System and method for forming a sealed chamber

Patent metadata

Field	Value
Publication number	US-10056274-B2
Application number	US-201615040904-A
Country	US
Kind code	B2
Filing date	Feb 10, 2016
Priority date	Aug 12, 2013
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

According to an embodiment of the invention, there is provided a system, comprising: a first chamber; a second chamber; a chuck; a movement system; wherein the first chamber comprises: a first element that has a first surface; a first chamber housing that comprises a second surface; wherein the first surface and the second surface come into proximity with each other at a first interface; a supporting element for supporting the chuck when the chuck is positioned within the first chamber; and a first dynamic seal formed at the first interface and is arranged to seal the first chamber from the movement system; wherein the second chamber comprises: a second chamber housing; a movement system that is arranged to introduce movement between (a) the first chamber housing and (b) the first element and the chuck; and a movement control element for mechanically coupling the first element to the movement system.

First claim

What is claimed is:

1. A system comprising:
a chuck;
a substrate processing chamber configured to perform a substrate processing operation on a substrate supported by the chuck, the substrate processing chamber comprising a first element that has a first surface, a first chamber housing that includes a second surface spaced apart from the first surface at a first interface, and a supporting element for supporting the chuck within the first chamber;
a second chamber comprising a second chamber housing;
a movement system positioned within the second chamber housing and operatively coupled to move the chuck and the first element in relation to the first chamber housing; and
a movement control element for mechanically coupling the first element to the movement system;
wherein a first dynamic seal is formed at the first interface and is arranged to seal the substrate processing chamber from the movement system; and
wherein the substrate processing chamber is an inspection chamber and further comprises an inspection column and wherein the chuck is positioned to support a substrate at a position spaced apart from the inspection column.

2. The system according to claim 1 further comprising pressure control elements for maintaining the substrate processing chamber at a lower pressure level than the second chamber.

3. The system according to claim 1 , wherein the substrate processing chamber and the second chamber are maintained at substantially a same pressure level and wherein the system comprises filtering elements arranged to prevent contaminants generated within the second chamber to enter the substrate processing chamber.

4. The system according to claim 1 wherein the first element is a plate.

5. The system according to claim 1 wherein the first element defines an aperture and wherein the supporting element and the movement control element are connected to each other to form a support and movement control module that passes through the aperture.

6. The system according to claim 5 comprising a second dynamic seal formed at a second interface between the aperture and the support and movement control module.

7. The system according to claim 5 wherein the aperture is located at a center of the first element.

8. The system according to claim 1 wherein the supporting element and the movement control element are connected to each other to form a support and movement control module; and wherein the support and control module further comprises a horizontal movement stage.

9. The system according to claim 1 further comprising a load lock mechanism for allowing the insertion of a substrate to the substrate processing chamber and a removal of the substrate from the substrate processing chamber.

10. The system according to claim 1 wherein the first interface has an annular shape.

11. The system according to claim 10 wherein the dynamic seal includes an air bearing annular groove and an isolating land adjacent to the annular groove.

12. The system according to claim 11 further comprising a gas pump operatively coupled to provide compressed gas to the air bearing annular groove.

13. The system according to claim 10 wherein the dynamic seal comprises an annular air inlet; first, second and third annular grooves; a first landing between the air inlet and the first annular groove, a second landing between the first and second annular grooves and a third landing between second and third annular grooves.

Assignees

• Applied Materials Israel Ltd

Inventors

• Rice Michael R
• Reuter Paul
• Weaver William (Ty)
• Morey Travis
• Schlimoff Natan
• Krivts (Krayvitz) Igor
• Avneri Israel
• Uziel Yoram
• Admoni Erez

Classifications

• H10P72/7604

  the wafers being placed on a susceptor, stage or support · CPC title

• H10P72/3308

  Vertical transfer of a single workpiece · CPC title

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title

• H10P72/0441 Primary

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H01L21/67748

  Electricity · mapped topic