensor according to claim 1 , wherein
the thin film in the heat flux sensor comprises an infrared reflective structure configured to reflect infrared rays traveling toward a surface of the thin film not facing the substrate to prevent the thin film from being heated by the infrared rays.

4. The internal temperature sensor according to claim 1 , further comprising:
a housing covering the heat flux sensor and the temperature sensor.

5. The internal temperature sensor according to claim 4 , wherein the housing includes an infrared absorber arranged on an inner surface thereof.

6. The internal temperature sensor according to claim 4 , wherein
the housing has an outer surface configured to reflect infrared rays and electromagnetic waves.

7. The internal temperature sensor according to claim 4 , wherein
the housing includes a side wall surrounding the heat flux sensor and the temperature sensor, a heat insulator arranged at an end face of the side wall at an opening of the side wall, and a top plate attached to the side wall via the heat insulator to cover the opening of the side wall.

8. The internal temperature sensor according to claim 7 , wherein the top plate is a heat sink or a radiator plate.

9. The internal temperature sensor according to claim 7 , further comprising:
a member configured to transfer heat from the first temperature measurement part of the thin film to the top plate.

10. The internal temperature sensor according to claim 1 , further comprising:
an amplifier configured to amplify an output from the heat flux sensor and an output from the temperature sensor.

11. The internal temperature sensor according to claim 10 , further comprising:
an arithmetic unit configured to calculate the internal temperature of the object based on the output from the heat flux sensor and the output from the temperature sensor amplified by the amplifier.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Nakagawa Shinya
• Shimizu Masao
• Hamaguchi Tsuyoshi

Classifications

• G01K17/20

  across a radiating surface, combined with ascertainment of the heat-transmission coefficient · CPC title

• B81B1/00

  Devices without movable or flexible elements, e.g. microcapillary devices · CPC title

• G01K17/00

  Measuring quantity of heat (measuring temperature by calorimetry G01K3/00 - G01K11/00; specially adapted for measuring thermal properties of materials, e.g. specific heat, heat of combustion G01N) · CPC title

• G01K7/00

  Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat (giving results other than momentary value of temperature G01K3/00) {; Power supply therefor, e.g. using thermoelectric elements} · CPC title

• G01K1/08

  Protective devices, e.g. casings · CPC title