Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Patent metadata

Field	Value
Publication number	US-10052741-B2
Application number	US-201615226402-A
Country	US
Kind code	B2
Filing date	Aug 2, 2016
Priority date	Mar 8, 2016
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

In one embodiment, a semiconductor manufacturing apparatus includes a polishing table configured to hold a polishing pad for polishing a substrate, and to rotate the polishing pad. The apparatus further includes a dressing module configured to hold a dresser for dressing the polishing pad, and to dress a surface of the polishing pad by sweeping the polishing pad with the dresser while rotating the dresser. The apparatus further includes a controller configured to control a number of revolutions of the polishing table based on a position of the dresser to the polishing table, while the polishing pad is dressed.

First claim

The invention claimed is:

1. A semiconductor manufacturing apparatus comprising:
a polishing table configured to hold a polishing pad for polishing a substrate, and to rotate the polishing pad;
a dressing module configured to hold a dresser for dressing the polishing pad, and to dress a surface of the polishing pad by sweeping the polishing pad with the dresser while rotating the dresser; and
a controller configured to control a number of revolutions of the polishing table based on a position of the dresser to the polishing table, while the polishing pad is dressed,
wherein the controller controls the number of revolutions of the polishing table such that a relative linear speed between the polishing table and the dresser on a rotational axis of the dresser is maintained constant even if the position of the dresser to the polishing table is changed.

2. A semiconductor manufacturing apparatus comprising:
a polishing table configured to hold a polishing pad for polishing a substrate, and to rotate the polishing pad;
a dressing module configured to hold a dresser for dressing the polishing pad, and to dress a surface of the polishing pad by sweeping the polishing pad with the dresser while rotating the dresser; and
a controller configured to control a number of revolutions of the polishing table based on a position of the dresser to the polishing table, while the polishing pad is dressed,
wherein the controller changes the number of revolutions of the polishing table and maintains a number of revolutions of the dresser constant, according to the position of the dresser to the polishing table.

3. A semiconductor manufacturing apparatus comprising:
a polishing table configured to hold a polishing pad for polishing a substrate, and to rotate the polishing pad;
a dressing module configured to hold a dresser for dressing the polishing pad, and to dress a surface of the polishing pad by sweeping the polishing pad with the dresser while rotating the dresser; and
a controller configured to control a number of revolutions of the polishing table based on a position of the dresser to the polishing table, while the polishing pad is dressed,
wherein the controller controls, based on the position of the dresser to the polishing table, the number of revolutions of the polishing table and a number of revolutions of the dresser such that the number of revolutions of the dresser becomes 75 to 125% of the number of revolutions of the polishing table.

4. The apparatus of claim 3 , wherein the controller detects a distance between a rotational axis of the polishing table and a rotational axis of the dresser, and controls the number of revolutions of the polishing table and the number of revolutions of the dresser based on the distance between the rotational axes.

5. The apparatus of claim 4 , wherein the controller reduces the number of revolutions of the polishing table with an increase of the distance between the rotational axes.

6. A method of manufacturing a semiconductor device, comprising:
holding a polishing pad for polishing a substrate by a polishing table, and rotating the polishing pad;
holding a dresser for dressing the polishing pad by a dressing module, and dressing a surface of the polishing pad by sweeping the polishing pad with the dresser while rotating the dresser; and
controlling a number of revolutions of the polishing table by a controller based on a position of the dresser to the polishing table, while the polishing pad is dressed,
wherein the controller controls the number of revolutions of the polishing table such that a relative linear speed between the polishing table and the dresser on a rotational axis of the dresser is maintained constant even if the position of the dresser to the polishing table is changed.

7. A method of manufacturing a semiconductor device, comprising:
holding a polishing pad for polishing a substrate by a polishing table, and rotating the polishing pad;
holding a dresser for dressing the polishing pad by a dressing module, and dressing a surface of the polishing pad by sweeping the polishing pad with the dresser while rotating the dresser; and
controlling a number of revolutions of the polishing table by a controller based on a position of the dresser to the polishing table, while the polishing pad is dressed,
wherein the controller changes the number of revolutions of the polishing table and maintains a number of revolutions of the dresser constant, according to the position of the dresser to the polishing table.

8. A method of manufacturing a semiconductor device, comprising:
holding a polishing pad for polishing a substrate by a polishing table, and rotating the polishing pad;
holding a dresser for dressing the polishing pad by a dressing module, and dressing a surface of the polishing pad by sweeping the polishing pad with the dresser while rotating the dresser; and
controlling a number of revolutions of the polishing table by a controller based on a position of the dresser to the polishing table, while the polishing pad is dressed,
wherein the controller controls, based on the position of the dresser to the polishing table the number of revolutions of the polishing table and a number of revolutions of the dresser such that the number of revolutions of the dresser becomes 75 to 125% of the number of revolutions of the polishing table.

9. The method of claim 8 , wherein the controller detects a distance between a rotational axis of the polishing table and a rotational axis of the dresser, and controls the number of revolutions of the polishing table and the number of revolutions of the dresser based on the distance between the rotational axes.

10. The method of claim 9 , wherein the controller reduces the number of revolutions of the polishing table with an increase of the distance between the rotational axes.

Assignees

• Toshiba Memory Corp

Inventors

• Watanabe Takashi
• Doi Shunsuke

Classifications

• H10P52/402

  of semiconductor materials · CPC title

• B24B37/20

  Lapping pads for working plane surfaces · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• H01L21/30625

  Electricity · mapped topic