Plating cup with contoured cup bottom

Patent metadata

Field	Value
Publication number	US-10053792-B2
Application number	US-201614990573-A
Country	US
Kind code	B2
Filing date	Jan 7, 2016
Priority date	Sep 12, 2011
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

Disclosed herein are cups for engaging wafers during electroplating in clamshell assemblies and supplying electrical current to the wafers during electroplating. The cup can comprise an elastomeric seal disposed on the cup and configured to engage the wafer during electroplating, where upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, and where the elastomeric seal and the cup are annular in shape, and comprise one or more contact elements for supplying electrical current to the wafer during electroplating, the one or more contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal. A notch area of the cup can have a protrusion or an insulated portion on a portion of a bottom surface of the cup where the notch area is aligned with a notch in the wafer.

First claim

We claim:

1. A cup for engaging a wafer during electroplating in a clamshell assembly and supplying electrical current to the wafer during electroplating, the cup comprising:
an elastomeric seal disposed on the cup and configured to engage the wafer at an inner edge of the elastomeric seal during electroplating, wherein upon engagement the elastomeric seal substantially excludes plating solution from a peripheral region of the wafer, wherein the elastomeric seal and the cup are annular in shape;
a plurality of contact elements for supplying electrical current to the wafer during electroplating, each of the contact elements attached to and extending inwardly towards a center of the cup from a metal strip disposed over the elastomeric seal; and
wherein each of the contact elements in a notch area of the cup is longer than each of the contact elements in a non-notch area of the cup by an amount so that a distance between a terminal end of the contact element and an inner edge of the elastomeric seal in the notch area is at least substantially the same as a distance between a terminal end of the contact element and an inner edge of the elastomeric seal in the non-notch area, wherein the notch area corresponds to an area of the cup in which the distance from the center of the wafer to the edge of the elastomeric seal is less than in non-notch areas of the cup.

2. The cup of claim 1 , further comprising a protrusion attached to and extending from a portion of a bottom surface of the cup below the inner edge of the elastomeric seal, wherein the portion of the bottom surface of the cup is an angular portion aligned with a notch in the wafer during electroplating, the protrusion being positioned to reduce electrical current drawn from the peripheral region of the wafer during electroplating.

3. The cup of claim 1 , further comprising an insulated layer coated on a portion of a bottom surface of the cup that spans a width of the portion of the bottom surface of the cup and is below the elastomeric seal, wherein the insulated layer includes an electrically insulating material and the portion of the bottom surface of the cup includes an electrically conductive material, wherein the portion of the bottom surface of the cup is an angular portion aligned with a notch in the wafer during electroplating, the insulated layer configured to reduce electrical current drawn from the peripheral region of the wafer during electroplating.

4. The cup of claim 1 , wherein the elastomeric seal has a diameter that is configured to engage the peripheral region of the wafer.

5. The cup of claim 1 , wherein the current density distribution around the perimeter of the wafer is substantially uniform.

6. The cup of claim 1 , wherein each of the contact elements in the notch area is longer than each of the contact elements in the non-notch area of the cup by an amount so that an electric potential at an interface with the plating solution in the notch area is substantially the same as an electric potential at the interface with the plating solution in the non-notch area.

Assignees

• Novellus Systems Inc

Inventors

• He Zhian
• Feng Jingbin
• Ghongadi Shantinath
• Wilmot Frederick D

Classifications

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D17/06 Primary

  Suspending or supporting devices for articles to be coated · CPC title

• C25D17/007

  Current directing devices · CPC title

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title

• C25D17/005

  Contacting devices · CPC title