Internal temperature measuring apparatus and sensor package

Patent metadata

Field	Value
Publication number	US-2018024010-A1
Application number	US-201615552619-A
Country	US
Kind code	A1
Filing date	Feb 25, 2016
Priority date	Mar 12, 2015
Publication date	Jan 25, 2018
Grant date	—

Abstract

An internal temperature measuring apparatus includes: a sensor package in which a MEMS chip and a temperature sensor are disposed in a bottomed tubular package, the MEMS chip including one or a plurality of thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package, the temperature sensor measuring a reference temperature used as temperature of a predetermined portion of the MEMS chip; and a printed circuit board configured to calculate the internal temperature of the measurement object based on output of the sensor package. An outer bottom face of the sensor package projects from a plate face of the printed circuit board through a through-hole made in the printed circuit board.

First claim

1 . An internal temperature measuring apparatus that measures an internal temperature of a measurement object, the internal temperature measuring apparatus comprising:
a sensor package in which a MEMS chip and a temperature sensor are disposed in a bottomed tubular package, the MEMS chip comprising one or a plurality of thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package, the temperature sensor measuring a reference temperature used as temperature of a predetermined portion of the MEMS chip; and a printed circuit board configured to calculate the internal temperature of the measurement object based on output of the sensor package, wherein an outer bottom face of the sensor package projects from a plate face of the printed circuit board through a through-hole made in the printed circuit board.

2 . The internal temperature measuring apparatus according to claim 1 , wherein the bottom of the bottomed tubular package comprises a non-heat transfer portion and a heat transfer portion made of a material having heat conductivity better than that of a constituent material of the non-heat transfer portion, and
at least a part of the MEMS chip is located on the heat transfer portion.

3 . The internal temperature measuring apparatus according to claim 2 , wherein the heat transfer portion is made of metal.

4 . The internal temperature measuring apparatus according to claim 1 , wherein the bottomed tubular package of the sensor package comprises a plurality of leads, in which surfaces oriented toward an identical direction at leading ends on an outside of a tubular wall of the bottomed tubular package are located on an identical plane, piercing the tubular wall, and
the sensor package is mounted on the printed circuit board using the surfaces at the leading ends of the plurality of leads.

5 . The internal temperature measuring apparatus according to claim 1 , wherein the outer bottom face of the sensor package has a curved shape in which a central portion projects.

6 . The internal temperature measuring apparatus according to claim 1 , wherein the bottomed tubular package is formed by mold forming.

7 . A sensor package according to claim 1 , wherein an inner surface of the tubular wall of the bottomed tubular package is coated with a black material.

8 . A sensor package that obtains data used to calculate an internal temperature of a measurement object, the sensor package comprising:
a bottomed tubular package; a MEMS chip disposed in the bottomed tubular package, the MEMS chip comprising one or a plurality of thermopiles each of which measures a heat flux passing through a region of a bottom of the bottomed tubular package; and a temperature sensor disposed in the bottomed tubular package, the temperature sensor measuring a reference temperature used as temperature of a predetermined portion of the MEMS chip, wherein the bottomed tubular package comprises a plurality of leads, in which surfaces oriented toward an identical direction at leading ends on an outside of a tubular wall of the bottomed tubular package are located on an identical plane, piercing the tubular wall.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Nakagawa Shinya
• Shimizu Masao

Classifications

• A61B5/683

  Means for maintaining contact with the body (A61B5/6802 takes precedence) · CPC title

• G01K7/427

  Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation · CPC title

• G01K1/18 Primary

  for reducing thermal inertia · CPC title

• B81B2201/0278

  Temperature sensors · CPC title

• G01K7/42

  Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature · CPC title