Heat pump type heating apparatus

US10060654B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10060654-B2
Application numberUS-201515519396-A
CountryUS
Kind codeB2
Filing dateJul 2, 2015
Priority dateOct 16, 2014
Publication dateAug 28, 2018
Grant dateAug 28, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Heat pump type heating apparatus capable of performing a continuous dual-stage operation without stopping a high stage side compressor even when a return temperature of a heating medium reaches a prescribed high temperature and, thereby, improving a sense of being insufficiently warmed due to stoppage of the high stage side compressor or a sense of being insufficiently warmed due to execution of frequent defrosting operations. The heat pump type heating apparatus includes an internal heat exchanger (a second internal heat exchanger) that performs heat exchange between a low-temperature refrigerant on a low-pressure side of a low stage side refrigeration circuit and a high-temperature refrigerant on a high-pressure side of a high stage side refrigerant circuit, a bypass pipe bypassing the internal heat exchanger, and flow path control means that controls a refrigerant flow to each of the internal heat exchanger and the bypass pipe.

First claim

Opening claim text (preview).

The invention claimed is: 1. A heat pump type heating apparatus characterized by comprising: a dual-stage heat pump unit including a low stage side refrigeration circuit formed by annularly connecting, in order, a low stage side compressor, a low stage side heating medium-refrigerant heat exchanger, a cascade heat exchanger, low stage side decompressing means, and an evaporator, so as to circulate a refrigerant therethrough, and a high stage side refrigeration circuit formed by annularly connecting, in order, a high stage side compressor, a high stage side heating medium-refrigerant heat exchanger, high stage side decompressing means, and the cascade heat exchanger, so as to circulate a refrigerant therethrough; and a heating unit having a heating medium circuit including a circulation pump, a heating terminal, the low stage side heating medium-refrigerant heat exchanger, and the high stage side heating medium-refrigerant heat exchanger, so as to circulate a heating medium therethrough, wherein the heat pump type heating apparatus further includes an internal heat exchanger that performs heat exchange between a low-temperature refrigerant on a low-pressure side of the low stage side refrigeration circuit and a high-temperature refrigerant on a high-pressure side of the high stage side refrigeration circuit, a bypass pipe bypassing the internal heat exchanger, and flow path control means that controls a refrigerant flow to each of the internal heat exchanger and the bypass pipe. 2. The heat pump type heating apparatus according to claim 1 , wherein the bypass pipe is provided between a refrigerant flowout side of the high stage side heating medium-refrigerant heat exchanger and a refrigerant inflow side of the high stage side decompressing means in the high stage side refrigeration circuit, or between a refrigerant flowout side of the evaporator and a refrigerant suction side of the low stage side compressor in the low stage side refrigeration circuit. 3. The heat pump type heating apparatus according to claim 1 , wherein when, in a dual-stage operation in which the low stage side compressor and the high stage side compressor are operated, a return temperature of a heating medium flowed out of the heating terminal is equal to or higher than a prescribed high-temperature threshold, the flow path control means performs high stage side refrigerant cooling control of causing a refrigerant on the low-pressure side of the low stage side refrigeration circuit or a refrigerant on the high-pressure side of the high stage side refrigeration circuit to flow into the internal heat exchanger side. 4. The heat pump type heating apparatus according to claim 3 , wherein the flow path control means performs the high stage side refrigerant cooling control when the outside air temperature is equal to or lower than a prescribed high stage side cooling operation upper limit temperature. 5. The heat pump type heating apparatus according to claim 3 , wherein the flow path control means performs the high stage side refrigerant cooling control when the outside air temperature is within a prescribed frequent defrosting operation temperature range.

Assignees

Inventors

Classifications

  • F25B7/00Primary

    Compression machines, plants or systems, with cascade operation, i.e. with two or more circuits, the heat from the condenser of one circuit being absorbed by the evaporator of the next circuit (F25B9/00 takes precedence) · CPC title

  • of the refrigerant at the inlet of the evaporator · CPC title

  • arranged in series · CPC title

  • the refrigerant being carbon dioxide · CPC title

  • of the fluid heated by the condenser · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10060654B2 cover?
Heat pump type heating apparatus capable of performing a continuous dual-stage operation without stopping a high stage side compressor even when a return temperature of a heating medium reaches a prescribed high temperature and, thereby, improving a sense of being insufficiently warmed due to stoppage of the high stage side compressor or a sense of being insufficiently warmed due to execution o…
Who is the assignee on this patent?
Sanden Holdings Corp
What technology area does this patent fall under?
Primary CPC classification F25B7/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Aug 28 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).