Method for measuring the mass thickness of a target sample for electron microscopy

Patent metadata

Field	Value
Publication number	US-10054557-B2
Application number	US-201515329902-A
Country	US
Kind code	B2
Filing date	Jul 29, 2015
Priority date	Jul 29, 2014
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

A method is provided of measuring the mass thickness of a target sample for use in electron microscopy. Reference data are obtained which is representative of the X-rays ( 28 ) generated within a reference sample ( 12 ) when a particle beam ( 7 ) is caused to impinge upon a region ( 14 ) of the reference sample ( 12 ). The region ( 14 ) is of a predetermined thickness of less than 300 nm and has a predetermined composition. The particle beam ( 7 ) is caused to impinge upon a region ( 18 ) of the target sample ( 16 ). The resulting X-rays ( 29 ) generated within the target sample ( 16 ) are monitored ( 27 ) so as to produce monitored data. Output data are then calculated based upon the monitored data and the reference data, the output data including the mass thickness of the region ( 18 ) of the target sample ( 16 ).

First claim

The invention claimed is:

1. A method of measuring the mass thickness of a target sample for use in electron microscopy, comprising:
a. obtaining reference data from an electron beam instrument representative of the X-rays generated within a reference sample when an electron beam having a first set of beam conditions comprising a first beam current is caused to impinge upon a region of the reference sample, wherein in the region the reference sample has a predetermined thickness between its external surfaces of less than 300 nm and a predetermined mass thickness for a single element and wherein the region of the reference sample has a uniform thickness and forms part of a continuous, unsupported thin film;
b. causing an electron beam having a second set of beam conditions comprising a second beam current, in the same electron beam instrument, to impinge upon a region of the target sample, wherein the first beam current is identical to the second beam current;
c. monitoring the resulting X-rays generated within the target sample so as to produce monitored data; and
d. calculating, independently of any beam current measurement, output data including the mass thickness of the region of the target sample, based upon the monitored data, the reference data, and the identical first and second beam currents.

2. A method according to claim 1 wherein at step (a) the reference data is obtained by:
i. causing the electron beam to impinge upon the region of the reference sample; and
ii. monitoring the resulting X-rays generated within the reference sample so as to produce the reference data.

3. A method according to claim 1 wherein the region of the reference sample forms part of a larger portion of the reference sample, the larger portion having uniform thickness and composition.

4. A method according to claim 3 wherein the variation in thickness of the reference sample within the portion is less than 5%.

5. A method according to claim 1 wherein the thickness of the region of the reference sample has been predetermined using X-ray data obtained by way of a scanning electron microscope or electron probe microanalysis.

6. A method according to claim 1 wherein the thickness of the reference sample is of the same order of magnitude as the thickness of the target sample.

7. A method according to claim 1 , wherein the thickness of the reference sample is sufficiently similar to the thickness of the target sample such that the intensity of X-rays generated within each of the target and reference samples is within the dynamic range of the electron beam instrument.

8. A method according to claim 1 wherein the acquisition of each of the reference and monitored data is performed using the electron beam instrument having predetermined efficiency, and step (d) is performed in accordance with the predetermined efficiency.

9. A method according to claim 1 wherein the thickness of the region of the target sample is less than 300 nm.

10. A method according to claim 1 wherein the first set of beam conditions is identical to the second set of beam conditions.

11. A method according to claim 1 wherein the calculated mass thickness is equal to the product of the density and the thickness of the region of the target sample in the direction of the electron beam.

12. A method according to claim 1 wherein the calculation at step (d) includes calculating the absorption factor for one or more of the elements present in the target sample.

13. A method according to claim 1 wherein the calculation at step (d) includes generating simulated data representing X-rays generated within a simulated sample having a known relationship with the reference sample, calculating system conditions based upon the reference data and simulated data, and calculating output data including the mass thickness of the target sample, based upon the monitored data and the calculated system conditions.

14. A method according to claim 1 wherein the output data further includes the mass fraction of one or more of the elements present in the target sample.

15. A method according to claim 1 wherein each length of time for which the X-rays are monitored is known, and step (d) is performed in accordance with each known length of time.

16. A method according to claim 1 wherein the electron beam is an electron beam with energy greater than 40 keV.

17. A method according to claim 1 wherein the region of the target sample comprises a precipitate embedded in or supported on thin matrix material, and the output data at step (d) includes the mass thickness and composition of the precipitate.

Assignees

• Oxford Instruments Nanotechnology Tools Ltd

Inventors

• Statham Peter

Classifications

• H01J2237/24578

  Spatial variables, e.g. position, distance · CPC title

• G01N2223/633

  thickness, density, surface weight (unit area) · CPC title

• G01N23/2252 Primary

  Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA] · CPC title

• H01J37/261

  Details · CPC title

• G01N2223/304

  electric circuits, signal processing · CPC title